Machining condition adjustment device and machine learning device

US11318565B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11318565-B2
Application numberUS-201916541157-A
CountryUS
Kind codeB2
Filing dateAug 15, 2019
Priority dateAug 24, 2018
Publication dateMay 3, 2022
Grant dateMay 3, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A machining condition adjustment device adjusts settings of an ionizer so as to neutralize a charge carried by plasma generated during laser beam machining of a workpiece by a laser beam machining device, calculates an amount of charge per unit time that is to be radiated from the ionizer, based on the amount of charge carried by the plasma generated during the laser beam machining, and sets the ionizer to radiate the calculated amount of charge per unit time.

First claim

Opening claim text (preview).

The invention claimed is: 1. A laser beam machining system, comprising: a laser beam machining device configured to generate a laser to perform laser beam machining of a workpiece; an ionizer configured to neutralize a charge carried by plasma generated during the laser beam machining of the workpiece by the laser beam machining device; a plasma measuring device configured to measure an amount of charge carried by the plasma generated during the laser beam machining; and a processor configured to calculate an amount of charge per unit time that is to be radiated from the ionizer, based on at least the amount of charge carried by the plasma generated during the laser beam machining and measured by the plasma measuring device, and set the ionizer to radiate the calculated amount of charge per unit time that neutralizes the amount of charge carried by the plasma. 2. A machining condition adjustment device for adjusting settings of an ionizer so as to neutralize a charge carried by plasma generated during laser beam machining of a workpiece by a laser beam machining device, the machining condition adjustment device comprising: a processor configured to calculate an amount of charge per unit time that is to be radiated from the ionizer, based on at least an amount of charge carried by the plasma generated during the laser beam machining and measured by a plasma measuring device, and set the ionizer to radiate the calculated amount of charge per unit time; anda correction factor storage device in which a correction factor set in association with at least material and a plate thickness of the workpiece is stored, wherein the processor is further configured to calculate a correction value for correction for the amount of charge per unit time that is calculated based on the amount of charge carried by the plasma generated during the laser beam machining and that is to be radiated from the ionizer, with use of a preset correction equation, based on the correction factor read out from the correction factor storage device based on the material and the plate thickness of the workpiece to be subjected to the laser beam machining and a laser beam machining condition set for the laser beam machining. 3. A machining condition adjustment device for adjusting settings of an ionizer so as to neutralize a charge carried by plasma generated during laser beam machining of a workpiece by a laser beam machining device, the machining condition adjustment device comprising: a processor configured to calculate an amount of charge per unit time that is to be radiated from the ionizer, based on at least an amount of charge carried by the plasma generated during the laser beam machining and measured by a plasma measuring device, set the ionizer to radiate the calculated amount of charge per unit time, produce state variables including ionizer setting data related to the settings of the ionizer, workpiece data related to the workpiece, plasma generation state data related to the amount of charge carried by the plasma generated during the laser beam machining, and machining condition data indicating a machining condition during the laser beam machining, produce determination data including plasma generation amount determination data for determination of appropriateness of the amount of charge carried by the plasma in the laser beam machining by the laser beam machining device, and learn adjustment action for the settings of the ionizer with respect to the amount of charge carried by the plasma generated in the laser beam machining of the workpiece under a prescribed laser beam machining condition, with use of the state variables and the determination data, wherein the plasma generation amount determination data is intended for determination of appropriateness of the amount of charge carried by the plasma generated in the laser beam machining of the workpiece under the laser beam machining condition adjusted by adjustment action for the settings of the ionizer. 4. The machining condition adjustment device according to claim 3 , wherein the processor is further configured to conduct reinforcement learning in which a high reward is conferred when the amount of charge carried by the plasma generated in the laser beam machining of the workpiece under the prescribed laser beam machining condition is near to a neutralized state. 5. The machining condition adjustment device according to claim 3 , wherein the adjustment action for the settings of the ionizer is adjustment action for an amount of charge per unit time that is to be radiated to a vicinity of a machined portion during the laser beam machining. 6. A machining condition adjustment device for adjusting settings of an ionizer so as to neutralize a charge carried by plasma generated during laser beam machining of a workpiece by a laser beam machining device, the machining condition adjustment device comprising: a processor configured to calculate an amount of charge per unit time that is to be radiated from the ionizer, based on at least an amount of charge carried by the plasma generated during the laser beam machining and measured by a plasma measuring device, set the ionizer to radiate the calculated amount of charge per unit time, and produce state variables including ionizer setting data related to the settings of the ionizer, workpiece data related to the workpiece, plasma generation state data related to the amount of charge carried by the plasma generated during the laser beam machining, and machining condition data indicating a machining condition during the laser beam machining, wherein the machining condition adjustment device further comprises a learning model storage device configured to store a learned model that has learned adjustment action for the settings of the ionizer with respect to the amount of charge carried by the plasma generated in the laser beam machining of the workpiece under a prescribed laser beam machining condition, and the processor is configured to estimate the adjustment action for the settings of the ionizer with use of the learned model based on the state variables.

Assignees

Inventors

Classifications

  • Combinations of networks · CPC title

  • Feedforward networks · CPC title

  • Reinforcement learning · CPC title

  • using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor (B23K26/12 takes precedence) · CPC title

  • B23K26/38Primary

    by boring or cutting · CPC title

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What does patent US11318565B2 cover?
A machining condition adjustment device adjusts settings of an ionizer so as to neutralize a charge carried by plasma generated during laser beam machining of a workpiece by a laser beam machining device, calculates an amount of charge per unit time that is to be radiated from the ionizer, based on the amount of charge carried by the plasma generated during the laser beam machining, and sets th…
Who is the assignee on this patent?
Fanuc Corp
What technology area does this patent fall under?
Primary CPC classification B23K26/38. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 03 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).