Multilayer capacitor

Patent metadata

Field	Value
Publication number	US-11322305-B2
Application number	US-202016778965-A
Country	US
Kind code	B2
Filing date	Jan 31, 2020
Priority date	Sep 2, 2019
Publication date	May 3, 2022
Grant date	May 3, 2022

Abstract

A multilayer capacitor includes a capacitor body having first through six surfaces, and having alternately stacked first internal electrodes and second internal electrodes having dielectric layers therebetween and each having one end thereof exposed through a respective one of third and fourth surfaces. First and second conductive layers respectively include first and second connection portions respectively disposed on the third and fourth surfaces of the capacitor body and respectively connected to the first and second internal electrodes, and first and second band portions respectively extending from the first and second connection portions to respective portions of the first, second, fifth, and sixth surfaces of the capacitor body. First and second reinforcing layers each include a carbon material and an impact-absorbing binder and are respectively disposed on the first and second band portions.

First claim

What is claimed is:

1. A multilayer capacitor comprising:
a capacitor body including first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other in a length direction, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposing each other, and including alternately stacked first internal electrodes and second internal electrodes having dielectric layers interposed therebetween and each having one end thereof exposed through a respective one of the third and fourth surfaces;
first and second conductive layers respectively including first and second connection portions respectively disposed on the third and fourth surfaces of the capacitor body and respectively connected to the first and second internal electrodes, and first and second band portions respectively extending from the first and second connection portions to respective portions of the first, second, fifth, and sixth surfaces of the capacitor body;
first and second reinforcing layers each including a carbon material and respectively disposed on the first and second band portions; and
first and second layers respectively disposed on the first and second reinforcing layers such that an interface is defined therebetween,
wherein the first and second layers respectively include first and second conductive resin layers disposed on the first and second conductive layers, respectively.

2. The multilayer capacitor of claim 1 , wherein a length of the first and second reinforcing layers in the length direction is longer than a length of the first and second band portions in the length direction.

3. The multilayer capacitor of claim 1 , wherein the first and second reinforcing layers are further respectively disposed on the first and second connection portions.

4. The multilayer capacitor of claim 1 ,
wherein the first reinforcing layer is disposed between the first conductive layer and the first conductive resin layer, and
the second reinforcing layer is disposed between the second conductive layer and the second conductive resin layer.

5. The multilayer capacitor of claim 4 , wherein a length of the first and second reinforcing layers in the length direction is longer than a length of the first and second band portions in the length direction.

6. The multilayer capacitor of claim 4 , wherein the first and second reinforcing layers are further respectively disposed on the first and second connection portions.

7. The multilayer capacitor of claim 1 , wherein the first and second layers respectively further include first and second plating layers disposed on the first and second conductive layers, respectively,
wherein the first reinforcing layer is disposed between the first conductive layer and the first plating layer, and
the second reinforcing layer is disposed between the second conductive layer and the second plating layer.

8. The multilayer capacitor of claim 7 , wherein the first and second plating layers comprise first and second nickel (Ni) plating layers disposed on the first and second conductive layers, respectively, and first and second tin (Sn) plating layers disposed on the first and second nickel plating layers, respectively.

9. The multilayer capacitor of claim 1 , wherein the carbon material of the first and second reinforcing layers comprises one or more of graphene, carbon nanotubes, or carbon black.

10. The multilayer capacitor of claim 1 , wherein the first and second reinforcing layers each includes an impact-absorbing binder comprising an epoxy-based or an acrylic-based binder.

11. The multilayer capacitor of claim 1 , wherein each of the first and second reinforcing layers further includes an impact-absorbing binder.

12. The multilayer capacitor of claim 1 , wherein the first and second reinforcing layers are not disposed on the third and fourth surfaces of the capacitor body.

13. A multilayer capacitor comprising:
a capacitor body including first internal electrodes and second internal electrodes that are alternately stacked with dielectric layers interposed therebetween; and
first and second external electrodes disposed on external surfaces of the capacitor body and respectively connected to the first internal electrodes and the second internal electrodes,
wherein each of the first and second external electrodes has a multi-layer structure including multiple electrically-conductive layers stacked on the external surfaces of the capacitor body, and including a reinforcing layer including a carbon material and disposed between two of the multiple electrically-conductive layers such that an interface is defined therebetween, and
wherein the reinforcing layer of each of the first and second external electrodes is not disposed on the external surfaces of the capacitor body through which the first and second external electrodes are respectively connected to the first internal electrodes and the second internal electrodes.

14. The multilayer capacitor of claim 13 , wherein the reinforcing layer of each of the first and second external electrodes further includes an impact-absorbing binder.

15. The multilayer capacitor of claim 13 , wherein the carbon material in the reinforcing layer of each of the first and second external electrodes includes one or more of graphene, carbon nanotubes, or carbon black.

16. The multilayer capacitor of claim 13 , wherein the reinforcing layer of each of the first and second external electrodes is spaced apart from surfaces of the capacitor body.

17. The multilayer capacitor of claim 13 , wherein the reinforcing layer of each of the first and second external electrodes extends from the respective first or second external electrode onto surfaces of the capacitor body.

18. The multilayer capacitor of claim 13 , wherein the reinforcing layer of the first external electrode is spaced apart from the reinforcing layer of the second external electrode.

19. A multilayer capacitor comprising:
a capacitor body including first internal electrodes and second internal electrodes that are alternately stacked with dielectric layers interposed therebetween;
first and second external electrodes disposed on external surfaces of the capacitor body and respectively connected to the first internal electrodes and the second internal electrodes;
first and second reinforcing layers disposed on different respective portions of the external surfaces of the capacitor body to be spaced apart from each other, and each including a carbon material; and
first and second conductive resin layers respectively disposed on the first and second reinforcing layers such that an interface is defined therebetween.

20. The multilayer capacitor of claim 19 , wherein the first and second reinforcing layers directly contact different respective portions of the external surfaces of the capacitor body.

21. The multilayer capacitor of claim 19 , wherein the first and second reinforcing layers are respectively disposed on the first and second external electrodes to overlay the different respective portions of the external surfaces of the capacitor body.

22. The multilayer capacitor of claim 19 , wherein the first and second internal electrodes are exposed on respective opposing external surfaces of the capacitor body, and the first and second reinforcing layers are disposed on the respective opposing external surfaces of the capacitor body.

23. The

Assignees

• Samsung Electro Mech

Inventors

• Oh Won Kuen
• Park Hye Hun
• Lee Tae Gyeom

Classifications

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/232 Primary

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01G4/005

  Electrodes · CPC title

• H01G2/065 Primary

  for surface mounting, e.g. chip capacitors · CPC title

• H01G5/14

  due to longitudinal movement of electrodes · CPC title