Film forming method

Patent metadata

Field	Value
Publication number	US-11318495-B2
Application number	US-202016906432-A
Country	US
Kind code	B2
Filing date	Jun 19, 2020
Priority date	Dec 22, 2017
Publication date	May 3, 2022
Grant date	May 3, 2022

Abstract

An object of the present invention is to provide a film forming method capable of forming a film by an aerosol deposition with high accuracy patterning. The object of the present invention is achieved by aerosolizing a raw material liquid including a film forming material; supplying the aerosol to a base material; and forming a film of the film forming material on the base material, in which the base material has, on a film forming surface, a liquid-repellent region which has liquid repellency to the raw material liquid and a lyophilic region which has lyophilicity to the raw material liquid, and in a case where a width of the liquid-repellent region is L and a diameter of the aerosol is D, “D>L” is satisfied.

First claim

What is claimed is:

1. A film forming method comprising:
aerosolizing a raw material liquid including a film forming material;
supplying the aerosol to a base material; and
forming a film of the film forming material on the base material,
wherein the base material has, on a film forming surface, a liquid-repellent region which has liquid repellency to the raw material liquid and a lyophilic region which has lyophilicity to the raw material liquid, and
in a case where a width of the liquid-repellent region is L and a diameter of the aerosol is D, D>L is satisfied, and
wherein the aerosol is supplied to the base material while vibrating the base material at a frequency of 10 kHz or less.

2. The film forming method according to claim 1 ,
wherein the aerosol is supplied to the base material while heating the base material.

3. The film forming method according to claim 2 ,
wherein the base material is heated such that a temperature of a surface of the base material is 100° C. or higher.

4. The film forming method according to claim 3 ,
wherein a boiling point of a solvent or a dispersion medium included in the raw material liquid is 100° C. or lower.

5. The film forming method according to claim 2 ,
wherein a boiling point of a solvent or a dispersion medium included in the raw material liquid is 100° C. or lower.

6. The film forming method according to claim 1 ,
wherein the lyophilic region and the liquid-repellent region on the film forming surface of the base material are formed by performing lyophilic treatment on an entire surface of one side of the base material and then forming a pattern having liquid repellency to the raw material liquid.

7. The film forming method according to claim 1 ,
wherein the lyophilic region and the liquid-repellent region form a wiring pattern.

8. The film forming method according to claim 7 ,
wherein the wiring pattern is a line-and-space wiring pattern.

9. The film forming method according to claim 1 ,
wherein the film forming material is a conductive material.

Assignees

• Fujifilm Corp

Inventors

• Hasegawa Masataka
• KANAZAWA Hayato

Classifications

• B05D1/02

  performed by spraying · CPC title

• B05D3/12 Primary

  by mechanical means · CPC title

• B05D3/044

  Pretreatment · CPC title

• G02F1/13

  based on liquid crystals, e.g. single liquid crystal display cells · CPC title

• B05D3/067

  Curing or cross-linking the coating · CPC title