Display device and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-11316085-B2
Application number	US-202016734330-A
Country	US
Kind code	B2
Filing date	Jan 4, 2020
Priority date	Apr 19, 2019
Publication date	Apr 26, 2022
Grant date	Apr 26, 2022

Abstract

A display device and a manufacturing method thereof are provided. The display device includes a circuit substrate, multiple light-emitting elements and a packaging material. The circuit substrate includes a first surface, a second surface opposite the first surface, and multiple through slots penetrating through the first and second surfaces. The through slots each are in a stepped form, and the circuit substrate is divided into a chip mounting area, multiple anodes, and a common cathode. The light-emitting elements include multiple light-emitting elements mounted on the circuit substrate along a straight line and electrically connected with the anodes respectively through wires. The packaging material covers the circuit substrate, the light-emitting elements and the wires. The display device has an excellent performance while achieving a small size.

First claim

What is claimed is:

1. A display device, comprising:
a circuit substrate, comprising a first surface, a second surface opposite to the first surface, and a plurality of stepped through slots penetrating through the first surface and the second surface; wherein the through slots divide the circuit substrate into a chip mounting region, a first anode, a second anode, a third anode and a common cathode;
a plurality of light-emitting elements, comprising a first light-emitting element, a second light-emitting element and a third light-emitting element mounted in the chip mounting region and sequentially arranged along a straight line; wherein the first light-emitting element, the second light-emitting element and the third light-emitting element are electrically connected to the first anode, the second anode and the third anode respectively by bonding wires; and
a packaging material, disposed covering the circuit substrate, the plurality of light-emitting elements and the bonding wires;
wherein a spacing between the first anode and the second anode is greater than twice a length of the first anode, and a spacing between the first anode and the common cathode is greater than the length of the first anode and less than twice a width of the first anode;
wherein the display device has a length in a range of 0.5 mm to 0.7 mm, a width in a range of 0.5 mm to 0.7 mm, and a height in a range of 0.5 mm to 0.6 mm.

2. The display device as claimed in claim 1 , wherein each of the through slots has a size of an opening exposed to the first surface is larger than that of an opening exposed to the second surface.

3. The display device as claimed in claim 2 , wherein the first light-emitting element, the second light-emitting element and the third light-emitting element are mounted on the second surface.

4. The display device as claimed in claim 3 , wherein the first light-emitting element, the second light-emitting element and the third light-emitting element are a red LED, a green LED and a blue LED respectively.

5. The display device as claimed in claim 2 , wherein each of the through slots has a step surface between the first surface and the second surface, the step surface is parallel to the first surface and second surface, a distance between the step surface and the first surface is less than 0.05 mm, and a distance between the first surface and the second surface is less than 0.15 mm.

6. The display device as claimed in claim 1 , wherein the chip mounting region is connected with the common cathode.

7. The display device as claimed in claim 6 , wherein the first anode and the common cathode are located on a side of the chip mounting region, and the second anode and the third anode are located on another opposite side of the chip mounting region.

8. The display device as claimed in claim 1 , wherein the packaging material comprises a resin matrix and a plurality of nanoscale matte particles dispersed in the resin matrix.

9. A manufacturing method adapted for the display device as claim in claim 1 , comprising:
providing a conductive base;
etching the conductive base to form a conductive circuit and then cutting the conductive base to obtain a conductive frame, wherein the conductive frame comprises a plurality of interconnected circuit substrates, each of the circuit substrates comprises a first surface, a second surface opposite to the first surface, and a plurality of stepped through slots penetrating through the first surface and second surface; each of the through slots has a size of an opening exposed at the first surface is greater than that of an opening exposed at the second surface; and the through slots divide the circuit substrate into a chip mounting region, a first anode, a second anode, a third anode and a common cathode;
attaching an impermeable tape onto the first surface;
mounting a plurality of light-emitting elements in the chip mounting region at the second surface, wherein the plurality of light-emitting elements comprise a first light-emitting element, a second light-emitting element and a third light-emitting element are sequentially arranged along a straight line and further electrically connected with the first anode, the second anode and the third anode respectively through wires;
encapsulating each the circuit substrate, the plurality of light-emitting elements and the wires by a packaging material, wherein the packaging material comprises a resin matrix and a plurality of nanoscale matte particles dispersed in the resin matrix;
punching the conductive frame to separate the circuit substrates from one another; and
removing the impermeable tape.

10. A display device, comprising:
a circuit substrate, comprising a first surface, a second surface opposite to the first surface, and a plurality of stepped through slots penetrating through the first surface and the second surface; wherein the through slots divide the circuit substrate into a chip mounting region, a first anode, a second anode, a third anode and a common cathode;
a plurality of light-emitting elements, comprising a first light-emitting element, a second light-emitting element and a third light-emitting element mounted in the chip mounting region and sequentially arranged along a straight line; wherein the first light-emitting element, the second light-emitting element and the third light-emitting element are electrically connected to the first anode, the second anode and the third anode respectively by bonding wires; and
a packaging material, disposed covering the circuit substrate, the plurality of light-emitting elements and the bonding wires;
wherein the first anode, the second anode, the third anode and the common cathode are spaced from one another by the stepped through slots; and the first anode, the second anode and the third anode are individually spaced from the chip mounting region by the stepped through slots;
wherein the first anode and the common cathode are located at one side of the chip mounting region, while the second anode and the third anode are located at another opposite side of the chip mounting region;
wherein the display device has a length in a range of 0.5 mm to 0.7 mm, a width in a range of 0.5 mm to 0.7 mm, and a height in a range of 0.5 mm to 0.6 mm.

11. The display device as claimed in claim 10 , wherein the common cathode is connected with the chip mounting region.

12. The display device as claimed in claim 11 , wherein the first light-emitting element, the second light-emitting element and the third light-emitting element are different colors of light-emitting diodes (LEDs) and electrically connected to the same common cathode; and some of the first light-emitting element, the second light-emitting element and the third light-emitting element are electrically connected to the common cathode by bonding wires.

13. The display device as claimed in claim 10 , wherein a spacing between the first anode and the second anode is greater than twice a length of the first anode, and a spacing between the first anode and the common cathode is greater than the length of the first anode and less than twice a width of the first anode.

Assignees

• Kaistar Lighting Xiamen Co Ltd

Inventors

• Zhong Bin

Classifications

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/5473

  multiple bond wires connected to a common bond pad · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/127

  characterised by arrangements for sealing or adhesion · CPC title