Sensor module, temple, frame and eyewear

US11294204B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11294204-B2
Application numberUS-201716474193-A
CountryUS
Kind codeB2
Filing dateSep 25, 2017
Priority dateDec 27, 2016
Publication dateApr 5, 2022
Grant dateApr 5, 2022

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Provided is a sensor module that includes: a casing; a contacted part that is disposed so that at least a part thereof is exposed to the outside of the casing and that has conductivity; and a detection part that has an electrostatic capacitance type detection pad and that is disposed inside the casing. The detection part further includes a conductive plate provided so as to correspond to the detection region of the detection pad, the contacted part being electrically connected to the conductive plate. This configuration makes it possible to provide a sensor module that is highly sensitive to contact with an object, and that prevents damage to the detection pad caused by contact with the object.

First claim

Opening claim text (preview).

What is claimed is: 1. A sensor module, comprising: a casing; a contacted section that has conductivity and is disposed such that at least a part of the contacted section is exposed to an outside of the casing; and a detection section that includes a capacitive detection pad and is disposed inside the casing, wherein: the detection section further includes: a insulating layer disposed on a detection region of the detection pad; a conductive plate provided corresponding to the detection region and disposed on the insulating layer; and a through hole, and the contacted section and the conductive plate are electrically connected to each other by a first conduction path via the through hole. 2. The sensor module according to claim 1 , wherein: the detection pad, the insulating layer, and the conductive plate respectively include through-hole elements constituting the through hole, and conduction sections constituting the first conduction path are formed on peripheries of the through-hole elements, respectively. 3. The sensor module according to claim 1 , further comprising a connection member inserted in the through hole, wherein the contacted section and the conductive plate are electrically connected to each other by a second conduction path via the connection member. 4. The sensor module according to claim 3 , wherein the detection section is held between the contacted section and a grasping section of the connection member. 5. The sensor module according to claim 3 , wherein: the conductive plate includes a first main surface and a second main surface facing the first main surface in a predetermined direction, and the conductive plate is connected to the contacted section via the first conduction path on the first main surface side, and the conductive plate is connected to the contacted section via the second conduction path on the second main surface side. 6. The sensor module according to claim 1 , further comprising, an elastic member that has conductivity and is disposed so as to urge the contacted section to an outside of the casing between the contacted section and the detection section, wherein the contacted section is connected to the detection section via the elastic member. 7. The sensor module according to claim 6 , further comprising, a spacer disposed between the contacted section and the detection section. 8. The sensor module according to claim 7 , wherein: a through hole is formed in the spacer, and at least a part of the elastic member is disposed in the through hole. 9. The sensor module according to claim 6 , wherein: a recess is formed on a surface of the contacted section, the surface being located inside the casing, and at least a part of the elastic member is disposed in the recess. 10. The sensor module according to claim 6 , wherein the elastic member is a flat spring or a coil spring. 11. The sensor module according to claim 6 , wherein the elastic member abuts on a center portion of the contacted section. 12. The sensor module according to claim 1 , wherein: the contacted section includes a holding section for holding a position of the contacted section, and the holding section has elasticity in a direction to the outside of the casing. 13. The sensor module according to claim 1 , wherein the number of the contacted sections is larger than one, and the plurality of contacted sections are each connected to the detection section so that a capacitance change caused by contact with an object occurs in the detection pad. 14. A temple for eyewear, comprising the sensor module according to claim 1 , wherein: the casing constitutes an outer shape of the temple, and at least a part of the contacted section is disposed so as to be exposed to an outside of the temple. 15. The temple according to claim 14 , wherein a length of the contacted section in the longitudinal direction is smaller than a length of the detection region of the detection pad in the longitudinal direction. 16. The temple according to claim 14 , wherein: a protruding strip extending along a longitudinal direction of the casing is formed in the casing, and the contacted section is disposed on an extension line of a ridge of the protruding strip. 17. The temple according to claim 14 , further comprising, a front-end cover disposed at a front end, wherein: in the casing, an opening is formed at the front end in the longitudinal direction of the casing, and the front-end cover abuts on one end of the detection section in the longitudinal direction and is disposed so as to cover the opening. 18. A frame for eyewear, comprising: a front configured to hold a pair of lenses; and the temple according to claim 14 , connected to the front. 19. An eyewear, comprising: a pair of lenses each including an electroactive region in which an optical characteristic changes by electric control; the frame according to claim 18 , holding the pair of lenses; and a control section configured to vary the optical characteristic in the electroactive region of each of the pair of lenses by applying a voltage to the pair of lenses or stopping application of the voltage to the pair of lenses when the detection section detects contact of the object with the contacted section.

Assignees

Inventors

Classifications

  • G02C11/10Primary

    Electronic devices other than hearing aids · CPC title

  • Electrooptic lenses · CPC title

  • Input arrangements using manually operated switches, e.g. using keyboards or dials · CPC title

  • Constructional details of capacitive touch and proximity switches · CPC title

  • having special front end · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11294204B2 cover?
Provided is a sensor module that includes: a casing; a contacted part that is disposed so that at least a part thereof is exposed to the outside of the casing and that has conductivity; and a detection part that has an electrostatic capacitance type detection pad and that is disposed inside the casing. The detection part further includes a conductive plate provided so as to correspond to the de…
Who is the assignee on this patent?
Mitsui Chemicals Inc
What technology area does this patent fall under?
Primary CPC classification G02C11/10. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Apr 05 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).