Ultrasonic joining method and arrangement

US11318688B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11318688-B2
Application numberUS-202016803201-A
CountryUS
Kind codeB2
Filing dateFeb 27, 2020
Priority dateMar 7, 2019
Publication dateMay 3, 2022
Grant dateMay 3, 2022

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method for joining at least two joining partners includes performing a plurality of ultrasonic joining operations in direct succession, wherein performing an individual ultrasonic joining operation includes, with a second joining tool, applying pressure to a second joining partner arranged adjacent to a first joining partner, thereby pressing the second joining partner against the first joining partner, and, with the second joining tool, applying high-frequency ultrasonic vibrations to the joining partners. The method further includes, during at least one intermediate time interval between two directly successive ultrasonic joining operations, at least one of actively cooling and heating the second joining tool.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for joining at least two joining partners, the method comprising: performing a plurality of ultrasonic joining operations in direct succession, wherein performing an individual ultrasonic joining operation comprises, with a joining tool, applying pressure to a second joining partner arranged adjacent to a first joining partner, thereby pressing the second joining partner against the first joining partner, and, with the joining tool, applying high-frequency ultrasonic vibrations to the joining partners; and during at least one intermediate time interval between two directly successive ultrasonic joining operations, actively cooling the joining tool by a temperature unit that comprises an evaporative cooling unit, wherein the evaporative cooling unit comprises a capillary comprising a first section having a first diameter and a second section having a second diameter that is smaller than the diameter of the first section, and wherein cooling liquid that passes through the capillary passes the second section and changes phase to a gaseous state when reaching the first section with the larger diameter. 2. The method of claim 1 , wherein the joining tool is actively heated to a predefined temperature before performing a first one of the plurality of ultrasonic joining operations. 3. The method of claim 1 , wherein the joining tool is actively heated during intermediate time intervals between less than 50% of the plurality of ultrasonic joining operations. 4. The method of claim 1 , wherein each of the plurality of ultrasonic joining operations has a duration of between 50 ms and 10 s. 5. The method of claim 1 , wherein each of the intermediate time intervals has a duration of between 200 ms and 30 s. 6. The method of claim 1 , wherein the joining tool is heated or cooled by the temperature unit, and wherein the temperature unit is inactive during each of the plurality of ultrasonic joining operations. 7. The method of claim 1 , wherein the evaporative cooling unit is disposed within the joining tool. 8. An ultrasonic joining arrangement, comprising: a first joining tool comprising a first support surface; and a second joining tool configured to perform a plurality of ultrasonic joining operations in direct succession, wherein performing an ultrasonic joining operation comprises applying pressure to a second joining partner and a first joining partner that are stacked on top of each other on the first support surface, thereby pressing the second joining partner against the first joining partner, and applying high-frequency ultrasonic vibrations to the joining partners, wherein the second joining tool comprises a temperature unit configured to at least one of actively cool down and heat up the second joining tool at least during one intermediate time interval between two directly successive ultrasonic joining operations, wherein the temperature unit comprises an evaporative cooling unit, wherein the evaporative cooling unit comprises a capillary comprising a first section having a first diameter and a second section having a second diameter that is smaller than the diameter of the first section, and wherein cooling liquid that passes through the capillary passes the second section and changes phase to a gaseous state when reaching the first section with the larger diameter. 9. The ultrasonic joining arrangement of claim 8 , wherein the second joining tool comprises a temperature sensor configured to detect a temperature of the second joining tool. 10. The ultrasonic joining arrangement of claim 8 , wherein the temperature unit comprises a laser unit or an induction unit configured to actively heat the second joining tool. 11. The ultrasonic joining arrangement of claim 8 , wherein the second joining tool comprises a sonotrode. 12. The ultrasonic joining arrangement of claim 8 , further comprising a joining arrangement configured to adjust a temperature profile of the first joining partner, a temperature profile of the second joining partner, a temperature profile of the first joining tool and a temperature profile of the second joining tool such that each temperature profile is identical or at least similar for each ultrasonic joining operation in a sequence of joining operations. 13. The ultrasonic joining arrangement of claim 12 , further comprising a temperature sensor configured to determine a temperature of the second joining tool, wherein the joining arrangement is further configured to, by means of the temperature unit, adjust a temperature profile of the second joining tool such that an initial temperature of the second joining tool is identical or at least similar at the beginning of each joining operation in a sequence of joining operations. 14. The ultrasonic joining arrangement of claim 13 , further comprising a proportional integral derivative regulator configured to adjust the temperature profile of the second joining tool based on the temperature determined by the temperature sensor. 15. The ultrasonic joining arrangement of claim 8 , further comprising a joining arrangement configured to, during an intermediate time interval between two directly successive ultrasonic joining operations, adjust an initial temperature of the first joining partner and an initial temperature of the second joining partner such that the initial temperature of the first joining partner and the initial temperature of the second joining partner each are identical or at least similar at the beginning of each joining operation in a sequence of joining operations. 16. The ultrasonic joining arrangement of claim 8 , wherein the evaporative cooling unit is disposed within the second joining tool.

Assignees

Inventors

Classifications

  • Single lap to lap joints, i.e. overlap joints (B29C66/45, B29C66/472, B29C66/52272 take precedence) · CPC title

  • of the welding jaws · CPC title

  • the welding jaws being cooled from the outside, e.g. by blowing a gas or spraying a liquid · CPC title

  • using heated tools · CPC title

  • said single elements being substantially flat · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11318688B2 cover?
A method for joining at least two joining partners includes performing a plurality of ultrasonic joining operations in direct succession, wherein performing an individual ultrasonic joining operation includes, with a second joining tool, applying pressure to a second joining partner arranged adjacent to a first joining partner, thereby pressing the second joining partner against the first joini…
Who is the assignee on this patent?
Infineon Technologies Ag
What technology area does this patent fall under?
Primary CPC classification B29C66/9441. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 03 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).