Diamond composites by lithography-based manufacturing

Patent metadata

Field	Value
Publication number	US-11311850-B2
Application number	US-201615754316-A
Country	US
Kind code	B2
Filing date	Aug 25, 2016
Priority date	Aug 26, 2015
Publication date	Apr 26, 2022
Grant date	Apr 26, 2022

Abstract

A lithography based method for the manufacture of diamond composite materials in which green bodies are prepared by a layer-by-layer construction with resulting green bodies de-bound and sintered to achieve a dense high hardness material.

First claim

The invention claimed is:

1. A method of preparing a diamond composite with a layered structure comprising:
preparing a slurry containing a polymerisable binder, an initiator and diamond particles;
forming a layered structure green body by stepwise irradiation curing of the slurry containing diamond particles, binder and initiator;
forming a white body comprising at least 30 vol % diamond particles by de-binding the layered structure green body;
introducing an infiltrant to the white body; and
sintering the white body by heating the white body from an initial stage up to a maximum sintering temperature by incremental temperature increases at a rate of 10 to 60° C./min at a first pressure to form a layered microstructure having diamond rich layers with binder matrix rich layers in between, wherein the diamond rich layers are in the range of 25 to 200 microns and the binder matrix rich layers are in the range of 1 to 15 microns, and a content of the diamond particles in the diamond composite article being between 30 and 65 vol %, wherein the binder in the binder matrix rich layers is SiC.

2. The method as claimed in claim 1 , wherein the diamond particles have a particle size of less than or equal to 200 μm.

3. The method as claimed in claim 1 , wherein the diamond particles have a particle size of less than or equal to 100 μm.

4. The method as claimed in claim 1 , wherein the diamond particles have a bi-modular or multi-modular particle size distribution and at least one fraction of diamond particles has a particle size of less than 30 μm and at least one fraction of diamond particles has a particle size of less than 100 μm.

5. The method as claimed in claim 1 , wherein the step of de-binding includes heating the green body up to a first de-binding temperature via incremental temperature increases, wherein the de-binding temperature is in a range of from 200° C. to 600° C. and the incremental temperature increases are at increments of 0.1 to 2° C./min.

6. The method as claimed in claim 1 , wherein the step of de-binding includes exposing the green body to a supercritical fluid.

7. The method as claimed in claim 1 , further comprising continuing to heat the white body in a further stage at a second pressure greater than the first pressure.

8. The method as claimed in claim 7 , wherein the maximum sintering temperature during the initial stage is in the range of from 850 to 1750° C.

9. The method as claimed in claim 7 , wherein the second pressure at the further stage is at least 50% greater than the first pressure at the initial stage.

Assignees

• Sandvik Intellectual Property

Inventors

• Sundstrom Johan
• Martensson Malin

Classifications

• B01J3/062 Primary

  characterised by the composition of the materials to be processed · CPC title

• B22F10/66

  by mechanical means · CPC title

• B22F10/12

  by photopolymerisation, e.g. stereolithography [SLA] or digital light processing [DLP] · CPC title

• B29C64/129 Primary

  characterised by the energy source therefor, e.g. by global irradiation combined with a mask · CPC title

• C04B2235/80

  Phases present in the sintered or melt-cast ceramic products other than the main phase · CPC title