Sensor housings, modules, and luminaires incorporating the same comprising a heat sink with heat dissipation structures radially arranged over the outer wall of a sensor housing

US11290621B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11290621-B2
Application numberUS-202016935770-A
CountryUS
Kind codeB2
Filing dateJul 22, 2020
Priority dateOct 16, 2017
Publication dateMar 29, 2022
Grant dateMar 29, 2022

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Sensor housings, modules, and luminaires comprising the same are provided. The sensor housings and modules set forth herein have improved heat sinking abilities for dissipating heat from a sensor while simultaneously facilitating thermal isolation of the sensor. Briefly, a sensor housing described herein comprises a cavity for housing a sensor and a heat sink. The heat sink is configured to dissipate heat from the sensor housing and thermally isolate the sensor housing from other heat generating components, such as other portions of a luminaire.

First claim

Opening claim text (preview).

The invention claimed is: 1. A luminaire comprising: an electronic sensor having a sensor housing in thermal communication with a heat sink, the heat sink comprising a plurality of heat dissipation structures radially arranged over an outer wall of the sensor housing. 2. The luminaire of claim 1 , where the luminaire further comprises a luminaire housing. 3. The luminaire of claim 2 , where the luminaire housing includes the sensor housing. 4. The luminaire of claim 1 , where the electronic sensor comprises drive circuitry, and a sensing device in electrical communication with the drive circuitry. 5. The luminaire of claim 4 where the drive circuitry comprises at least any one of a processor, a controller, a memory element, a wireless antenna, and combinations thereof. 6. The luminaire of claim 1 where the heat sink is configured to thermally insulate the electronic sensor. 7. The luminaire of claim 1 where the electronic sensor comprises at least any one of an image sensor, a light sensor, a motion sensor, a temperature sensor, a magnetic field sensor, a gravity sensor, a humidity sensor, a moisture sensor, a vibration sensor, a pressure sensor, an electrical field sensor, a noise sensor, an environmental sensor, a directional sensor, a position sensor, a velocity sensor, an airflow sensor, a chemical sensor, a carbon dioxide sensor, an oxygen sensor, and combinations thereof. 8. The luminaire of claim 1 where the electronic sensor comprises a wireless interface configured to wirelessly communicate data from the electronic sensor. 9. The luminaire of claim 8 , wherein the interface comprises one or more antennae within the sensor housing. 10. The luminaire of claim 1 where the sensor housing includes at least one wall defining a cavity for accepting the electronic sensor. 11. The luminaire of claim 10 , wherein the heat sink forms a portion of the outer wall. 12. The luminaire of claim 10 , wherein the outer wall comprises an aperture. 13. The luminaire of claim 12 , wherein the aperture is configured to receive optics of a sensor. 14. The luminaire of claim 1 , wherein the heat sink is coupled to a surface of the outer wall. 15. The luminaire of claim 1 , wherein the plurality of heat dissipation structures comprises fins. 16. The luminaire of claim 1 further comprising thermally insulating material in the sensor housing. 17. The luminaire of claim 1 , wherein the sensor is an image sensor, and the sensor housing is integrated with the luminaire. 18. The luminaire of claim 1 , wherein the heat sink forms one or more portions of the sensor housing.

Assignees

Inventors

Classifications

  • Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements · CPC title

  • H04N23/51Primary

    Housings · CPC title

  • F21V23/008Primary

    the casing being outside the housing of the lighting device · CPC title

  • Light-emitting diodes [LED] · CPC title

  • the planes containing the fins or blades having the direction of the light emitting axis · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11290621B2 cover?
Sensor housings, modules, and luminaires comprising the same are provided. The sensor housings and modules set forth herein have improved heat sinking abilities for dissipating heat from a sensor while simultaneously facilitating thermal isolation of the sensor. Briefly, a sensor housing described herein comprises a cavity for housing a sensor and a heat sink. The heat sink is configured to dis…
Who is the assignee on this patent?
Ideal Ind Lighting Llc
What technology area does this patent fall under?
Primary CPC classification H04N23/51. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 29 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).