Polyamide resin composition

US11299603B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11299603-B2
Application numberUS-201716342784-A
CountryUS
Kind codeB2
Filing dateOct 17, 2017
Priority dateOct 19, 2016
Publication dateApr 12, 2022
Grant dateApr 12, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A polyamide resin composition contains a polyamide resin and an inorganic filler. 90 mass % or more of polyamide 66 is contained relative to 100 mass % of the polyamide resin. The inorganic filler content is ≥30 mass % relative to 100 mass % of the composition. The composition has a solidifying point of ≥210° C. The composition has a spiral flow value of ≥60 cm when the inorganic filler content is ≥30 mass % and <40 mass %, ≥40 cm when the content is ≥40 mass % and ≤50 mass %, and ≥20 cm when the content is >50 mass % and ≤70 mass %. The composition has a strain of ≤3.8% in a 1000-hour tensile creep test under 120° C. and 60 MPa. The composition has a formic acid relative viscosity (VR) of 30<VR<40.

First claim

Opening claim text (preview).

The invention claimed is: 1. A polyamide resin composition comprising (A) a polyamide resin and (B) an inorganic filler, wherein: the (A) polyamide resin comprises polyamide 66 in an amount of 90 mass or more relative to 100 mass % of the polyamide resin and a liquidity improver in an amount of from 0.1 to 10 mass % relative to 100 mass % of the polyamide resin; the (B) inorganic filler is contained in an amount of 30 mass % or more relative to 100 mass % of the polyamide resin composition; the polyamide resin composition has a solidifying point of 210° C. or more; the polyamide resin composition has a spiral flow value in a flat spiral mold having a cavity width of 10 mm and a thickness of 2 mm, the spiral flow value being 60 cm or more under the conditions of a set temperature of 285° C., a mold temperature of 80° C., and an injection pressure of 70 MPa when the content of the (B) inorganic filler is 30 mass % or more and less than 40 mass %, being 40 cm or more under the conditions of a set temperature of 285° C., a mold temperature of 80° C., and an injection pressure of 70 MPa when the content of the (B) inorganic filler is 40 mass % or more and not greater than 50 mass %, and being 20 cm or more under the conditions of a set temperature 295° C., a mold temperature of 80° C., and an injection pressure of 70 MPa when the content of the (B) inorganic filler is greater than 50 mass % and not greater than 70 mass %; the polyamide resin composition has a strain of 3.8% or less measured in a 1000-hour tensile creep test under the conditions of 120° C. and 60 MPa, and the polyamide resin composition has a formic acid relative viscosity VR in the range of 30<VR<40. 2. The polyamide resin composition as claimed in claim 1 , wherein the polyamide resin composition also has a tensile strength that is measured according to ISO 527, the tensile strength being greater than 195 MPa when the content of the (B) inorganic filler is 30 mass % or more and less than 40 mass %, being greater than 240 MPa when the content of the (B) inorganic filler is 40 mass % or more and not greater than 50 mass %, and being greater than 250 MPa when the content of the (B) inorganic filler is greater than 50 mass % and not greater than 70 mass %. 3. The polyamide resin composition as claimed in claim 1 , wherein the (B) inorganic filler comprises glass fiber. 4. The polyamide resin composition as claimed in claim 3 , wherein the glass fiber has an average minor diameter of 12 μm or less. 5. The polyamide resin composition as claimed in claim 3 , wherein the glass fiber comprises an acid copolymer as a binder. 6. The polyamide resin composition as claimed in claim 1 , wherein the (B) inorganic filler is surface-treated with an amino silane. 7. A cylinder head cover produced by molding the polyamide resin composition as claimed in claim 1 and having an average product thickness of 2 mm or less. 8. An oil pan produced by molding the polyimide resin composition as claimed in claim 1 . 9. An engine mount or a torque rod produced by molding the polyamide resin composition as claimed in claim 1 . 10. A head rest component produced by molding the polyamide resin composition as claimed in claim 1 . 11. A resonator produced by molding the polyamide resin composition as claimed in claim 1 . 12. A timing chain component or a timing belt component produced by molding the polyamide resin composition as claimed in claim 1 . 13. The polyamide resin composition as claimed in claim 2 , wherein the (B) inorganic filler comprises glass fiber. 14. The polyamide resin composition as claimed in claim wherein the (B) inorganic tiller is surface-treated with an amino silane. 15. The polyamide resin composition as claimed in claim 13 , wherein the glass fiber has an average minor diameter of 12 μm or less. 16. The polyamide resin composition as claimed in claim 13 , wherein the glass fiber comprises an acid copolymer as a binder.

Assignees

Inventors

Classifications

  • C08K7/14Primary

    Glass · CPC title

  • with rubber springs {(grommet- or bushing-type resilient mountings F16F1/3732, F16F1/38); with springs made of rubber and metal (arrangement of internal-combustion or jet-propulsion units B60K5/12; mounting of propulsion plants on vessels B63H21/30; mounting of vehicle drivers' cabs B62D33/0604)} · CPC title

  • Intake silencers {; Sound modulation, transmission or amplification (intake silencers also used as exhaust silencer F01N13/007; filters for compressors F04B39/16)} · CPC title

  • Manufacturing; Treatments · CPC title

  • Glass · CPC title

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What does patent US11299603B2 cover?
A polyamide resin composition contains a polyamide resin and an inorganic filler. 90 mass % or more of polyamide 66 is contained relative to 100 mass % of the polyamide resin. The inorganic filler content is ≥30 mass % relative to 100 mass % of the composition. The composition has a solidifying point of ≥210° C. The composition has a spiral flow value of ≥60 cm when the inorganic filler content…
Who is the assignee on this patent?
Asahi Chemical Ind
What technology area does this patent fall under?
Primary CPC classification C08K7/14. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 12 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).