Integrated assemblies and methods of forming integrated assemblies

Patent metadata

Field	Value
Publication number	US-11296103-B2
Application number	US-202016863000-A
Country	US
Kind code	B2
Filing date	Apr 30, 2020
Priority date	Apr 30, 2020
Publication date	Apr 5, 2022
Grant date	Apr 5, 2022

Abstract

Some embodiments include an integrated assembly having a vertical stack of alternating insulative and conductive levels. The conductive levels have terminal regions and nonterminal regions. The terminal regions are vertically thicker than the nonterminal regions. Channel material extends vertically through the stack. Tunneling material is adjacent the channel material. Charge-storage material is adjacent the tunneling material. High-k dielectric material is between the charge-storage material and the terminal regions of the conductive levels. The insulative levels have carbon-containing first regions between the terminal regions of neighboring conductive levels, and have second regions between the nonterminal regions of the neighboring conductive levels. Some embodiments include methods of forming integrated assemblies.

First claim

We claim:

1. An integrated assembly, comprising:
a vertical stack of alternating insulative levels and conductive levels;
the conductive levels having terminal regions, and having nonterminal regions proximate the terminal regions; the terminal regions being vertically thicker than the nonterminal regions;
channel material extending vertically through the stack;
tunneling material adjacent the channel material;
charge-storage material adjacent the tunneling material;
high-k dielectric material between the charge-storage material and the terminal regions of the conductive levels;
the insulative levels having first regions vertically between the terminal regions of neighboring conductive levels, and having second regions vertically between the nonterminal regions of the neighboring conductive levels; and
the first regions of the insulative levels comprising one or more members of the group consisting of SiOC, where the chemical formula indicates primary constituents rather than a specific stoichiometry and wherein the carbon is present to a concentration within a range of from about 1 at % to about 50 at %, SiC and SiNC.

2. The integrated assembly of claim 1 wherein the first regions of the insulative levels comprise the carbon in combination with one or more of silicon, oxygen and nitrogen.

3. The integrated assembly of claim 2 wherein the first regions of the insulative levels have a horizontal thickness within a range of from about 1 nm to about 12 nm.

4. The integrated assembly of claim 2 wherein the first regions of the insulative levels have a horizontal thickness within a range of from about 2 nm to about 4 nm.

5. The integrated assembly of claim 1 wherein the second regions of the insulative levels comprise silicon dioxide.

6. The integrated assembly of claim 1 wherein the second regions of the insulative levels comprise voids.

7. The integrated assembly of claim 1 wherein the first regions of the insulative levels comprise SiOC, where the chemical formula indicates primary constituents rather than a specific stoichiometry; and wherein the carbon is present to a concentration within a range of from about 1 at % to about 50 at %.

8. The integrated assembly of claim 7 wherein the carbon is present to a concentration within a range of from about 4 at % to about 20 at %.

9. The integrated assembly of claim 1 wherein the first regions of the insulative levels comprise SiC, where the chemical formula indicates primary constituents rather than a specific stoichiometry; and wherein the carbon is present to a concentration within a range of from about 1 at % to about 50 at %.

10. The integrated assembly of claim 9 wherein the carbon is present to a concentration within a range of from about 4 at % to about 20 at %.

11. The integrated assembly of claim 1 wherein the first regions of the insulative levels comprise SiNC, where the chemical formula indicates primary constituents rather than a specific stoichiometry; and wherein the carbon is present to a concentration within a range of from about 1 ppm to about 5 at %.

12. An integrated assembly, comprising:
a vertical stack of alternating insulative levels and conductive levels;
the conductive levels having terminal regions, and having nonterminal regions proximate the terminal regions; the terminal regions being vertically thicker than the nonterminal regions;
channel material extending vertically through the stack;
tunneling material adjacent the channel material;
charge-storage material adjacent the tunneling material;
high-k dielectric material between the charge-storage material and the terminal regions of the conductive levels;
the insulative levels having first regions vertically between the terminal regions of neighboring conductive levels, and having second regions vertically between the nonterminal regions of the neighboring conductive levels; and
the first regions of the insulative levels comprising carbon; wherein:
the conductive levels comprise a conductive liner material along an outer periphery of a conductive core material;
the conductive liner material is compositionally different from the conductive core material;
the terminal regions comprise only the conductive liner material; and
the nonterminal regions comprising both the conductive liner material and the conductive core material.

13. The integrated assembly of claim 12 wherein the terminal regions join to the nonterminal regions at corners having angles of about 90°.

14. The integrated assembly of claim 12 wherein the terminal regions are substantially straight along a vertical direction.

15. The integrated assembly of claim 12 wherein the conductive liner material comprises metal nitride.

16. The integrated assembly of claim 15 wherein the metal nitride comprises titanium nitride; and wherein the conductive core material consists of tungsten.

17. The integrated assembly of claim 1 wherein the nonterminal regions are substantially vertically-centered relative to the terminal regions along each of the conductive levels.

18. An integrated assembly, comprising:
a vertical stack of alternating insulative levels and conductive levels;
the conductive levels having terminal regions, and having nonterminal regions proximate the terminal regions; the terminal regions being vertically thicker than the nonterminal regions;
the conductive levels comprising a conductive liner material along an outer periphery of a conductive core material;
the conductive liner material being compositionally different from the conductive core material;
the terminal regions comprising only the conductive liner material;
the nonterminal regions comprising both the conductive liner material and the conductive core material; the conductive liner material having a substantially uniform thickness along the nonterminal and terminal regions of the conductive levels;
the terminal regions joining to the nonterminal regions at corners having angles of about 90°;
the nonterminal regions being substantially vertically-centered relative to the terminal regions along the conductive levels;
channel material extending vertically through the stack;
tunneling material adjacent the channel material;
charge-storage material adjacent the tunneling material;
charge-blocking material adjacent the charge-storage material; and
high-k dielectric material between the charge-blocking material and the terminal regions of the conductive levels.

19. The integrated assembly of claim 18 wherein the conductive liner material comprises titanium nitride; and wherein the conductive core material consists of tungsten.

20. The integrated assembly of claim 18 wherein the terminal regions of the conductive levels have first vertical thicknesses; wherein the nonterminal regions of the conductive levels have second vertical thicknesses; and wherein the first vertical thicknesses are greater than the second vertical thicknesses by an amount within range of from about 1 nm to about 20 nm.

21. The integrated assembly of claim 18 wherein the said amount is within a range of from about 1 nm to about 8 nm.

22. The integrated assembly of claim 18 wherein the second vertical thicknesses are within range of from about 15 nm to about 40 nm.

23. The integrated assembly of claim 18 wherein the insulative levels have first regions vertically between the terminal regions of neighboring conductive levels, and have second regions vertically between the nonterminal regi

Assignees

• Micron Technology Inc

Inventors

• Surthi Shyam
• Shrotri Kunal
• Thorum Matthew

Classifications

• H10D64/037 Primary

  comprising charge-trapping insulators · CPC title

• H01L27/11565

  Electricity · mapped topic

• H01L27/1157 Primary

  Electricity · mapped topic

• H01L27/11519

  Electricity · mapped topic

• H01L27/11556

  Electricity · mapped topic