Electronic component mounting orientation checking system and electronic component mounting orientation checking method

Patent metadata

Field	Value
Publication number	US-11328405-B2
Application number	US-201716767304-A
Country	US
Kind code	B2
Filing date	Dec 4, 2017
Priority date	Dec 4, 2017
Publication date	May 10, 2022
Grant date	May 10, 2022

Abstract

A representation of the electronic component to be mounted according to a production program is displayed so as to be superimposed on the image of the mounting area on the display device, and the production program is edited so that a mounting orientation of the electronic component matches an orientation of the pad pattern, in a case where the mounting orientation of the electronic component designated in the production program does not match the orientation of the pad pattern in the mounting area when an operator looks at the representation of the electronic component displayed so as to be superimposed on the image of the mounting area on the display device.

First claim

The invention claimed is:

1. An electronic component mounting orientation checking system for checking a mounting orientation of an electronic component to be mounted on a circuit board according to a production program before starting a production, the system comprising:
a camera configured to image a mounting area including a pad pattern and a pad pattern orientation indicating portion indicating an orientation of the pad pattern on the circuit board on which the electronic component is to be mounted;
a display device configured to display an image of the mounting area imaged by the camera; and
circuitry configured to:
display an imaginary mounted state of the electronic component to be mounted according to the production program including (i) a representation of the electronic component and (ii) a component mounting orientation indicating portion indicating the mounting orientation of the electronic component being superimposed on the image of the mounting area including (iii) the pad pattern and (iv) the pad pattern orientation indicating portion on the display device, and
edit the production program so that the mounting orientation of the electronic component matches the orientation of the pad pattern, in a case where the mounting orientation of the electronic component designated in the production program does not match the orientation of the pad pattern in the mounting area when an operator looks at the imaginary mounted state of the electronic component displayed on the display device.

2. The electronic component mounting orientation checking system according to claim 1 , wherein
the electronic component mounting orientation checking system is equipped on an electronic component mounter, and
the camera is a mark imaging camera configured to image a reference position mark of the circuit board.

3. The electronic component mounting orientation checking system according to claim 1 , wherein the circuitry is configured to display a terminal specifying the mounting orientation of the electronic component among multiple terminals of the electronic component with any one of a character, a symbol, a mark, and a color distinguishable from other terminals, as the component mounting orientation indicating portion.

4. The electronic component mounting orientation checking system according to claim 1 , wherein the circuitry is configured to edit the production program so that a mounting position of the electronic component matches a position of the pad pattern, when the operator looks at a positional deviation of the pad pattern of the mounting area with respect to the imaginary mounted state of the electronic component displayed on the display device.

5. The electronic component mounting orientation checking system according to claim 1 , wherein the pad pattern orientation indicating portion includes a pad numeral.

6. The electronic component mounting orientation checking system according to claim 5 , wherein the component mounting orientation indicating portion includes a terminal numeral.

7. The electronic component mounting orientation checking system according to claim 6 , wherein
the pad numeral is disposed near a pad of the pad pattern,
the pad numeral corresponds to an order in which the pad is soldered,
the terminal numeral is disposed near a terminal of terminals of the electronic component, and
the terminal numeral corresponds to an order of the terminal with respect to the terminals.

8. The electronic component mounting orientation checking system according to claim 5 , wherein
the pad numeral is disposed near a pad of the pad pattern, and
the pad numeral corresponds to an order in which the pad is soldered.

9. The electronic component mounting orientation checking system according to claim 1 , wherein the component mounting orientation indicating portion includes a terminal numeral.

10. The electronic component mounting orientation checking system according to claim 9 , wherein
the terminal numeral is disposed near a terminal of terminals of the electronic component, and
the terminal numeral corresponds to an order of the terminal with respect to the terminals.

11. The electronic component mounting orientation checking system according to claim 1 , wherein the pad pattern orientation indicating portion indicates an order of a pad with respect to other pads.

12. The electronic component mounting orientation checking system according to claim 11 , wherein the component mounting orientation indicating portion indicates an order of a terminal with respect to terminals of the electronic component.

13. The electronic component mounting orientation checking system according to claim 1 , wherein the component mounting orientation indicating portion indicates an order of a terminal with respect to terminals of the electronic component.

14. An electronic component mounting orientation checking method for checking a mounting orientation of an electronic component to be mounted on a circuit board according to a production program before starting a production, in which a pad pattern orientation indicating portion indicating an orientation of a pad pattern on which the electronic component is mounted is formed in a mounting area including the pad pattern in the circuit board, the method comprising:
imaging the mounting area including the pad pattern and the pad pattern orientation indicating portion on the circuit board with a camera;
displaying an image of the mounting area imaged by the camera on a display device;
displaying an imaginary mounted state of the electronic component to be mounted according to the production program including (i) a representation of the electronic component and (ii) a component mounting orientation indicating portion indicating the mounting orientation of the electronic component being superimposed on the image of the mounting area including (iii) the pad pattern and (iv) the pad pattern orientation indicating portion on the display device; and
editing the production program so that the mounting orientation of the electronic component matches the orientation of the pad pattern, in a case where the mounting orientation of the electronic component designated in the production program does not match the orientation of the pad pattern in the mounting area when an operator looks at the imaginary mounted state of the electronic component displayed on the display device.

Assignees

• Fuji Corp

Inventors

• Yokoi yuta
• Kobayashi Takahiro
• Kito Shuichiro

Classifications

• G06T7/0004 Primary

  Industrial image inspection · CPC title

• H05K3/3436

  having an array of bottom contacts, e.g. pad grid array or ball grid array components · CPC title

• H05K13/0882 Primary

  Control systems for mounting machines or assembly lines, e.g. centralized control, remote links, programming of apparatus and processes as such (H05K13/083 takes precedence) · CPC title

• G06T2207/30141

  Printed circuit board [PCB] · CPC title

• H05K13/0815

  Controlling of component placement on the substrate during or after manufacturing · CPC title