Refrigeration cycle device

US11299014B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11299014-B2
Application numberUS-202016808179-A
CountryUS
Kind codeB2
Filing dateMar 3, 2020
Priority dateSep 21, 2017
Publication dateApr 12, 2022
Grant dateApr 12, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A refrigeration cycle device includes a high-temperature side heat exchanger, an expansion valve for decompressing the refrigerant flowing out of the high-temperature side heat exchanger, a low-temperature side heat exchanger that exchanges heat between the refrigerant decompressed by the expansion valve and coolant, a high-temperature coolant circuit in which the coolant circulates to the high-temperature side heat exchanger, a low-temperature coolant circuit in which the coolant circulates to the low-temperature side heat exchanger, a battery and a low-temperature side radiator configured to exchange heat with the coolant in the low-temperature coolant circuit; and a heat transfer portion configured to transfer heat from the high-temperature coolant circuit to the low-temperature coolant circuit such that the coolant dissipates heat in the battery and the low-temperature side radiator.

First claim

Opening claim text (preview).

What is claimed is: 1. A refrigeration cycle device comprising: a compressor configured to draw and discharge a refrigerant; a high-temperature side heat exchanger configured to exchange heat between the refrigerant discharged from the compressor and a heat medium; a decompression valve configured to decompress the refrigerant flowing out of the high-temperature side heat exchanger; a low-temperature side heat exchanger configured to exchange heat between the refrigerant decompressed by the decompression valve and the heat medium; a high-temperature side heat medium circuit in which the heat medium circulates to the high-temperature side heat exchanger; a low-temperature side heat medium circuit in which the heat medium circulates to the low-temperature side heat exchanger; a heat exchanging portion located in the low-temperature side heat medium circuit to exchange heat with the heat medium; and a heat transfer portion configured to transfer heat from the high-temperature side heat medium circuit to the low-temperature side heat medium circuit and to cause the heat medium to dissipate heat in the heat exchanging portion. 2. The refrigeration cycle device according to claim 1 , wherein the heat transfer portion includes a communication flow passage configured to communicate the high-temperature side heat medium circuit with the low-temperature side heat medium circuit such that the heat medium circulates between the high-temperature side heat medium circuit and the low-temperature side heat medium circuit, and the communication flow passage is configured such that at least a part of the heat medium flowing from the high-temperature side heat medium circuit into the low-temperature side heat medium circuit via the communication flow passage flows through the heat exchanging portion without passing through the low-temperature side heat exchanger. 3. The refrigeration cycle device according to claim 2 , further comprising: an opening/closing valve configured to open or close the communication flow passage; and a controller configured to control the opening/closing valve so as to open the communication flow passage after a temperature or voltage of the heat medium in the high-temperature side heat medium circuit is raised to a predetermined value or higher. 4. The refrigeration cycle device according to claim 1 , further comprising: a low-temperature side radiator configured to exchange heat between the heat medium in the low-temperature side heat medium circuit and outside air; and a high-temperature side radiator configured to exchange heat between the heat medium in the high-temperature side heat medium circuit and the outside air, wherein the heat transfer portion includes a coupling portion configured to couple the high-temperature side radiator and the low-temperature side radiator using a metal member and to transfer heat from the high-temperature side radiator to the low-temperature side radiator. 5. The refrigeration cycle device according to claim 1 , further comprising: a high-temperature side radiator configured to exchange heat between the heat medium in the high-temperature side heat medium circuit and outside air, wherein the heat exchanging portion is a low-temperature side radiator configured to exchange heat between the heat medium in the low-temperature side heat medium circuit and outside air; and a coupling portion configured to couple the high-temperature side radiator and the low-temperature side radiator using a metal member and to transfer heat from the high-temperature side radiator to the low-temperature side radiator. 