Semiconductor package having stiffener

Patent metadata

Field	Value
Publication number	US-11315849-B2
Application number	US-202017060805-A
Country	US
Kind code	B2
Filing date	Oct 1, 2020
Priority date	Mar 27, 2020
Publication date	Apr 26, 2022
Grant date	Apr 26, 2022

Abstract

A semiconductor package includes a substrate including an upper surface and a side surface, an adhesive layer disposed on an edge of the upper surface of the substrate, and a stiffener including a horizontal portion disposed on the adhesive layer and extending in an horizontal direction to an outside of the substrate in a plan view and a vertical portion connected to the horizontal portion and extending vertically downwards from the horizontal portion. The vertical portion is spaced apart from the side surface of the substrate with a vertical gap extending in a vertical direction therebetween, and the outer width of the stiffener is 40 mm or more.

First claim

What is claimed is:

1. A semiconductor package comprising:
a substrate including an upper surface and a side surface;
an adhesive layer disposed on an edge of the upper surface of the substrate; and
a stiffener including a horizontal portion disposed on the adhesive layer and extending in a horizontal direction to an outside of the substrate in a plan view and a vertical portion connected to the horizontal portion and extending vertically downwards from the horizontal portion,
wherein a portion of the horizontal portion of the stiffener is spaced apart from the upper surface of the substrate with a first empty gap extending in a horizontal direction therebetween and the vertical portion of the stiffener is spaced apart from the side surface of the substrate with a second empty gap extending in a vertical direction therebetween, and
wherein a distance between the adhesive layer and the vertical portion of the stiffener is larger than a distance between the side surface of the substrate and the vertical portion of the stiffener.

2. The semiconductor package of claim 1 , wherein a total thickness of the semiconductor package in the vertical direction is 2 mm or more.

3. The semiconductor package of claim 1 , wherein a thickness of the adhesive layer in the vertical direction is 0.05 mm to 0.2 mm.

4. The semiconductor package of claim 1 , wherein a vertical thickness of the horizontal portion is 0.5 mm to 2 mm.

5. The semiconductor package of claim 1 , wherein a horizontal thickness of the vertical portion is 0.5 mm to 2 mm.

6. The semiconductor package of claim 1 , wherein a height difference between a lower surface of the vertical portion and a lower surface of the substrate is 1 mm or less.

7. The semiconductor package of claim 1 , wherein a horizontal width of the second empty gap is 0.05 mm to 0.2 mm.

8. The semiconductor package of claim 1 , wherein the second empty gap is defined by a lower surface of the horizontal portion, an inner side surface of the vertical portion, and the side surface of the substrate.

9. The semiconductor package of claim 1 , wherein a side surface of the adhesive layer is not aligned with the side surface of the substrate.

10. The semiconductor package of claim 1 , wherein a lower surface of the vertical portion is located at a lower level than a lower surface of the substrate.

11. The semiconductor package of claim 1 , wherein a side surface of the adhesive layer is spaced apart from an inner side surface of the vertical portion of the stiffener.

12. The semiconductor package of claim 1 , wherein the stiffener is disposed along an edge of the substrate.

13. The semiconductor package of claim 1 , further comprising:
an external connection terminal disposed on a lower surface of the substrate;
an interposer disposed on the substrate; and
a semiconductor chip disposed on the interposer.

14. A semiconductor package comprising:
a substrate including an upper surface and a side surface;
a first adhesive layer disposed on an edge of the upper surface of the substrate;
a first stiffener disposed on the first adhesive layer;
second stiffeners connected to the first stiffener, the second stiffeners being disposed outside the substrate in a plan view and extending vertically; and
second adhesive layers disposed between the first stiffener and the second stiffeners,
wherein a portion of each of the second stiffeners is spaced apart from the side surface of the substrate with a vertical gap extending in a vertical direction therebetween, and
wherein an outer width of each of the second stiffeners is 40 mm or more.

15. The semiconductor package of claim 14 , wherein the first stiffener is formed along an edge of the substrate.

16. The semiconductor package of claim 15 , wherein the second stiffeners are respectively disposed on four side surfaces of the first stiffener.

17. The semiconductor package of claim 14 , wherein a side surface of the first adhesive layer is located further inwards than the side surface of the substrate in a plan view,
wherein a portion of the first stiffener is spaced apart from the upper surface of the substrate with a horizontal gap extending in a horizontal direction therebetween, and
wherein the horizontal gap is defined by a lower surface of the first stiffener and the upper surface of the substrate.

18. A semiconductor package comprising:
a substrate including an upper surface and a side surface;
an adhesive layer disposed on opposite edges of the upper surface of the substrate;
a stiffener including a horizontal portion disposed on the adhesive layer and extending in a horizontal direction to an outside of the substrate in a plan view and a vertical portion connected to the horizontal portion and extending vertically downwards from the horizontal portion;
a heat spreader disposed on the stiffener; and
a heat sink disposed on the heat spreader,
wherein a portion of the horizontal portion of the stiffener is spaced apart from the upper surface of the substrate with a first empty gap therebetween and the vertical portion of the stiffener is spaced apart from the side surface of the substrate with a second empty gap therebetween, and
wherein a distance between the adhesive layer and the vertical portion of the stiffener is larger than a distance between the side surface of the substrate and the vertical portion of the stiffener.

19. The semiconductor package of claim 18 , further comprising:
an external connection terminal disposed on a lower surface of the substrate;
an interposer disposed on the substrate; and
a semiconductor chip disposed on the interposer,
wherein the heat spreader is connected to the semiconductor chip.

20. The semiconductor package of claim 18 , wherein a side surface of the heat spreader is located further outwards than the side surface of the substrate in a plan view.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Suchang
• Kwak Dongok

Classifications

• H10W90/401

  characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title

• H10W70/611 Primary

  for connecting multiple chips together · CPC title

• H10W70/65 Primary

  Shapes or dispositions of interconnections · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/072

  of bump connectors · CPC title