Flexible temperature-flow velocity dual-parameter sensors

US11300433B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11300433-B2
Application numberUS-201816142143-A
CountryUS
Kind codeB2
Filing dateSep 26, 2018
Priority dateDec 29, 2017
Publication dateApr 12, 2022
Grant dateApr 12, 2022

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

The present description includes a flexible sensor including a flexible substrate, a thermoelectric substrate formed on the flexible substrate, a first metal electrode that is formed on the flexible substrate and is connected to one end of the thermoelectric body, and a second metal electrode that is formed on the flexible substrate and is connected to another end of the thermoelectric body but spaced apart from the first metal electrode. The flexible sensor simply measures the temperature and the flow velocity with high accuracy. The change in temperature and flow velocity may be measured in real time. In addition, the flexible sensor may measure the temperature and the flow velocity of a fluid even when attached to a curved surface, and self-development is possible by the measurement.

First claim

Opening claim text (preview).

What is claimed is: 1. A flexible sensor comprising: a flexible substrate; a thermoelectric body formed on the flexible substrate; a first metal electrode that is formed on the flexible substrate and is connected to one end of the thermoelectric body; and a second metal electrode that is formed on the flexible substrate and is connected to another end of the thermoelectric body but spaced apart from the first metal electrode, wherein the thermoelectric body comprises a first connection point connected to the first metal electrode at one point, and a second connection point and a third connection point connected to the second metal electrode and spaced apart from each other, wherein the thermoelectric body branches at a split point spaced apart from the first connection point, and is connected to the second connection point and the third connection point, and wherein a length of a branch of the thermoelectric body from the split point to the second connection point and a length of a branch of the thermoelectric body from the split point to the third connection point are different from each other. 2. The flexible sensor of claim 1 , further comprising a protection layer formed on the first metal electrode, the second metal electrode, and the thermoelectric body. 3. The flexible sensor of claim 2 , wherein a bending structure of the branch of the thermoelectric body from the split point to the second connection point and a bending structure of the branch of the thermoelectric body from the split point to the third connection point are different from each other. 4. The flexible sensor of claim 2 , wherein a thermoelectric element comprised in the thermoelectric body comprises at least one selected from the group consisting of bismuth chalcogenide compounds and antimony chalcogenide compounds. 5. The flexible sensor of claim 4 , wherein thickness of the thermoelectric body is in a range of about 50 nm to about 1 μm. 6. The flexible sensor of claim 5 , wherein the protection layer comprises at least one selected from the group of poly methyl methacrylate, polystyrene, phenolic polymer, acrylic polymer, imide polymer such as polyimide, aryl ether-based polymer, amide-based polymer, fluorine-based polymer, p-xylylene-based polymer, vinyl alcohol polymer, parylene, and a compound comprising at least one thereof. 7. The flexible sensor of claim 6 , wherein a thickness of the protection layer is in a range of about 1 μm to about 50 μm. 8. A flexible sensor array comprising a plurality of the flexible sensors of claim 7 , wherein each thermoelectric body of the plurality of flexible sensors is partially or entirely exposed to a fluid to be measured, and the plurality of the flexible sensors are connected to each other in parallel. 9. The flexible sensor of claim 1 , wherein a bending structure of the branch of the thermoelectric body from the split point to the second connection point and a bending structure of the branch of the thermoelectric body from the split point to the third connection point are different from each other. 10. The flexible sensor of claim 1 , wherein a thermoelectric element comprised in the thermoelectric body comprises at least one selected from the group consisting of bismuth chalcogenide compounds and antimony chalcogenide compounds. 11. The flexible sensor of claim 10 , wherein thickness of the thermoelectric body is in a range of about 50 nm to about 1 μm.

Assignees

Inventors

Classifications

  • G01F1/6888Primary

    Thermoelectric elements, e.g. thermocouples, thermopiles · CPC title

  • for measuring surface temperatures · CPC title

  • for measuring temperature of moving fluids or granular materials capable of flow · CPC title

  • using electrical means · CPC title

  • by measuring variation of an electric variable directly affected by the flow, e.g. by using dynamo-electric effect · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11300433B2 cover?
The present description includes a flexible sensor including a flexible substrate, a thermoelectric substrate formed on the flexible substrate, a first metal electrode that is formed on the flexible substrate and is connected to one end of the thermoelectric body, and a second metal electrode that is formed on the flexible substrate and is connected to another end of the thermoelectric body but…
Who is the assignee on this patent?
Univ Korea Res & Bus Found
What technology area does this patent fall under?
Primary CPC classification G01F1/6888. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Apr 12 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).