Fluid supply device and liquid discharge method of this device

Patent metadata

Field	Value
Publication number	US-11322372-B2
Application number	US-201816635002-A
Country	US
Kind code	B2
Filing date	Jul 31, 2018
Priority date	Aug 13, 2017
Publication date	May 3, 2022
Grant date	May 3, 2022

Abstract

A fluid supply device includes a condenser, a tank that stores the fluid, a pump that pressure-feeds the fluid toward a processing chamber, a main pipe connecting the tank and the pump and transferring the liquid stored in the tank to the pump using a weight of the liquid, and a discharging pipe that is connected to the main pipe at a lowest position of the main pipe at one end, is opened to the atmosphere at the other end, and vaporizes and discharges the liquid in the tank and the main pipe to the outside. The discharging pipe is formed so that, after the liquid in the tank and the main pipe is fully discharged, a liquid pool that separates a space on the atmosphere side and a space on the main pipe side of the discharging pipe is temporarily produced in the discharging pipe.

First claim

What is claimed is:

1. A fluid supply device for supplying a fluid in a liquid state toward a processing chamber, comprising:
a condenser that liquefies a fluid in a gas state;
a tank that stores the fluid liquefied by the condenser;
a pump that pressure-feeds the liquefied fluid stored in the tank toward the processing chamber;
a main pipe connecting the tank and the pump and transferring the liquefied fluid stored in the tank to the pump using a weight of the liquefied fluid; and
a discharging pipe that is connected to the main pipe at a lowest position of the main pipe at one end, is opened to an atmosphere at another end, and vaporizes and discharges the liquefied fluid in the tank and the main pipe to an outside,
the discharging pipe being formed so that, after the liquefied fluid in the tank and the main pipe is fully discharged, a liquid pool that separates a space on an atmosphere side and a space on a main pipe side of the discharging pipe is temporarily produced in the discharging pipe.

2. The fluid supply device according to claim 1 , wherein
the discharging pipe has a lowest position in a middle thereof lower than positions of the one end and the another end so that the liquid pool is produced at and adjacent the lowest position, and a switch valve is provided at the lowest position of the discharging pipe.

3. The fluid supply device according to claim 1 , wherein
the discharging pipe is provided with an orifice on a side of the another end, comprises an exhaust passage connected in a vicinity of an outlet side of the orifice of the discharging pipe, and further comprises an exhaust device to cause the atmosphere to flow through the exhaust passage in one direction.

4. The fluid supply device according to claim 1 , wherein
the fluid includes carbon dioxide.

5. A liquid discharge method of a fluid supply device for supplying a fluid in a liquid state toward a processing chamber, the fluid supply device comprising:
a condenser that liquefies a fluid in a gas state;
a tank that stores the fluid liquefied by the condenser;
a pump that pressure-feeds the liquefied fluid stored in the tank toward the processing chamber; and
a main pipe connecting the tank and the pump and transferring the liquefied fluid stored in the tank to the pump using a weight of the liquefied fluid,
the liquid discharge method comprising:
when a discharging pipe connected to the main pipe at a lowest position of the main pipe at one end and opened to an atmosphere at another end is used to vaporize and discharge the liquefied fluid in the tank and the main pipe to an outside, temporarily producing, in the discharging pipe, a liquid pool that separates a space on an atmosphere side and a space on a main pipe side of the discharging pipe after the liquefied fluid in the tank and the main pipe is fully discharged.

6. The liquid discharge method according to claim 5 , further comprising:
causing the atmosphere to flow through an exhaust passage in one direction;
mixing the gas obtained by vaporizing the liquefied fluid and the atmosphere to obtain a mixture; and
discharging the mixture to the outside, wherein
the discharging pipe is provided with an orifice on a side of said another end, and
the exhaust passage is connected in a vicinity of an outlet side of the orifice of the discharging pipe.

7. A semiconductor manufacturing system comprising:
the fluid supply device described in claim 1 ; and
a processing chamber that processes a substrate using the fluid supplied from the fluid supply device.

Assignees

• Fujikin Kk

Inventors

• Yoshida Toshihide
• Minami Yukio
• Shinohara Tsutomu

Classifications

• H10P72/0408 Primary

  for drying · CPC title

• H10P52/00 Primary

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• H10P76/00

  Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography · CPC title

• H10P72/0402 Primary

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• B05C3/00

  Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material · CPC title