Polyimide film and method for producing same

US11306183B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11306183-B2
Application numberUS-201816480822-A
CountryUS
Kind codeB2
Filing dateFeb 5, 2018
Priority dateFeb 8, 2017
Publication dateApr 19, 2022
Grant dateApr 19, 2022

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

One embodiment may provide a method for producing a polyimide film, the method comprising the steps of: polishing the surface of a casting body; producing a gel sheet by casting a precursor on the polished surface of the casting body, and drying same; and producing a polyimide film by heat-treating the gel sheet, wherein the roughness of the polished surface of the casting body is 0.1 nm to 160 nm, and when the area of the casting body onto which the precursor is casted is partitioned by 1 cm×1 cm, the area corresponding to a defect reduction region is at least 90%, and the polyimide film has a yellowness of at most 3, a haze of at most 1%, a permeability of at least 88%, a modulus of at least 5.0 GPa and a surface hardness of at least HB.

First claim

Opening claim text (preview).

The invention claimed is: 1. A polyimide film, which has a yellow index of 3 or less, a haze of 1% or less, a transmittance of 88% or more, a modulus of 5.0 GPa or more, and a surface hardness of HB or higher, and which comprises a first surface having a surface roughness of 0.1 nm to 150 nm and a second surface opposite to the first surface and having a surface roughness of 0.1 nm to 40 nm, wherein when the first surface is divided into 1 cm×1 cm, the area falling under a defect free region is 90% or more, the defect free region referring to a region that satisfies the conditions that the numbers of a first protrusion, a second protrusion, a third protrusion, and a fourth protrusion, which have a width of 0.3 μm to 3 μm, a height of 0.5 μm to 5 μm, and a length of 2 μm to less than 3 μm, 3 μm to less than 5 μm, 5 μm to less than 10 μm, and 10 μm or more, respectively, are 10 or less, 5 or less, 3 or less, and 0, respectively, in the divided area of 1 cm×1 cm, and wherein the polyimide film is prepared from a polyamide-imide polymer formed by polymerizing an aromatic diamine compound, an aromatic dianhydride compound, and a dicarbonyl compound, wherein the aromatic diamine compound comprises 2,2′-bis(trifluoromethyl)-4,4′-diaminobiphenyl (TFDB), the aromatic dianhydride compound comprises 2,2′-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride (6-FDA), and the dicarbonyl compound comprises terephthaloyl chloride (TPC), 1,1′-biphenyl-4,4′-dicarbonyl dichloride (BPDC), or a combination thereof. 2. A cover window, which comprises the polyimide film of claim 1 . 3. The cover window of claim 2 , which further comprises a hard coating layer formed on the first surface. 4. A display device comprising: a display panel; and the cover window of claim 2 disposed on the display panel.

Assignees

Inventors

Classifications

  • C08G73/14Primary

    Polyamide-imides · CPC title

  • Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

  • Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound · CPC title

  • used for films · CPC title

  • Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00 · CPC title

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What does patent US11306183B2 cover?
One embodiment may provide a method for producing a polyimide film, the method comprising the steps of: polishing the surface of a casting body; producing a gel sheet by casting a precursor on the polished surface of the casting body, and drying same; and producing a polyimide film by heat-treating the gel sheet, wherein the roughness of the polished surface of the casting body is 0.1 nm to 160…
Who is the assignee on this patent?
Skc Co Ltd
What technology area does this patent fall under?
Primary CPC classification C08G73/14. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 19 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).