DC high voltage relay and contact material for DC high-voltage relay

Patent metadata

Field	Value
Publication number	US-11309141-B2
Application number	US-201916980047-A
Country	US
Kind code	B2
Filing date	Mar 12, 2019
Priority date	Mar 16, 2018
Publication date	Apr 19, 2022
Grant date	Apr 19, 2022

Abstract

A DC high-voltage relay including at least one contact pair including a movable contact and a fixed contact, having a contact force and/or opening force of 100 gf or more, the DC high-voltage relay of 48 V or more. The movable contact and/or the fixed contact includes Ag oxide-based contact material. Metal components in the contact material includes at least one metal M essentially containing Sn, and a balance including Ag and inevitable impurity metals. The content of the metal M is 0.2% by mass or more and 8% by mass or less based on the total mass of all metal components in the contact material. The contact material has a material structure in which one or more oxides of the metal M are dispersed in a matrix including Ag or a Ag alloy. As metal M, In, Bi, Ni and Te can be added.

First claim

The invention claimed is:

1. A DC high-voltage relay, comprising:
a drive section which generates and transmits a drive force for moving a movable contact; and a contact section which performs switching of a DC high-voltage circuit, wherein
the drive section comprises an electromagnet or a coil which generates a drive force; a transmission unit which transmits the drive force to the contact section; and a biasing unit which biases the transmission unit for closing or opening a contact pair,
the contact section comprises at least one contact pair including a fixed contact and a movable contact which is moved by the transmission unit of the drive section; and at least one movable terminal bonded to the movable contact and at least one fixed terminal bonded to the fixed contact,
the DC high-voltage relay has a rated voltage of 48 V or more,
the contact pair has a contact force and/or opening force of 100 gf or more,
the movable contact and/or the fixed contact comprises a Ag oxide-based contact material,
metal components in the contact material comprise at least one metal M essentially containing Sn, and a balance being Ag and inevitable impurity metals,
the contact material has a content of the metal M being 0.2% by mass or more and 8% by mass or less based on a total mass of all metal components of, and
the contact material has a material structure in which one or more oxides of the metal M are dispersed in a matrix including Ag or a Ag alloy.

2. The DC high-voltage relay according to claim 1 , wherein
the contact material contains In as metal M,
the contact material has a content of In is 0.1% by mass or more and 5% by mass or less based on a total mass of all metal components, and
the contact material has a content of Sn being 0.1% by mass or more and 7.9% by mass or less based on the total mass of all metal components.

3. The DC high-voltage relay according to claim 1 , wherein
the contact material contains Bi as metal M,
a content of Bi is 0.05% by mass or more and 2% by mass or less based on the total mass of all metal components, and
the contact material has the content of Sn being 0.1% by mass or more and 7.95% by mass or less based on the total mass of all metal components.

4. The DC high-voltage relay according to claim 2 , wherein
the contact material contains Bi as metal M,
a content of Bi is 0.05% by mass or more and 2% by mass or less based on the total mass of all metal components, and
the contact material has the content of Sn being 0.1% by mass or more and 7.95% by mass or less based on the total mass of all metal components.

5. The DC high-voltage relay according to claim 1 , wherein
the contact material contains Te as metal M,
the contact material has a content of Te being 0.05% by mass or more and 2% by mass or less based on the total mass of all metal components, and
the contact material has the content of Sn being 0.1% by mass or more and 7.95% by mass or less based on the total mass of all metal components.

6. The DC high-voltage relay according to claim 2 , wherein
the contact material contains Te as metal M,
the contact material has a content of Te being 0.05% by mass or more and 2% by mass or less based on the total mass of all metal components, and
the contact material has the content of Sn being 0.1% by mass or more and 7.95% by mass or less based on the total mass of all metal components.

7. The DC high-voltage relay according to claim 2 , wherein
the contact material further contains Ni as metal M,
the contact material has a content of Ni being 0.05% by mass or more and 1% by mass or less based on the total mass of all metal components, and
the contact material has the content of Sn being 0.1% by mass or more and 7.85% by mass or less based on the total mass of all metal components.

8. The DC high-voltage relay according to claim 5 , wherein
the contact material further contains Ni as metal M,
the contact material has a content of Ni being 0.05% by mass or more and 1% by mass or less based on the total mass of all metal components, and
the contact material has the content of Sn being 0.1% by mass or more and 7.85% by mass or less based on the total mass of all metal components.

9. The DC high-voltage relay according to claim 6 , wherein
the contact material further contains Ni as metal M,
the contact material has a content of Ni being 0.05% by mass or more and 1% by mass or less based on the total mass of all metal components, and
the contact material has the content of Sn being 0.1% by mass or more and 7.85% by mass or less based on the total mass of all metal components.

10. The DC high-voltage relay according to claim 1 , wherein oxides dispersed in a matrix of the contact material has an average particle size of 0.01 μm or more and 0.3 μm or less.

11. The DC high-voltage relay according to claim 2 , wherein oxides dispersed in a matrix of the contact material has an average particle size of 0.01 μm or more and 0.3 μm or less.

12. The DC high-voltage relay according to claim 3 , wherein oxides dispersed in a matrix of the contact material has an average particle size of 0.01 μm or more and 0.3 μm or less.

13. The DC high-voltage relay according to claim 4 , wherein oxides dispersed in a matrix of the contact material has an average particle size of 0.01 μm or more and 0.3 μm or less.

14. The DC high-voltage relay according to claim 5 , wherein oxides dispersed in a matrix of the contact material has an average particle size of 0.01 μm or more and 0.3 μm or less.

15. The DC high-voltage relay according to claim 6 , wherein oxides dispersed in a matrix of the contact material has an average particle size of 0.01 μm or more and 0.3 μm or less.

16. The DC high-voltage relay according to claim 7 , wherein oxides dispersed in a matrix of the contact material has an average particle size of 0.01 μm or more and 0.3 μm or less.

17. The DC high-voltage relay according to claim 8 , wherein oxides dispersed in a matrix of the contact material has an average particle size of 0.01 μm or more and 0.3 μm or less.

18. The DC high-voltage relay according to claim 9 , wherein oxides dispersed in a matrix of the contact material has an average particle size of 0.01 μm or more and 0.3 μm or less.

Assignees

• Tanaka Precious Metal Ind

Inventors

• NISHIDE Sachihiro
• Nakamura Tetsuya
• Itakura Hiroyuki
• Yanagihara Nobuhito

Classifications

• H01H50/54

  Contact arrangements · CPC title

• H01H1/023

  having a noble metal as the basic material · CPC title

• C22C1/1005

  Pretreatment of the non-metallic additives (pretreatment of non-metallic fibres C22C47/02) · CPC title

• H01H50/58

  Driving arrangements structurally associated therewith; Mounting of driving arrangements on armature · CPC title

• H01H1/0237 Primary

  and containing oxides · CPC title