Resin molded body manufacturing method, resin film manufacturing method, and injection molded article manufacturing method
US-2018079876-A1 · Mar 22, 2018 · US
Shaping material, resin shaped product, cosmetic container, semiconductor container, and method of producing semiconductor container
US11325287B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11325287-B2 |
| Application number | US-201816484587-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 19, 2018 |
| Priority date | Mar 21, 2017 |
| Publication date | May 10, 2022 |
| Grant date | May 10, 2022 |
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- Title
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Abstract
Official abstract text for this publication.
A shaping material contains a crystalline alicyclic structure-containing resin. More specifically, the crystalline alicyclic structure-containing resin in the shaping material has a melting point of 200° C. or higher, and content of chlorobenzene-soluble components in the shaping material is 1,000 ppm or less as an o-dichlorobenzene-equivalent value based on gas chromatography analysis with o-dichlorobenzene as a standard substance.
First claim
Opening claim text (preview).
The invention claimed is: 1. A shaping material comprising a crystalline alicyclic structure-containing resin, wherein the crystalline alicyclic structure-containing resin has a melting point of 200° C. or higher, and content of chlorobenzene-soluble components in the shaping material is 1,000 ppm or less as an o-dichlorobenzene-equivalent value based on gas chromatography analysis with o-dichlorobenzene as a standard substance. 2. The shaping material according to claim 1 , wherein the crystalline alicyclic structure-containing resin is a hydrogenated dicyclopentadiene ring-opened polymer. 3. A resin shaped product obtained through melt shaping of the shaping material according to claim 1 . 4. A cosmetic container that is a shaped item of the shaping material according to claim 1 . 5. A semiconductor container that is a shaped item of the shaping material according to claim 1 . 6. The semiconductor container according to claim 5 , having a degree of crystallinity of 10% or more. 7. A method of producing the shaping material according to claim 1 , the method comprising: a purification step of holding a target resin including a crystalline alicyclic structure-containing resin having a melting point Tm (° C.) of 200° C. or higher in a purification temperature range of not lower than 140° C. and not higher than 300° C. for not less than 0.5 hours and not more than 100 hours to obtain a purified target resin; and a shaping step of heating a pre-crystallization shaping material including the purified target resin to a higher temperature than the melting point Tm (° C.) to melt the pre-crystallization shaping material and subsequently shaping the pre-crystallization shaping material while holding the pre-crystallization shaping material in a crystallization temperature range of not lower than (Tm−140)° C. and lower than the melting point Tm (° C.) to cause crystallization. 8. The method according to claim 7 , wherein content of chlorobenzene-soluble components in the pre-crystallization shaping material used in the shaping step is 1,000 ppm or less as an o-dichlorobenzene-equivalent value based on gas chromatography analysis with o-dichlorobenzene as a standard substance.
Assignees
Inventors
Classifications
of carbocyclic compounds containing one or more carbon-to-carbon double bonds in the ring · CPC title
- C08J5/18Primary
Manufacture of films or sheets · CPC title
Ring opening metathesis polymerisation [ROMP] · CPC title
- B29C45/0055Primary
Shaping · CPC title
Hydrogenation · CPC title
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Frequently asked questions
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- What does patent US11325287B2 cover?
- A shaping material contains a crystalline alicyclic structure-containing resin. More specifically, the crystalline alicyclic structure-containing resin in the shaping material has a melting point of 200° C. or higher, and content of chlorobenzene-soluble components in the shaping material is 1,000 ppm or less as an o-dichlorobenzene-equivalent value based on gas chromatography analysis with o-d…
- Who is the assignee on this patent?
- Zeon Corp
- What technology area does this patent fall under?
- Primary CPC classification C08J5/18. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue May 10 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).