Multi-layer electromagnetic coupler arrangement

Patent metadata

Field	Value
Publication number	US-11329697-B2
Application number	US-201515756287-A
Country	US
Kind code	B2
Filing date	Nov 27, 2015
Priority date	Nov 27, 2015
Publication date	May 10, 2022
Grant date	May 10, 2022

Abstract

The present invention broadly relates to a multi-layer electromagnetic coupler arrangement, for encoding an RFID tag, suitable for being used in a printing device. The coupler arrangement employs a differential transmission line loop, as a coupling element arranged on a top surface layer of the multi-layer arrangement, which is arranged close to a metallic ground plane layer for shielding on the side opposite the top surface. Coupling is achieved by inductive coupling in the reactive near field and based on the fact that each RFID tag comprises a current loop, itself. The differential property of the transmission line loop is achieved by feeding the terminals of the loop with signal parts having a phase shift of 180° with respect to each other. The feeding components are arranged on the opposite side of the ground plane with respect to the top surface layer comprising the current loop. It is possible to arrange plural differential transmission line loops on the top surface layer, in form of a one-or two-dimensional array.

First claim

The invention claimed is:

1. A multi-layer electromagnetic coupler arrangement for coupling electromagnetic power to an electric current loop of an RFID tag of arbitrary geometric shape, by means of reactive near field coupling, the electromagnetic coupler arrangement comprising:
a top surface layer forming a top surface of the electromagnetic coupler arrangement to be arranged closest to an RFID tag to which the electromagnetic power is to be coupled, the top surface layer comprising a transmission line loop for achieving the electromagnetic coupling by inductive coupling with a current loop of the RFID tag, the transmission line loop being a continuous transmission line of finite length formed into a loop so that two terminals thereof approach each other;
a metallic ground plane layer; and
a feeding layer including a balun element for feeding the two terminals so as to form a differential input of said transmission line loop with current signals obtained by splitting an input signal into two parts equal in amplitude and shifted by 180° in phase with respect to each other, thereby forming a differential transmission line loop out of said transmission line loop, the balun further including inherent impedance transformation means for matching the impedance of an external feeding system interface with the differential input impedance of the transmission line loop.

2. The multi-layer electromagnetic coupler arrangement according to claim 1 , wherein said top surface layer and said metallic ground plane layer are realized in microstrip technology.

3. The multi-layer electromagnetic coupler arrangement according to claim 1 , wherein said feeding layer is a microstrip layer.

4. The multi-layer electromagnetic coupler arrangement according to claim 1 , wherein said feeding layer is a stripline layer.

5. The multi-layer electromagnetic coupler arrangement according to claim 1 , comprising a plurality of transmission line loops arranged in a one-or two-dimensional array on said top surface layer.

6. The multi-layer electromagnetic coupler arrangement according to claim 5 , wherein there is provided a separate balun for each of said plural transmission line loops, in said feeding layer.

7. The multi-layer electromagnetic coupler arrangement according to claim 5 , wherein plural of said transmission line loops are fed through a single balun, in said feeding layer.

8. The multi-layer electromagnetic coupler arrangement according to claim 5 , wherein there is formed a constant phase magnetic field along said top surface layer.

9. The multi-layer electromagnetic coupler arrangement according to claim 8 , wherein said array being a one-dimensional array and said constant phase magnetic field is achieved by means of phase compensation, by including transmission line sections having an electrical length of λ/2 between each two of said transmission line loops, respectively, wherein λ is the guided wavelength of the transmission line.

10. The multi-layer electromagnetic coupler arrangement according to claim 8 , wherein said one-or two-dimensional array is a two-dimensional array and phase compensation between the columns of said array is achieved by means of providing a network of lumped or distributed components in accordance with selected electrical lengths of transmission line segments between said transmission line loops.

11. The multi-layer electromagnetic coupler arrangement according to claim 1 , wherein said transmission line loop has a super elliptic shape geometry in accordance with the parametric representation:

x
=

a
⁢



cos
⁢

⁢
θ



2
m

⁢

sgn
⁡

(

cos
⁢

⁢
θ

)

y
=

b
⁢



cos
⁢

⁢
θ



2
m

⁢

sgn
⁡

(

sin
⁢

⁢
θ

)

a
,

b
>
0

m
,

n
≥
2

θ
∈

[

0
,

2
⁢
π

]

,

wherein x and y are Cartesian co-ordinates.

12. The multi-layer electromagnetic coupler arrangement according to claim 1 , wherein the input signal is a standard guided wave input signal provided by a 50Ω coaxial cable system.

13. The multi-layer electromagnetic coupler arrangement according to claim 1 , further comprising two dielectric layers arranged between said top surface layer, said ground plane layer, and said feeding layer, respectively, wherein the feeding layer and the top surface layer are connected through vias.

14. The multi-layer electromagnetic coupler arrangement according to claim 1 , adapted to encode said RFID tag by coupling electromagnetic power thereto.

15. The multi-layer electromagnetic coupler arrangement according to claim 14 suitable for being employed in a printer wherein RFID tags to be encoded are arranged on a medium guided in the printer along a media path,
wherein the shape of the multi-layer electromagnetic coupler arrangement can be flexibly adapted so as to achieve a constant distance between the top surface and the media path of the printer at all positions of the top surface.

16. An RFID

Assignees

• Sato Holdings Kk

Inventors

• Frank Markus
• Hedberg Mats

Classifications

• H04B5/45

  Transponders · CPC title

• H04B5/24

  Inductive coupling · CPC title

• G06K7/10356

  using a plurality of antennas, e.g. configurations including means to resolve interference between the plurality of antennas · CPC title

• H02J50/10

  using inductive coupling · CPC title

• G06K7/10336

  the antenna being of the near field type, inductive coil · CPC title