MEMS microphone
US-10349185-B2 · Jul 9, 2019 · US
MEMS microphone
US11297414B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11297414-B2 |
| Application number | US-201816760803-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 6, 2018 |
| Priority date | Jun 25, 2018 |
| Publication date | Apr 5, 2022 |
| Grant date | Apr 5, 2022 |
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- Title
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Abstract
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An MEMS microphone is provided, comprising a substrate and a vibration diaphragm supported above the substrate by a spacing portion, the substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the substrate, wherein: a lower electrode forming a capacitor structure with the vibration diaphragm is provided on the substrate, and an electret layer providing an electric field between the vibration diaphragm and the lower electrode is provided on the substrate
First claim
Opening claim text (preview).
The invention claimed is: 1. A MEMS microphone, comprising a substrate and a vibration diaphragm supported above the substrate by a spacing portion, the substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, wherein a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the substrate, wherein: a lower electrode forming a capacitor structure with the vibration diaphragm is provided on the substrate, and an electric layer providing an electric field between the vibration diaphragm and the lower electrode is provided on the substrate. 2. The MEMS microphone according to claim 1 , wherein the vibration diaphragm comprises an insulating material, and an upper electrode forming a capacitor structure with the lower electrode is provided on the vibration diaphragm. 3. The MEMS microphone according to claim 1 , wherein the vibration diaphragm comprises a composite structure, an upper electrode being provided in the composite structure of the vibration diaphragm. 4. The MEMS microphone according to claim 1 , wherein an upper electrode on the vibration diaphragm is electrically connected to a circuit layout on the substrate via a lead. 5. The MEMS microphone according to claim 1 , wherein the vibration diaphragm has a mechanical sensitivity of 0.02 to 0.9 nm/Pa. 6. The MEMS microphone according to claim 1 , wherein an initial gap between the vibration diaphragm and the substrate is 1-100 μm. 7. The MEMS microphone according to claim 1 , further comprising an ASIC circuit integrated on the substrate. 8. The MEMS microphone according to claim 1 , wherein a reinforcing portion is provided at a central region of the vibration diaphragm that is away from the vacuum chamber. 9. The MEMS microphone according to claim 1 , wherein a bonding pad for an external connection is provided on a side of the substrate that is away from the vacuum chamber. 10. The MEMS microphone according to claim 1 , wherein the electric field between the vibration diaphragm and the lower electrode is 100-300 V/μm.
Assignees
Inventors
Classifications
- H04R19/04Primary
Microphones (H04R19/01 takes precedence) · CPC title
Mems transducers or their use · CPC title
- H04R1/283Primary
using a passive diaphragm · CPC title
Microphones or microspeakers · CPC title
Interconnection of transducer parts (of diaphragm and outer suspension by moulding H04R31/003) · CPC title
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- What does patent US11297414B2 cover?
- An MEMS microphone is provided, comprising a substrate and a vibration diaphragm supported above the substrate by a spacing portion, the substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the substrate, wher…
- Who is the assignee on this patent?
- Goertek Inc
- What technology area does this patent fall under?
- Primary CPC classification H04R19/04. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 05 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).