Flexible substrate and method for manufacturing same, and flexible display substrate and method for manufacturing same

Patent metadata

Field	Value
Publication number	US-11296285-B2
Application number	US-201916709000-A
Country	US
Kind code	B2
Filing date	Dec 10, 2019
Priority date	Feb 19, 2019
Publication date	Apr 5, 2022
Grant date	Apr 5, 2022

Abstract

The present disclosure discloses a flexible substrate and a method for manufacturing the same, and a flexible display substrate and a method for manufacturing the same. The method for manufacturing the flexible substrate includes: sequentially forming a first flexible substrate layer and a first inorganic layer on a rigid base substrate; forming a second flexible substrate layer on a side of the first inorganic layer distal from the first flexible substrate layer, an orthographic projection of the second flexible substrate layer on the first flexible substrate layer being located within the first flexible substrate layer; and stripping off the rigid base substrate to obtain the flexible substrate. The method solves the problem of poor process of the flexible substrate.

First claim

The invention claimed is:

1. A method for manufacturing a flexible substrate, comprising:
sequentially forming a first flexible substrate layer and a first inorganic layer on a rigid base substrate;
forming a second flexible substrate layer on a side of the first inorganic layer distal from the first flexible substrate layer, an orthographic projection of the second flexible substrate layer on the first flexible substrate layer being located within the first flexible substrate layer;
forming a second inorganic layer on a side of the second flexible substrate layer distal from the first inorganic layer; and
stripping off the rigid base substrate to obtain the flexible substrate,
wherein the first inorganic layer coats the first flexible substrate layer, and the second inorganic layer coats the second flexible substrate layer and the first flexible substrate layer, the first and second flexible substrate layers do not extend to a boundary position of the flexible substrate and only a stack of the first inorganic layer and the second inorganic layer remains at the boundary position.

2. The method according to claim 1 , wherein the forming the second flexible substrate layer on the side of the first inorganic layer distal from the first flexible substrate layer, the orthographic projection of the second flexible substrate layer on the first flexible substrate layer being located within the first flexible substrate layer comprises:
forming a first substrate solution layer on the side of the first inorganic layer distal from the first flexible substrate layer, an area of the first substrate solution layer being smaller than an area of the first flexible substrate layer, and an orthographic projection of the first substrate solution layer on the first flexible substrate layer being located within the first flexible substrate layer; and
drying the first substrate solution layer to obtain the second flexible substrate layer.

3. The method of claim 1 , wherein upon the forming the second inorganic layer on the side of the second flexible substrate layer distal from the first inorganic layer, the method further comprises:
forming a third flexible substrate layer on a side of the second inorganic layer distal from the second flexible substrate layer, an orthographic projection of the third flexible substrate layer on the first flexible substrate layer being located within the orthographic projection of the second flexible substrate layer on the first flexible substrate layer; and
forming a third inorganic layer on a side of the third flexible substrate layer distal from the second inorganic layer.

4. The method according to claim 3 , wherein the forming the third flexible substrate layer on the side of the second inorganic layer distal from the second flexible substrate layer comprises:
forming a second substrate solution layer on the side of the second inorganic layer distal from the second flexible substrate layer, an area of the second substrate solution layer being smaller than an area of the second flexible substrate layer, and an orthographic projection of the second substrate solution layer on the first flexible substrate layer being located within the orthographic projection of the second flexible substrate layer on the first flexible substrate layer; and
drying the second substrate solution layer to obtain the third flexible substrate layer.

5. The method according to claim 1 , wherein
upon the forming the second flexible substrate layer on the side of the first inorganic layer distal from the first flexible substrate layer, the method further comprises:
sequentially forming a third flexible substrate layer and a third inorganic layer on the side of the second flexible substrate layer distal from the first inorganic layer, an orthographic projection of the third flexible substrate layer on the first flexible substrate layer being located within the orthographic projection of the second flexible substrate layer on the first flexible substrate layer.

6. A flexible substrate, comprising:
a first flexible substrate layer, a first inorganic layer, a second flexible substrate layer, and a second inorganic layer that are sequentially stacked, wherein an orthographic projection of the second flexible substrate layer on the first flexible substrate layer is located within the first flexible substrate layer, the first inorganic layer coats the first flexible substrate layer, and the second inorganic layer coats the second flexible substrate layer and the first flexible substrate layer;
wherein the first and second flexible substrate layers do not extend to a boundary position of the flexible substrate and only a stack of the first inorganic layer and the second inorganic layer remains at the boundary position.

7. The flexible substrate according to claim 6 , further comprising:
a third flexible substrate layer located on a side of the second inorganic layer distal from the second flexible substrate layer, an orthographic projection of the third flexible substrate layer on the first flexible substrate layer being located within the orthographic projection of the second flexible substrate layer on the first flexible substrate layer; and
a third inorganic layer located on a side of the third flexible substrate layer distal from the second inorganic layer.

8. A method for manufacturing a flexible display substrate, the method comprising:
sequentially forming a first flexible substrate layer, a first inorganic layer, and a second flexible substrate layer on a rigid base substrate, an orthographic projection of the second flexible substrate layer on the first flexible substrate layer being located within the first flexible substrate layer;
forming a second inorganic layer on the side of the second flexible substrate layer distal from the first inorganic layer;
forming a display structure layer on a side of the second flexible substrate layer distal from the first inorganic layer, an orthographic projection of the display structure layer on the first flexible substrate layer being located within the orthographic projection of the second flexible substrate layer on the first flexible substrate layer; and
stripping off the rigid base substrate to obtain the flexible display substrate,
wherein the first inorganic layer coats the first flexible substrate layer, and the second inorganic layer coats the second flexible substrate layer and the first flexible substrate layer, the first and second flexible substrate layers do not extend to a boundary position of the flexible substrate and only a stack of the first inorganic layer and the second inorganic layer remains at the boundary position.

9. The method according to claim 8 , wherein
forming the display structure layer on the side of the second flexible substrate layer distal from the first inorganic layer comprises:
forming the display structure layer on a side of the second inorganic layer distal from the second flexible substrate layer.

10. The method according to claim 9 , wherein
upon the forming the second inorganic layer on the side of the second flexible substrate layer distal from the first inorganic layer, the method further comprises:
sequentially forming a third flexible substrate layer and a third inorganic layer on the side of the second inorganic layer distal from the second flexible substrate layer, an orthographic projection of the third flexible substrate layer on the first flexible substrate layer being located within the orthographic projection of the second flexible substrate layer on the first flexible substrate layer; and
the forming the display structure layer on the side of the second inorganic layer distal from the second flexible substrat

Assignees

• Chengdu Boe Optoelect Tech Co
• Boe Technology Group Co Ltd

Inventors

• Xu Baoqiang
• Wang Xiangnan
• Wen Qiang
• Tan Jianjun
• Yi Haitao

Classifications

• H10K59/8731

  multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers · CPC title

• H10K59/12

  Active-matrix OLED [AMOLED] displays · CPC title

• H10K77/111

  Flexible substrates · CPC title

• H10K71/80 Primary

  using temporary substrates · CPC title

• Y02P70/50

  Manufacturing or production processes characterised by the final manufactured product · CPC title