Electromagnetic radiators with ground planes having discontinuities

Patent metadata

Field	Value
Publication number	US-11303039-B2
Application number	US-202016885644-A
Country	US
Kind code	B2
Filing date	May 28, 2020
Priority date	May 28, 2020
Publication date	Apr 12, 2022
Grant date	Apr 12, 2022

Abstract

An electromagnetic radiator with ground plane having discontinuities is disclosed. A disclosed example antenna includes an antenna element, including a first conductive material adjacent to a first dielectric material, to transmit a signal. The disclosed example antenna further includes a microstrip feed network, including a second conductive material adjacent to a second dielectric material, to transmit power to the antenna element, the antenna element proximity coupled to the microstrip feed network. The disclosed example antenna further includes a ground plane, including a third conductive material adjacent to a third dielectric material, to provide a signal return path, the ground plane including gaps regularly spaced in the third conductive material.

First claim

What is claimed is:

1. An antenna comprising:
antenna elements, each including a first conductive material adjacent to a first dielectric material, to transmit a signal;
microstrip feeds, each including a second conductive material adjacent to a second dielectric material, to transmit power to the antenna elements, each antenna element proximity coupled to a respective one of the microstrip feeds; and
a ground plane, including a third conductive material adjacent to a third dielectric material, to provide a signal return path, the ground plane including gaps regularly spaced in the third conductive material, the entirety of each gap spaced away from peripheral edges of the ground plane and each of the gaps corresponding to a respective one of the antenna elements and structured to affect operation of the respective antenna element.

2. The antenna of claim 1 , wherein the antenna elements are on an outer surface of the antenna, the antenna elements electrically coupled to the microstrip feeds.

3. The antenna of claim 1 , wherein the microstrip feeds are electrically coupled to the ground plane, and wherein the ground plane is on a bottom surface of the antenna.

4. The antenna of claim 1 , wherein the first conductive material, the second conductive material, and the third conductive material include copper.

5. The antenna of claim 1 , wherein the antenna elements and the microstrip feeds are separated by a first spacer layer, the first spacer layer including a fourth dielectric material.

6. The antenna of claim 1 , wherein the microstrip feeds and the ground plane are separated by a second spacer layer, the second spacer layer including a fifth dielectric material.

7. The antenna of claim 1 , wherein each of the gaps is immediately adjacent to the respective ones of the antenna elements.

8. The antenna of claim 1 , wherein each of the gaps is spaced within edges of the respective ones of the antenna elements.

9. The antenna of claim 1 , wherein each of the gaps is orientated in a same direction as the respective ones of the antenna elements.

10. The antenna of claim 9 , wherein each of the gaps is orientated in a diagonal direction relative to the peripheral edges.

11. An apparatus to form an antenna, the apparatus comprising:
a first layer to transit a signal, the first layer including a first conductive material on a surface of a first dielectric;
a second layer to transmit power to the first layer, the second layer including a second conductive material on a surface of a second dielectric material; and
a third layer to provide a signal return path, the third layer including a third conductive material on a surface of a third dielectric material, the third layer including regularly-spaced gaps in the third conductive material on the surface of the third dielectric material, the entirety of each gap spaced away from peripheral edges of the third layer and each of the gaps corresponding to the first layer and structured to affect operation of the first layer.

12. The apparatus of claim 11 , wherein the first layer includes antenna elements.

13. The apparatus of claim 11 , wherein the second layer includes microstrip feeds.

14. The apparatus of claim 11 , wherein the third layer includes a ground plane.

15. The apparatus of claim 11 , wherein the first conductive material, the second conductive material, and the third conductive material include copper.

16. The apparatus of claim 11 , wherein the first layer and the second layer are separated by a fourth layer, the fourth layer including a fourth dielectric material.

17. The apparatus of claim 16 , wherein the second layer and the third layer are separated by a fifth layer, the fifth layer including a fifth dielectric material.

18. The apparatus of claim 17 , wherein the first layer, the second layer, the third layer, the fourth layer, and the fifth layer are joined using an adhesive material.

19. The apparatus of claim 17 , wherein the first layer, the second layer, the third layer, the fourth layer, and the fifth layer are joined using mechanical fasteners.

20. A method of forming an antenna, the method comprising:
disposing first conductive elements on a surface of a first dielectric material to form a first layer;
disposing second conductive elements on a surface of a second dielectric material to form a second layer;
disposing a third conductive element on a surface of a third dielectric material to form a third layer, the third conductive element being a ground plane;
disposing regularly-spaced gaps in the third conductive element, the entirety of each gap spaced away from peripheral edges of the ground plane and each of the gaps corresponding to a respective one of the first conductive elements and structured to affect operation of the respective one of the first conductive elements; and
laminating the first layer, the second layer, the third layer, a fourth layer of a fourth dielectric material, and a fifth layer of a fifth dielectric material to form the antenna, wherein the fourth layer is between the first layer and the second layer, and wherein the fifth layer is between the second layer and the third layer.

21. The method of claim 20 , wherein the first layer includes antenna elements to transmit a signal.

22. The method of claim 20 , wherein the second layer includes microstrip feeds to transmit power to antenna elements.

23. The method of claim 20 , wherein each of the surface of the first dielectric material, the surface of the second dielectric material, and the surface of the third dielectric material faces a same direction.

24. The method of claim 20 , wherein the first conductive elements, the second conductive elements, and the third conductive element include copper.

Assignees

• Boeing Co

Inventors

• Rogers John E

Classifications

• H01Q21/0075

  Stripline fed arrays (H01Q21/065 takes precedence) · CPC title

• H01Q9/0457

  electromagnetically coupled to the feed line · CPC title

• H01Q1/48

  Earthing means; Earth screens; Counterpoises · CPC title

• H01Q21/065 Primary

  Patch antenna array · CPC title

• H01Q1/287 Primary

  integrated in a wing or a stabiliser · CPC title