Flexible display substrate and manufacturing method therefor, and display apparatus

Patent metadata

Field	Value
Publication number	US-11302879-B2
Application number	US-201816620559-A
Country	US
Kind code	B2
Filing date	Oct 12, 2018
Priority date	Oct 26, 2017
Publication date	Apr 12, 2022
Grant date	Apr 12, 2022

Abstract

A flexible display substrate and a manufacturing method therefor, and a display apparatus, for relieving the problem that it is difficult to bend the flexible display substrate in a bending region to damage an upper circuit. The flexible display substrate comprises a back film, a first flexible base substrate located above the back film, and a second flexible base substrate located on one side of the first flexible base substrate facing away from the back film. The flexible display substrate has a bending region. An auxiliary layer is further provided between the first flexible base substrate and the second flexible base substrate. At least part of the auxiliary layer in the bending region can be decomposed in a preset condition, wherein the other film layers except the auxiliary layer are maintained at the original status in the preset condition.

First claim

The invention claimed is:

1. A flexible display substrate having a display area and a bezel area, wherein a bending region is provided in the bezel area, and the flexible display substrate comprises:
a back film;
a first flexible base substrate, disposed on the back film;
a second flexible base substrate, disposed on one side of the first flexible base substrate facing away from the back film; and
an auxiliary layer, disposed between the first flexible base substrate and the second flexible base substrate;
wherein when light with a preset wavelength is irradiating at the bending region, at least part of the auxiliary layer in the bending region is decomposed; wherein:
when part of the auxiliary layer in the bending area is decomposed, a first gap is formed between the first flexible base substrate and the auxiliary layer; and
when all the auxiliary layer in the bending area is decomposed, a second gap is formed between the first flexible base substrate and the second flexible base substrate;

after the first gap or the second gap is formed, removing the back film and the first flexible base substrate in the bending region.

2. The flexible display substrate of claim 1 , wherein the auxiliary layer is a non-crystalline silicon layer.

3. The flexible display substrate of claim 1 , wherein the light with the preset wavelength is a laser with a wavelength ranging from 500 nm to 560 nm.

4. The flexible display substrate of claim 1 , wherein the flexible display substrate further comprises a stress balancing layer disposed between the auxiliary layer and the second flexible base substrate.

5. The flexible display substrate of claim 4 , wherein the stress balancing layer is a silicon oxide film layer or a silicon nitride film layer.

6. The flexible display substrate of claim 1 , wherein the flexible display substrate has a groove structure in the bending region, and the groove structure extends to the auxiliary layer from the back film.

7. A flexible display apparatus, wherein the flexible display apparatus comprises the flexible display substrate of claim 1 .

8. A manufacturing method for the flexible display substrate of claim 1 , wherein the manufacturing method comprises:
forming the auxiliary layer on the first flexible base substrate;
forming the second flexible base substrate on one side of the auxiliary layer facing away from the first flexible base substrate; and
forming the back film on one side of the first flexible base substrate facing away from the auxiliary layer.

9. The manufacturing method of claim 8 , further comprising:
decomposing at least part of the auxiliary layer in the bending region;
wherein the step of decomposing at least part of the auxiliary layer in the bending region specifically comprises: irradiating the auxiliary layer in the bending region by light with a preset wavelength.

10. The manufacturing method of claim 9 , wherein the step of forming an auxiliary layer on a first flexible base substrate specifically comprises: forming a non-crystalline silicon layer on the first flexible base substrate.

11. The manufacturing method of claim 10 , wherein the step of decomposing at least part of the auxiliary layer in the bending region specifically comprises: irradiating the non-crystalline silicon layer in the bending region with a laser with a wavelength ranging from 500 nm to 560 nm.

12. The manufacturing method of claim 8 , further comprising:
removing a back film and a first flexible base substrate in the bending region, after decomposing at least part of the auxiliary layer in the bending region;
wherein the step of removing the back film and the first flexible base substrate in the bending region specifically comprises: performing laser cutting along an edge of the gap formed by decomposing the auxiliary layer to cut off the back film and the first flexible base substrate in the bending region.

13. The manufacturing method of claim 8 , wherein before the step of forming a second flexible base substrate, the manufacturing method further comprises: forming a stress balancing layer on one side of the auxiliary layer facing away from the first flexible base substrate.

Assignees

• Boe Technology Group Co Ltd

Inventors

• Liu Lu
• Tsai Pao Ming
• Cai Peng
• Li Hong
• Bu Dejun
• Li Jianwei
• Chen Liqiang

Classifications

• H10K71/00

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

• Y02E10/549

  Organic PV cells · CPC title

• Y02P70/50

  Manufacturing or production processes characterised by the final manufactured product · CPC title

• H01L2251/5338

  Electricity · mapped topic

• H01L51/56

  Electricity · mapped topic