Method based on multi-source deposition for fabricating perovskite film

Patent metadata

Field	Value
Publication number	US-11293101-B2
Application number	US-201916357837-A
Country	US
Kind code	B2
Filing date	Mar 19, 2019
Priority date	Aug 7, 2014
Publication date	Apr 5, 2022
Grant date	Apr 5, 2022

Abstract

A method for fabricating a perovskite film includes the steps of: placing a substrate on a substrate stage in a chamber, the substrate stage configured to rotate around its central axis at a rotation speed; depositing first source materials on the substrate from a first set of evaporation units, each coupled to the side section or the bottom section of the chamber; depositing second source materials on the substrate from a second set of evaporation units coupled to the bottom section, wherein the chamber includes a shield defining two or more zones having respective horizontal cross-sectional areas, which are open and facing the substrate, designated for the two or more evaporation units in the second set. The perovskite film includes multiple unit layers each being formed by one rotation of the substrate stage, and having composition and thickness thereof controlled by adjusting evaporation rates, rotation speed and horizontal cross-sectional areas.

First claim

The invention claimed is:

1. A method for fabricating a perovskite film, comprising:
placing a substrate on a substrate stage in a chamber, the chamber having a closed hollow structure that has a side section along a vertical direction and top and bottom sections along a horizontal direction, the substrate stage being coupled to the top section of the chamber and configured to have a stage surface facing vertically downward for the substrate to be placed and to rotate around a central axis at a rotation speed;
depositing first source materials on the substrate from a first set of evaporation units comprising one or more evaporation units, each coupled to the side section or to the bottom section of the chamber, the first set of evaporation units generating vapors of one or more of the first source materials with one or more first evaporation rates, respectively, and deposition of each of the one or more first source materials includes circulating the vapor of the first source material in the chamber, wherein at least one of the one or more first source materials is AX;
depositing second source materials on the substrate from a second set of evaporation units comprising two or more evaporation units coupled to the bottom section of the chamber, the second set of evaporation units generating vapors of two or more second source materials with two or more second evaporation rates, respectively, and deposition of each of the two or more second source materials includes vertical line-of-sight transfer, wherein at least one of the two or more second source materials is BX 2 ; and
wherein AX is an organic halide compound and BX 2 is a metal halide compound, wherein halogen X in the AX and halogen X in the BX 2 are the same or different,
wherein the chamber includes a shield for separating the two or more evaporation units coupled to the bottom section of the chamber, and thereby defining two or more zones designated for the two or more evaporation units coupled to the bottom section, respectively, wherein the zone designated for each of the two or more evaporation units in the second set is configured to have a horizontal cross-sectional area that is open and facing the substrate surface.

2. The method of claim 1 , wherein
at least the one or more first evaporation rates, the two or more second evaporation rates, the rotation speed and the two or more horizontal cross-sectional areas are adjusted to control composition and thickness of a unit layer to fabricate the perovskite film comprising a plurality of unit layers, wherein each unit layer is formed by one rotation of the substrate stage.

3. The method of claim 2 , wherein
the two or more second source materials are two or more metal halide compounds each represented by the BX 2 , respectively,
wherein at least the one or more first evaporation rates, the two or more second evaporation rates, the rotation speed and the two or more horizontal cross-sectional areas are adjusted to form two or more sub-layers in the unit layer, the two or more sub-layers including at least elements of the two or more types metal halide compounds each represented by the BX 2 , respectively.

4. The method of claim 2 , wherein
one of the two or more second source materials is a dopant material,
wherein at least the one or more first evaporation rates, the two or more second evaporation rates, the rotation speed and the two or more horizontal cross-sectional areas are adjusted to form the unit layer with a predetermined dopant concentration.

5. The method of claim 2 , wherein
one of the one or more first source materials is a dopant material,
wherein at least the one or more first evaporation rates, the two or more second evaporation rates, the rotation speed and the two or more horizontal cross-sectional areas are adjusted to form the unit layer with a predetermined dopant concentration.

6. The method of claim 1 , wherein
at least one of the one or more evaporation units in the first set is coupled to the side section of the chamber.

7. The method of claim 1 , wherein
at least one of the one or more evaporation units in the first set is coupled to the bottom section of the chamber, and
the shield is configured to include a top shield portion above the at least one of the one or more evaporation units in the first set to promote the circulation of the vapor of the first source material therefrom by reducing the vapor directly hitting the substrate.

8. The method of claim 1 , wherein
at least one of the one or more evaporation units in the first set is coupled to the bottom section of the chamber, and
an opening portion of the shield for the at least one of the one or more evaporation units in the first set is oriented to face away from the substrate surface to promote the circulation of the vapor of the first source material therefrom by reducing the vapor directly hitting the substrate.

9. The method of claim 1 , wherein
at least one of the one or more evaporation units in the first set is coupled to the bottom section of the chamber away from the two or more evaporation units in the second set to avoid an overlap between a horizontal cross-sectional area of the substrate surface and that of the at least one of the one or more evaporation units in the first set.

10. The method of claim 1 , further comprising:
controlling a temperature of the substrate stage for providing uniform cooling or heating to the substrate;
rotating the substrate stage at the rotation speed;
controlling temperatures associated with the one or more evaporation units in the first set and the two or more evaporation units in the second set to adjust the one or more first evaporation rates and the two or more second evaporation rates, respectively;
monitoring a film thickness in situ; and
interrupting the deposition when the film thickness reaches a predetermined thickness.

11. The method of claim 10 , further comprising:
predetermining at least the one or more first evaporation rates, the two or more second evaporation rates, the rotation speed and the two or more horizontal cross-sectional areas to control composition and thickness of a unit layer to fabricate the perovskite film comprising a plurality of unit layers, wherein each unit layer is formed by one rotation of the substrate stage.

12. The method of claim 10 , wherein the chamber further comprises a shutter provided below the substrate stage, and a plurality of evaporation shutters provided for the one or more evaporation units in the first set and for the two or more evaporation units in the second set, respectively, the method further comprising:
closing the shutter to cover the substrate stage before the deposition;
opening the shutter to expose the substrate stage to start the deposition; and
adjusting the plurality of evaporation shutters to control flows of the vapors of the first and second source materials, respectively,
wherein the interrupting the deposition comprises closing the shutter.

13. The method of claim 10 , wherein a root mean square roughness per atomic force microscopy (AFM) of the perovskite film fabricated is less than 40 nm without annealing.

14. The method of claim 1 , wherein the A is an organic element selected from a group consisting of methylammonium (MA) and formamidinium (FA), the B is a metal element selected from a group consisting of Pb and Sn, and the X is a halogen element selected from a group consisting of Cl, I and Br.

Assignees

• Okinawa Inst Science & Tech School Corp

Inventors

• Qi Yabing
• Ono Luis
• Wang Shenghao

Classifications

• C23C14/0694 Primary

  Halides · CPC title

• C23C16/52 Primary

  Controlling or regulating the coating process {(C23C16/45557, C23C16/279 take precedence)} · CPC title

• H10K85/50

  Organic perovskites; Hybrid organic-inorganic perovskites [HOIP], e.g. CH3NH3PbI3 · CPC title

• H10K30/10

  comprising heterojunctions between organic semiconductors and inorganic semiconductors · CPC title

• H10K30/50

  Photovoltaic [PV] devices · CPC title