Buried contact layer for UV emitting device

US11322647B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11322647-B2
Application numberUS-202016864838-A
CountryUS
Kind codeB2
Filing dateMay 1, 2020
Priority dateMay 1, 2020
Publication dateMay 3, 2022
Grant dateMay 3, 2022

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

In some embodiments, a light emitting structure comprises a layered semiconductor stack comprising a first set of doped layers, a second layer, a light emitting layer positioned between the first set of doped layers and the second layer, and an electrical contact to the first set of doped layers. The first set of doped layers can comprise a first sub-layer, a second sub-layer, and a third sub-layer, where the third sub-layer is adjacent to the light emitting layer. The electrical contact to the first set of doped layers can be made to the second sub-layer. The first, second and third sub-layers can be doped n-type, and an electrical conductivity of the second sub-layer can be higher than an electrical conductivity of the first and third sub-layers. In some cases, the second sub-layer can absorb more light emitted from the light emitting layer than the first or third sub-layers.

First claim

Opening claim text (preview).

What is claimed is: 1. A light emitting structure, comprising: a layered stack comprising a first set of doped layers, a second layer, a light emitting layer positioned between the first set of doped layers and the second layer, and an electrical contact to the first set of doped layers, wherein: the first set of doped layers, the second layer, and the light emitting layer comprise semiconductor materials; the first set of doped layers comprises a first sub-layer, a second sub-layer, and a third sub-layer, the third sub-layer being adjacent to the light emitting layer; the first, second and third sub-layers comprise a first, second and third superlattice, respectively; well layers of the second superlattice are thicker than well layers of the first and third superlattices; barrier layers of the second superlattice are thinner than barrier layers of the first and third superlattices; the electrical contact to the first set of doped layers is made to the second sublayer; the first, second and third sub-layers are doped n-type; an electrical conductivity of the second sub-layer is higher than an electrical conductivity of the first and third sub-layers; the light emitting layer comprises a fourth superlattice; the second layer comprises a fifth superlattice; and the fifth superlattice is a chirped superlattice comprising changing well layer thicknesses, changing barrier layer thicknesses, or changing well layer and barrier layer thicknesses through the fifth superlattice. 2. The light emitting structure of claim 1 , wherein: light with a wavelength shorter than 300 nm that is emitted from the light emitting layer passes through the first set of doped layers before being emitted from the light emitting structure; and the second sub-layer absorbs from 10% to 60% of the light emitted from the light emitting layer that reaches the second sub-layer. 3. The light emitting structure of claim 1 , wherein the well layers of the second superlattice comprise materials with lower bandgaps than the well layers of the first and third superlattices. 4. The light emitting structure of claim 1 , wherein the first, second, third, fourth, and fifth superlattices each comprise sets of GaN well layers and AlN barrier layers. 5. The light emitting structure of claim 1 , wherein the chirped superlattice is a p-type chirped superlattice comprising changing well layer thicknesses, changing barrier layer thicknesses, or changing well layer and barrier layer thicknesses through the fifth superlattice. 6. A light emitting structure, comprising: a layered stack comprising a first set of doped layers, a second layer, a light emitting layer positioned between the first set of doped layers and the second layer, and an electrical contact to the first set of doped layers, wherein: the first set of doped layers, the second layer, and the light emitting layer comprise semiconductor materials; the first set of doped layers comprises a first sub-layer, a second sub-layer, and a third sub-layer, the third sub-layer being adjacent to the light emitting layer; the electrical contact to the first set of doped layers is made to the second sublayer; the first, second and third sub-layers are doped n-type; an electrical conductivity of the second sub-layer is higher than an electrical conductivity of the first and third sub-layers; the first, second and third sub-layers comprise a first, second and third superlattice, respectively; the light emitting layer comprises a fourth superlattice; the second layer comprises a fifth superlattice; the first, second, third, fourth, and fifth superlattices each comprise sets of GaN well layers and AlN barrier layers; and the fifth superlattice is a chirped superlattice comprising changing well layer thicknesses, changing barrier layer thicknesses, or changing well layer and barrier layer thicknesses through the fifth superlattice. 7. The light emitting structure of claim 6 , wherein: light with a wavelength shorter than 300 nm is emitted from the light emitting layer and passes through the first set of doped layers before being emitted from the light emitting structure; and the second sub-layer absorbs from 10% to 60% of the light emitted from the light emitting layer that reaches the second sub-layer. 8. The light emitting structure of claim 6 , wherein well layers of the second superlattice are thicker than well layers of the first and third superlattices. 9. The light emitting structure of claim 6 , wherein the chirped superlattice is a p-type chirped superlattice comprising changing well layer thicknesses, changing barrier layer thicknesses, or changing well layer and barrier layer thicknesses through the fifth superlattice.

Assignees

Inventors

Classifications

  • containing nitrogen, e.g. GaN · CPC title

  • having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures · CPC title

  • H10H20/812Primary

    within the light-emitting regions, e.g. having quantum confinement structures · CPC title

  • Current-blocking structures · CPC title

  • having stress relaxation structures, e.g. buffer layers · CPC title

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What does patent US11322647B2 cover?
In some embodiments, a light emitting structure comprises a layered semiconductor stack comprising a first set of doped layers, a second layer, a light emitting layer positioned between the first set of doped layers and the second layer, and an electrical contact to the first set of doped layers. The first set of doped layers can comprise a first sub-layer, a second sub-layer, and a third sub-l…
Who is the assignee on this patent?
Silanna UV Technologies Pte Ltd
What technology area does this patent fall under?
Primary CPC classification H10H20/812. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 03 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).