6. The refrigeration cycle device according to claim 1 , further comprising: a low-temperature side radiator configured to exchange heat between the heat medium in the low-temperature side heat medium circuit and outside air; a low-temperature side circulation switching valve configured to switch between a first state in which the heat medium circulates between the low-temperature side heat exchanger and the low-temperature side radiator and a second state in which the heat medium does not circulate between the low-temperature side heat exchanger and the low-temperature side radiator; and a controller configured to open the communication flow passage after the low-temperature side circulation switching valve is controlled to circulate the thermal medium between the low-temperature side heat exchanger and the low-temperature side radiator. 7. The refrigeration cycle device according to claim 1 , further comprising: a low-temperature side radiator configured to exchange heat between the heat medium in the low-temperature side heat medium circuit and outside air; a low-temperature side circulation switching valve configured to switch between a first state in which the heat medium circulates between the heat exchanging portion and the low-temperature side radiator and a second state in which the heat medium does not circulate between the heat exchanging portion and the low-temperature side radiator; and a controller configured to open the communication flow passage after the low-temperature side circulation switching valve is controlled to circulate the thermal medium between the heat exchanging portion and the low-temperature side radiator. 8. The refrigeration cycle device according to claim 1 , wherein the heat exchanging portion is a battery mounted on a vehicle. 9. The refrigeration cycle device according to claim 1 , wherein the heat exchanging portion is an exterior heat exchanger configured to exchange heat between the heat medium in the low-temperature side heat medium circuit and outside air. 10. The refrigeration cycle device according to claim 1 , further comprising: a gas-liquid separator configured to separate the refrigerant flowing into the gas-liquid separator from the high-temperature side heat exchanger, into a gas-phase refrigerant and a liquid-phase refrigerant and cause the separated liquid-phase refrigerant to flow out to a side of the decompression valve. 11. The refrigeration cycle device according to claim 1 , further comprising: an evaporator configured to exchange heat between the refrigerant decompressed by the decompression valve and air to be blown into a space to be air-conditioned; a high-temperature side radiator configured to exchange heat between the heat medium in the high-temperature side heat medium circuit and outside air; a heater core configured to exchange heat between the heat medium in the high-temperature side heat medium circuit and air; a low-temperature side radiator configured to exchange heat between the heat medium in the low-temperature side heat medium circuit and outside air; and a mode switching device configured to switch among an air-cooling mode in which heat is absorbed from the air into the refrigerant in the evaporator and heat is dissipated from the refrigerant into the outside air in the high-temperature side radiator, an air-heating mode in which heat is dissipated from the heat medium into the air in the heater core and heat is absorbed from the outside air into the refrigerant in the low-temperature side radiator, and a cooling mode in which the heat medium absorbs heat in the heat exchanging portion. 12. A refrigeration cycle device comprising: a compressor configured to draw and discharge a refrigerant; a first heat exchanger configured to exchange heat between the refrigerant discharged from the compressor and a heat medium; a decompression valve configured to decompress the refrigerant flowing out of the high-temperature side heat exchanger; a second heat exchanger configured to exchange heat between the refrigerant decompres

Assignees

Inventors

Classifications

  • comprising a secondary circuit · CPC title

  • comprising two or more secondary circuits, e.g. at evaporator and condenser side · CPC title

  • characterised by the arrangement or type of the compressor (B60H1/3222 takes precedence) · CPC title

  • Controlling the flow of liquid in a heat pump system (controlling the properties of the refrigerant liquid, e.g. pressure or temperature, B60H1/3204) · CPC title

  • B60H1/3227Primary

    characterised by the arrangement or the type of heat exchanger, e.g. condenser, evaporator (condensed liquid drainage means B60H1/3233) · CPC title

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What does patent US11299014B2 cover?
A refrigeration cycle device includes a high-temperature side heat exchanger, an expansion valve for decompressing the refrigerant flowing out of the high-temperature side heat exchanger, a low-temperature side heat exchanger that exchanges heat between the refrigerant decompressed by the expansion valve and coolant, a high-temperature coolant circuit in which the coolant circulates to the high…
Who is the assignee on this patent?
Denso Corp
What technology area does this patent fall under?
Primary CPC classification B60H1/00899. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 12 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).