Wire embedding system with a curved delivery path

US11317515B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11317515-B2
Application numberUS-201715695828-A
CountryUS
Kind codeB2
Filing dateSep 5, 2017
Priority dateSep 6, 2016
Publication dateApr 26, 2022
Grant dateApr 26, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for embedding a line in a substrate. A line embedding head in positioned relative to a surface of the substrate. The line from an output port in the line embedding head is output at an angle relative to the embedding head such that the line is embedded in the substrate.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus comprising: a line embedding head having an input port and an output port, wherein the input port is configured to receive a line, and the output port is configured to output the line; and a curved channel within the line embedding head, wherein the curved channel is in communication with the output port, and wherein the curved channel changes direction of output relative to direction of input such that the line is output from the output port at an angle relative to the line embedding head that differs from an angle of input into the input port, and wherein the line is output at a non perpendicular angle relative to surface of a substrate so that at least a portion of the line is embedded in the substrate. 2. The apparatus of claim 1 , wherein the angle relative to the surface of the substrate is selected based on at least one of a desired depth for the line embedded in the substrate or a desired amount of resistance to embedding the line in the substrate. 3. The apparatus of claim 1 , wherein the angle is selected based on a group of parameters selected from at least one of a line diameter, a material, a stiffness of the line, a temperature of a substrate, a temperature of a heating block in the line embedding head, a feed rate, or a speed of the line embedding head. 4. The apparatus of claim 1 , wherein the angle is selected to reduce at least one of line breakage or line damage. 5. The apparatus of claim 1 , further comprising: a linear channel in communication with the curved channel. 6. The apparatus of claim 1 , further comprising: a heating block, wherein the curved channel is located within the heating block. 7. The apparatus of claim 6 , further comprising: a guiding structure located on a landing on the heating block that is configured to contact the substrate, wherein the guiding structure guides the line output from the output port as the line is embedded into the substrate. 8. The apparatus of claim 6 , wherein the curved channel comprises: a tube located within the heating block in the line embedding head, wherein the line moves through the tube from the input port to the output port. 9. The apparatus of claim 8 , further comprising: a coating on an interior of the tube such that the coating reduces friction when moving the line through the tube. 10. The apparatus of claim 8 , further comprising: an array of input ports and an array of output ports, wherein the array of input ports is configured to receive lines, and the array of output ports is configured to output the lines; and an array of curved channels within the line embedding head, wherein the array of curved channels is in communication with the array of output ports and wherein the lines are output from the array of output ports at angles relative to the line embedding head. 11. The apparatus of claim 10 , wherein the array of input ports, the array of output ports, and the array of curved channels are located in at least one of a heating block, heating blocks, or line embedding heads including the line embedding head. 12. The apparatus of claim 1 , wherein the line is selected from a group comprising a wire, a filament, a stranded wire, a braided wire, a litz wire, a copper wire, a silver wire, a gold wire, a nichrome wire, a cable, a carbon fiber tow, carbon nanotube yarn, a para-aramid synthetic fiber, an optical fiber, a shape memory alloy line, and an optical cable. 13. A line embedding system comprising: an automation motion system; and a line embedding head connected to the automation motion system, wherein the line embedding head comprises a heating block having an input port, an output port, and a curved channel configured to change direction of output relative to direction of input; wherein the input port is configured to receive a line, and the curved channel is in communication with the output port such that the line is output from the output port at an angle relative to a plane to the line embedding head that differs from an angle of input into the input port; and wherein the line is output at an non perpendicular angle relative to surface of a substrate so that at least a portion of the line is embedded in the substrate. 14. The line embedding system of claim 13 , further comprising: a sensor system configured to measure a distance between the line embedding head and the surface of the substrate. 15. The line embedding system of claim 13 , further comprising: a heating system configured to heat at least one of the line or the substrate. 16. The apparatus of claim 1 , wherein output from the output port is tangential to a surface of a substrate. 17. The line embedding system of claim 13 , wherein output from the output port is tangential to a surface of a substrate.

Assignees

Inventors

Classifications

  • Nanotubes or nanowires · CPC title

  • Details of rigid insulating substrates therefor, e.g. three-dimensional details (H05K1/117 takes precedence) · CPC title

  • Shaping of the substrate, e.g. by moulding · CPC title

  • Carbon · CPC title

  • Forcing wires, nets or the like partially or completely into the surface of an article, e.g. by cutting and pressing · CPC title

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Frequently asked questions

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What does patent US11317515B2 cover?
A method for embedding a line in a substrate. A line embedding head in positioned relative to a surface of the substrate. The line from an output port in the line embedding head is output at an angle relative to the embedding head such that the line is embedded in the substrate.
Who is the assignee on this patent?
Univ Texas
What technology area does this patent fall under?
Primary CPC classification H05K3/103. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Apr 26 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).