Highly-dielectric, elastic structure and a touch sensor including the same

Patent metadata

Field	Value
Publication number	US-11299655-B2
Application number	US-201916460195-A
Country	US
Kind code	B2
Filing date	Jul 2, 2019
Priority date	Dec 14, 2018
Publication date	Apr 12, 2022
Grant date	Apr 12, 2022

Abstract

A highly-dielectric, elastic structure includes an elastic body that is highly-dielectric and includes a polymer matrix that including 1000 pbw of a polydimethylsiloxane (PDMS) base and 100 pbw of a PDMS curing agent, and has a tensile strength of 0.1 to 10 MPa; and 22.4 pbw of carbon black that is surface-treated with octadecyltrimethoxysilane (ODTMS) in an amount of at least 0.707 mmol per 22.4 pbw of the carbon black, and that is dispersed in the polymer matrix and cured; and an adhesive electrode that is stretchable, that is disposed on the elastic body, and that includes a polymer adhesive including a 500 pbw of a thermosetting silicone-based polymer adhesive including a curable polymer and a curing agent; and a conductive filler comprising 500 pbw of silver particles and 4000 pbw of a carbonaceous material that is a multi-walled carbon nanotube that are dispersed in the polymer adhesive and cured.

First claim

What is claimed is:

1. A highly-dielectric, elastic structure, comprising:
an elastic body that is highly-dielectric and comprises:
a polymer matrix that comprises 1000 parts by weight of a polydimethylsiloxane (PDMS) base and 100 parts by weight mg of a PDMS curing agent, and has a tensile strength of 0.1 to 10 MPa; and 22.4 parts by weight of carbon black that is a dielectric material and a conductive filler, that is surface-treated with octadecyltrimethoxysilane (ODTMS) in an amount of at least 0.707 mmol per 22.4 parts by weight of the carbon black, and that is dispersed in the polymer matrix and cured; and an adhesive electrode that is adhesive and stretchable, that is disposed on the body, and that comprises:
a polymer adhesive comprising a 500 parts by weight of a thermosetting silicone-based polymer adhesive including a curable polymer and a curing agent; and
a conductive filler comprising 1500 parts by weight of silver particles and 4000 parts by weight of a carbonaceous material that is a multi-walled carbon nanotube that are dispersed in the polymer adhesive and cured.

2. The highly-dielectric, elastic structure according to claim 1 , wherein the polymer matrix of the elastic body has a dielectric constant of 1-10.

3. The highly-dielectric, elastic structure according to claim 1 , wherein the polymer adhesive of the adhesive electrode comprises 5-20 parts by weight of the curing agent based on 100 parts by weight of the curable polymer.

4. The highly-dielectric, elastic structure according to claim 1 , wherein the polymer adhesive of the adhesive electrode has a bulk tensile strength of 0.1-10 MPa after curing.

5. The highly-dielectric, elastic structure according to claim 1 , wherein the polymer adhesive of the adhesive electrode has a volume shrinkage ratio of 1-10% after curing.

6. The highly-dielectric, elastic structure according to claim 1 , wherein the polymer adhesive comprises 10-120 parts by weight of the curing agent based on 100 parts by weight of the curable polymer.

7. The highly-dielectric, elastic structure according to claim 1 , wherein the metal of the conductive filler is a mixture of metal particles having a diameter of 100-200 nm, 1-4 μm, or 5-10 μm.

8. The highly-dielectric, elastic structure according to claim 1 , wherein the carbonaceous material of the conductive filler is a multi-walled carbon nanotube having a diameter of 15-40 nm and a length of 10-50 μm.

9. The highly-dielectric, elastic structure according to claim 1 , wherein the elastic body and the adhesive electrode are connected to each other to form a single structure.

10. A touch sensor comprising the highly-dielectric, elastic structure according to claim 1 .

11. The touch sensor according to claim 10 , wherein the touch sensor is a capacitance-type force sensor.

Assignees

• Korea Inst Sci & Tech

Inventors

• Kim Heesuk
• Ko Youngpyo
• Park Min
• Lee Sang-Soo
• Son Jeong Gon
• Park Jong Hyuk
• Chung Seungjun
• Kim Tae Ann

Classifications

• C09J7/30 Primary

  characterised by the adhesive composition · CPC title

• G01D5/24

  by varying capacitance · CPC title

• C09J9/02 Primary

  Electrically-conducting adhesives · CPC title

• C08K5/0025

  Crosslinking or vulcanising agents; including accelerators · CPC title

• H01B5/16 Primary

  comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber (H01B1/14, H01B1/20 take precedence; insulating bodies with conductive admixtures H01B17/64; conductive paints C09D5/24) · CPC title