Easy-to-tear, unstretched resin film and laminate film for packaging material using the same

US11292908B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11292908-B2
Application numberUS-201716318896-A
CountryUS
Kind codeB2
Filing dateJul 14, 2017
Priority dateJul 20, 2016
Publication dateApr 5, 2022
Grant dateApr 5, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

This invention provides an easy-to-tear resin film. Such easy-to-tear resin film is an easy-to-tear, unstretched resin film composed of a blend of a polyethylene terephthalate-based resin with the second resin having a difference in SP value from the polyethylene terephthalate-based resin of 1.1 to 4.0 (cal/cm3)0.5. This invention also provides a laminate film 1B for a packaging material comprising the easy-to-tear, unstretched resin film 10 between the inner layer film 20 serving as a heat seal surface and the surface layer film 30 comprising an isophthalic acid-modified polyethylene terephthalate resin having a copolymerization ratio of isophthalic acid component of 0 mol % to 5 mol %.

First claim

Opening claim text (preview).

The invention claimed is: 1. An easy-to-tear, unstretched resin film consisting of a blend of a polyethylene terephthalate-based resin and a second resin having a difference in solubility parameter (SP) value from the polyethylene terephthalate-based resin of 1.1 to 4.0 (cal/cm 3 ) 0.5 , wherein the second resin is a cycloolefin copolymer or polymethyl methacrylate; wherein the second resin is dispersed in a particulate state in the polyethylene terephthalate-based resin and the average aspect ratio of the particles is 1 to 1.76; wherein the film has a tear strength in the longitudinal direction of 0.25 N or lower and a tear strength in the transverse direction of 0.25 N or lower; and wherein the tear strength in the longitudinal direction and the tear strength in the transverse direction are measured according to the Trouser method using a test rate of 200 mm/minute at a temperature of 25° C.; wherein the polyethylene terephthalate-based resin is an isophthalic acid-modified polyethylene terephthalate resin having a copolymerization ratio of isophthalic acid component of 1 mol % to 5 mol %, based on the whole dicarboxylic acid component of the isophthalic acid-modified polyethylene terephthalate resin; wherein in the blend, the proportion of the polyethylene terephthalate-based resin is 65% to 75% by weight and the proportion of the second resin is 35% to 25% by weight. 2. The easy-to-tear, unstretched resin film according to claim 1 , wherein the second resin has Tg that is higher than Tg of the polyethylene terephthalate-based resin by at least 25° C. 3. The easy-to-tear, unstretched resin film according to claim 1 , wherein the melt viscosity ratio of the second resin to the polyethylene terephthalate-based resin is 0.3 to 1.6 at 270° C. and a shear rate of 121.6 (1/second).

Assignees

Inventors

Classifications

  • Inert, i.e. inert to chemical degradation, corrosion · CPC title

  • comprising polyesters · CPC title

  • comprising acrylic (co)polymers · CPC title

  • comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers · CPC title

  • Homopolymers or copolymers of acrylonitrile (C08L55/02 takes precedence) · CPC title

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What does patent US11292908B2 cover?
This invention provides an easy-to-tear resin film. Such easy-to-tear resin film is an easy-to-tear, unstretched resin film composed of a blend of a polyethylene terephthalate-based resin with the second resin having a difference in SP value from the polyethylene terephthalate-based resin of 1.1 to 4.0 (cal/cm3)0.5. This invention also provides a laminate film 1B for a packaging material compri…
Who is the assignee on this patent?
Toyo Seikan Group Holdings Ltd, Toyo Seikan Kaisha Ltd
What technology area does this patent fall under?
Primary CPC classification C08L67/02. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 05 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).