Apparatus related to an improved package including a semiconductor die
US-9177925-B2 · Nov 3, 2015 · US
Substrate interposer on a leaderframe
US11296069B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11296069-B2 |
| Application number | US-202016737628-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 8, 2020 |
| Priority date | Mar 27, 2015 |
| Publication date | Apr 5, 2022 |
| Grant date | Apr 5, 2022 |
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Abstract
Official abstract text for this publication.
In one general aspect, a device can include a leadframe including at least one of an external input terminal or an external output terminal, an interposer made of an insulating material, and a redistribution layer coupled to the interposer and made of a conductive material. The redistribution layer can include a plurality of traces. The device can also include a semiconductor die disposed between the redistribution layer and the leadframe.
First claim
Opening claim text (preview).
What is claimed is: 1. A method, comprising: forming a leadframe assembly, including: etching a leadframe to create a recessed leadframe portion and a leadframe portion, the recessed leadframe portion having a thickness less than a thickness of the leadframe portion; and coupling a first semiconductor die to the leadframe portion; forming, on an interposer made of an insulating material, an interposer assembly, the forming the interposer assembly including: forming a redis…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US11296069B2 cover?
- In one general aspect, a device can include a leadframe including at least one of an external input terminal or an external output terminal, an interposer made of an insulating material, and a redistribution layer coupled to the interposer and made of a conductive material. The redistribution layer can include a plurality of traces. The device can also include a semiconductor die disposed betwe…
- Who is the assignee on this patent?
- Fairchild Semiconductor, Semiconductor Components Ind Llc
- What technology area does this patent fall under?
- Primary CPC classification H10W70/468. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 05 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).