Method of forming circuit body and circuit body

Patent metadata

Field	Value
Publication number	US-11306398-B2
Application number	US-201916413925-A
Country	US
Kind code	B2
Filing date	May 16, 2019
Priority date	Nov 18, 2016
Publication date	Apr 19, 2022
Grant date	Apr 19, 2022

Abstract

A conductive portion of a circuit body is formed by performing spraying on a surface of a resin casing. For spraying of the conductive portion, a cold spray method in which metal powder and inert gas are sprayed to an object is used. A circuit component is mounted on the conductive portion. Each terminal portion of the conductive portion is provided with a connector for connection with an external circuit body. An insulating resin is laminated on a surface of the conductive portion. The circuit body is directly formed on the surface of the resin casing by a series of processes described above.

First claim

What is claimed is:

1. A circuit body, comprising:
a resin casing; and
a conductive portion which is formed on a surface of the resin casing, wherein
the conductive portion has
a first layer constituted of an aggregate of metal particles and embedded in the surface of the resin casing, and
a second layer constituted of an aggregate of metal particles and laminated on the first layer,
a density of the second layer is greater than that of the first layer, wherein
the conductive portion in which a particle diameter of the metal particles is 5 μm or more and 50 μm or less is formed in the resin casing mounted on a vehicle,
an insulating resin is laminated at least on the conductive portion, and
a circuit component is mounted on the conductive portion,
wherein the circuit component has
a connector unit to which a wire connected to an auxiliary device is connected, and
a control unit for controlling the auxiliary device.

2. The circuit body according to claim 1 , further comprising:
a terminal portion which is electrically connected to an external circuit body provided on an object to which the resin casing is assembled.

3. The circuit body according to claim 1 , further comprising:
a wire wired on the resin casing, wherein
one end of the wire is electrically connected to the circuit component.

4. The circuit body according to claim 3 , wherein
the wire is a signal circuit for transmitting a signal.

Assignees

• Yazaki Corp

Inventors

• Shimakura Keita
• Matsumoto Takuo

Classifications

• B60R16/0207

  Wire harnesses · CPC title

• H01B13/00

  Apparatus or processes specially adapted for manufacturing conductors or cables · CPC title

• H01B13/165

  by spraying · CPC title

• C23C24/04 Primary

  Impact or kinetic deposition of particles · CPC title

• H01B13/01209

  Details · CPC title