Resistive soldering method, assembly of antenna and glass, and resistive soldering system

Patent metadata

Field	Value
Publication number	US-11298767-B2
Application number	US-202016855633-A
Country	US
Kind code	B2
Filing date	Apr 22, 2020
Priority date	May 20, 2016
Publication date	Apr 12, 2022
Grant date	Apr 12, 2022

Abstract

A resistive soldering system, includes a first electrode; a second electrode; a support cylinder; a resistive soldering joint which is adapted to raise or lower the first electrode, the second electrode and the support cylinder; and a power supply unit which is connected with the first and second electrodes and adapted to supply power and a heating current to the first and second electrodes.

First claim

What is claimed is:

1. A resistive soldering system, comprising:
a first electrode;
a second electrode;
a support cylinder;
a resistive soldering joint which is adapted to raise or lower the first electrode, the second electrode and the support cylinder; and
a power supply unit which is connected with the first and second electrodes and adapted to supply power and a heating current to the first and second electrodes,
wherein, said support cylinder is configured to be apart from said first and second electrodes, and is configured to be located beyond a conductive heating circuit constituted by said first and second electrodes.

2. The resistive soldering system according to claim 1 , further comprising:
a control unit connected with the power supply unit, wherein the control unit is adapted to control the power supply unit to supply power to the first electrode and the second electrode; and
a current display unit connected with the first electrode and the second electrode, wherein the current display unit is adapted to display a heating current flowing through the first electrode and the second electrode.

3. The resistive soldering system according to claim 1 , wherein the support cylinder is disposed between the first electrode and the second electrode.

4. The resistive soldering system according to claim 1 , wherein both the first electrode and the second electrode have a falling wedge-shaped end.

5. The resistive soldering system according to claim 1 , wherein along a direction from a bottom to a top of the support cylinder, a diameter of the support cylinder on a sectional surface parallel with the horizontal plane increases.

6. The resistive soldering system according to claim 1 , wherein the support cylinder comprises a central axial structure and a bump structure on the periphery of the central axial structure.

7. The resistive soldering system according to claim 6 , wherein the bump structure is an annular structure surrounding the periphery of the central axial structure, or the bump structure comprises at least two separate bumps.

Assignees

• Saint Gobain

Inventors

• Shi Ce
• Yu Shengwen
• Wu Huanhuan

Classifications

• B23K2103/04

  Steel {or steel} alloys · CPC title

• B23K2103/54

  Glass · CPC title

• B23K1/0008

  specially adapted for particular articles or work · CPC title

• B23K1/0004 Primary

  Resistance soldering · CPC title

• B23K11/36

  Auxiliary equipment (B23K11/31 takes precedence) · CPC title