Plasma processing apparatus and plasma processing method

Patent metadata

Field	Value
Publication number	US-11315792-B2
Application number	US-201916506095-A
Country	US
Kind code	B2
Filing date	Jul 9, 2019
Priority date	May 12, 2015
Publication date	Apr 26, 2022
Grant date	Apr 26, 2022

Abstract

A plasma processing apparatus includes a plasma processing chamber processing a sample using plasma, a radio frequency power supply supplying radio frequency power for generating the plasma, a sample stage including an electrode electrostatically chucking the sample, mounting the sample thereon, a DC power supply applying DC voltage to the electrode, and a control device shifting the DC voltage previously set, in a negative direction by a first shift amount during discharge of the plasma, shifting the DC voltage having been shifted in the negative direction by the first shift amount, in a positive direction by a second shift amount after the discharge of the plasma. The first shift amount has a value changing potential over a surface of the sample to 0 V, upon shifting the DC voltage in the positive direction. The second shift amount has a value obtained based on a floating potential of the plasma.

First claim

What is claimed is:

1. A plasma processing apparatus comprising:
a plasma processing chamber processing a sample using plasma;
a radio frequency power supply supplying radio frequency power for generation of the plasma;
a sample stage including an electrode electrostatically chucking the sample, the sample stage mounting the sample thereon with a back surface of the sample facing the sample stage;
a DC power supply applying an output DC voltage to the electrode; and
a control device configured to shift the output DC voltage previously set, in a negative direction by a first shift amount during discharge of the plasma with the radio frequency power supply turned on for generation of the plasma, and shift the output DC voltage having been shifted in the negative direction by the first shift amount, in a positive direction by a second shift amount, after turning off the radio frequency power supply for generation of the plasma, the second shift amount having a value by which a potential over a surface of the sample is changed to approximately 0 V when an output DC voltage is shifted in a positive direction, after turning off the radio frequency power supply for generation of the plasma.

2. The plasma processing apparatus according to claim 1 , wherein
the electrode includes a first electrode to which a first output DC voltage is applied by the DC power supply, and a second electrode to which a second output DC voltage having a polarity different from that of the first output DC voltage is applied by the DC power supply.

3. The plasma processing apparatus according to claim 2 , wherein
the first shift amount is equal to the second shift amount.

4. The plasma processing apparatus according to claim 2 , wherein
the control device controls a value of the first output DC voltage and a value of the second output DC voltage, before generation of the plasma such that the sample has a potential of approximately 0, the potential being generated due to a difference between an impedance between the first electrode and the sample, and an impedance between the second electrode and the sample.

5. The plasma processing apparatus according to claim 3 , wherein
the second shift amount is not less than 15 V.

6. The plasma processing apparatus according to claim 1 , further comprising:
a detection unit detecting discharge of the plasma and end of the discharge,
the detection unit including:
a sensor monitoring an output voltage of the radio frequency power supply, a sensor monitoring optical emission of the plasma, or a sensor monitoring an ion current from the plasma.

Assignees

• Hitachi High Tech Corp

Inventors

• Ishiguro Masaki
• Sumiya Masahiro
• Shirayone Shigeru
• Ikenaga Kazuyuki
• Tamura Tomoyuki

Classifications

• H10P72/72

  using electrostatic chucks · CPC title

• H10P50/242 Primary

  of Group IV materials · CPC title

• H01J37/32706

  Polarising the substrate · CPC title

• H01J37/32972

  Spectral analysis · CPC title

• H01J37/32422

  Arrangement for selecting ions or species in the plasma · CPC title