Multi-axial position sensors printed on a folded flexible circuit board

Patent metadata

Field	Value
Publication number	US-11304642-B2
Application number	US-201715433072-A
Country	US
Kind code	B2
Filing date	Feb 15, 2017
Priority date	Feb 15, 2017
Publication date	Apr 19, 2022
Grant date	Apr 19, 2022

Abstract

A position sensor includes a flexible substrate formed into a three-dimensional (3D) shape. At least first and second field-sensing coils are formed in first and second respective layers of the flexible substrate, such that in the 3D shape the first and second field-sensing coils have first and second respective axes that are not parallel to one another.

First claim

The invention claimed is:

1. A position sensor, comprising:
(a) a flexible substrate, which is formed into a three-dimensional (3D) shape defining a central longitudinal axis;
(b) a first field-sensing coil formed in a first layer of the flexible substrate, the first field-sensing coil defining a closed-loop shape about a first axis such that the first field-sensing coil fully encircles the first axis, the first axis being orthogonal to the central longitudinal axis, the first field-sensing coil being located at a first longitudinal position along the central longitudinal axis;
(c) a second field-sensing coil formed in a second layer of the flexible substrate, the second field-sensing coil defining a closed-loop shape about a second axis such that the second field-sensing coil fully encircles the second axis, the second axis being coaxial with the central longitudinal axis such that the second field-sensing coil fully encircles the central longitudinal axis, the second field-sensing coil being located at the first longitudinal position along the central longitudinal axis such that the second field-sensing coil overlappingly wraps around the first field-sensing coil at the first longitudinal position along the central longitudinal axis;
the first and second field-sensing coils being configured to sense components of a magnetic field oriented about the first and second respective axes.

2. The position sensor according to claim 1 , the flexible substrate comprising a flexible circuit board.

3. The position sensor according to claim 1 , the 3D shape comprising a cylindrical shape.

4. The position sensor according to claim 1 , further comprising a third field-sensing coil defining a closed-loop shape about a third axis, the third axis being orthogonal to the central longitudinal axis, the third field-sensing coil being located at the first longitudinal position along the central longitudinal axis such that the first-field sensing coil overlappingly wraps around the third field-sensing coil at the first longitudinal position along the central longitudinal axis, the third field-sensing coil being configured to sense the magnetic field about the third axis.

5. The position sensor according to claim 4 , the third field-sensing coil being formed on a third layer of the flexible substrate.

6. The position sensor according to claim 1 , the first and second layers being electrically isolated from one another by a dielectric layer.

7. The position sensor according to claim 1 , further comprising one or more electrodes formed on a surface of the flexible substrate.

8. The position sensor according to claim 1 , the first and second field-sensing coils being configured generate corresponding electrical signals indicative of the sensed components of the magnetic field.

9. The position sensor according to claim 8 , further comprising a ferromagnetic element coupled to or adjacent to the flexible substrate, the ferromagnetic element being configured to amplify at least one of the sensed components.

10. A method for producing a position sensor, the method comprising:
(a) forming at least first and second field-sensing coils in first and second respective layers of a flexible substrate in a flat form, the first field-sensing coil being disposed in a stripe shape extending from one end of the flexible substrate in the flat form to another end of the flexible substrate in the flat form, the second field-sensing coil being disposed in a closed-loop shape and being embedded within the flexible substrate, the first and second field-sensing coils overlapping each other while the flexible substrate is in the flat form such that the stripe shape overlaps the closed-loop shape while the flexible substrate is in the flat form; and
(b) forming the flexible substrate into the 3D shape, the 3D shape extending longitudinally along a first axis, the first field-sensing coil being positioned about the first axis in the 3D shape, the second field-sensing coil being positioned about a second axis in the 3D shape, the first and second axis being orthogonal to each other in the 3D shape, the first and second field-sensing coils in the 3D shape being configured to sense components of a magnetic field oriented about the first and second respective axes.

11. The method according to claim 10 , the flexible substrate comprising a flexible circuit board.

12. The method according to claim 10 , forming the substrate into the 3D shape including rolling the substrate into a cylindrical shape.

13. The method according to claim 10 , further comprising forming a third field-sensing coil such that, in the 3D shape, the third field-sensing sensing coil is configured to sense components of the magnetic field oriented about a third axis that is not parallel to any of the first and second axes.

14. The method according to claim 13 , forming the third field-sensing coil including forming the third field-sensing coil on a third layer of the flexible substrate.

15. The method according to claim 10 , forming the at least first and second field-sensing coils including electrically isolating the first and second field-sensing coils from one another.

16. The method according to claim 10 , forming the flexible substrate into the 3D shape including arranging the first and second axes orthogonally to one another.

17. The method according to claim 10 , further comprising forming one or more electrodes on a surface of the flexible substrate.

18. A position sensor, comprising:
(a) a flexible substrate formed into a cylindrical shape, the flexible substrate defining an inward-facing surface and an outward-facing surface, the cylindrical shape defining a central longitudinal axis;
(b) a first field-sensing coil formed on the outward-facing surface of the flexible substrate, the first field-sensing coil forming a closed-loop shape extending about a first axis centered within the first field-sensing coil, the first axis being orthogonal to the central longitudinal axis, the first field-sensing coil being located at a first longitudinal position along the central longitudinal axis;
(c) a second field-sensing coil embedded internally within the flexible substrate, the second field-sensing coil forming a closed-loop shape extending about a second axis centered within the second field-sensing coil, the second axis being orthogonal to the central longitudinal axis, the second field-sensing coil being located at the first longitudinal position along the central longitudinal axis, a portion of the second field-sensing coil angularly overlapping with a portion of the first field-sensing coil about the central longitudinal axis; and
(d) a third field-sensing coil formed on the inward-facing surface of the flexible substrate, the third field-sensing coil being located at the first longitudinal position along the central longitudinal axis, the third field-sensing coil forming a closed-loop shape extending about the central longitudinal axis such that the third field-sensing coil fully encircles the central longitudinal axis, the third field-sensing coil further overlappingly wrapping around the first and second field-sensing coils;
each field-sensing coil separated by one or more dielectric layers and oriented about respective axes that are not parallel to one another, each field-sensing coil configured to sense a respective component of a magnetic field oriented about each respective axis.

19. The method of claim 13 , the third field-sensing sensing coil overlapping the first and second field-sensing coils while the flexible s

Assignees

• Biosense Webster Israel Ltd

Inventors

• Govari Assaf
• Bar-Tal Meir
• Reuveni Avi

Classifications

• A61B5/6851

  Guide wires · CPC title

• A61B2562/125

  characterised by the manufacture of electrodes · CPC title

• H01F2017/006

  flexible printed inductors · CPC title

• A61B2562/166

  the sensor is mounted on a specially adapted printed circuit board · CPC title

• A61B2562/04

  Arrangements of multiple sensors of the same type · CPC title