Resin multilayer substrate, actuator, and method of manufacturing resin multilayer substrate

Patent metadata

Field	Value
Publication number	US-11289965-B2
Application number	US-202017008987-A
Country	US
Kind code	B2
Filing date	Sep 1, 2020
Priority date	Mar 28, 2018
Publication date	Mar 29, 2022
Grant date	Mar 29, 2022

Abstract

A resin multilayer substrate includes a stacked body including resin layers, and a coil including coil conductor patterns provided on two or more resin layers. The coil conductor patterns include a coil conductor pattern including a parallel conductor portion. The parallel conductor portion includes linear conductor patterns connected in parallel that are parallel to each other, and is provided at least at a portion of an outermost peripheral portion of the coil conductor pattern. A total line width of the linear conductor patterns of the parallel conductor portion is larger than a line width of other portions of the coil conductor pattern.

First claim

What is claimed is:

1. A resin multilayer substrate comprising:
a stacked body including a plurality of resin layers that are stacked; and
a coil including a plurality of coil conductor patterns provided on two or more resin layers of the plurality of resin layers; wherein
the plurality of coil conductor patterns include a coil conductor pattern including a parallel conductor portion in which a plurality of linear conductor patterns connected in parallel are parallel or substantially parallel to each other in at least a portion of an outermost peripheral portion; and
a total line width of the plurality of linear conductor patterns defining the parallel conductor portion is larger than a line width of other portions of the coil conductor pattern.

2. The resin multilayer substrate according to claim 1 , wherein the parallel conductor portion is provided on an entirety or substantially an entirety of the outermost peripheral portion of the coil conductor pattern.

3. The resin multilayer substrate according to claim 1 , wherein the parallel conductor portion includes a straight portion in which the plurality of linear conductor patterns are linearly parallel or substantially parallel to each other, and a connecting portion that connects the linear conductor patterns to each other near a center of the straight portion.

4. The resin multilayer substrate according to claim 1 , wherein the coil conductor pattern including the parallel conductor portion is closest to a surface layer in a stacking direction of the plurality of resin layers among the plurality of coil conductor patterns.

5. The resin multilayer substrate according to claim 1 , wherein
the stacked body includes a first main surface and a second main surface that oppose each other in a stacking direction of the plurality of resin layers; and
the coil conductor pattern including the parallel conductor portion is closest to the first main surface among the plurality of coil conductor patterns.

6. The resin multilayer substrate according to claim 1 , wherein a plurality of the coil conductor patterns including the parallel conductor portion are provided.

7. The resin multilayer substrate according to claim 6 , wherein
the stacked body includes a first main surface and a second main surface that oppose each other in a stacking direction of the plurality of resin layers; and
the plurality of the coil conductor patterns including the parallel conductor portion are at a position closest to the first main surface and a position closest to the second main surface, respectively, among the plurality of coil conductor patterns.

8. An actuator comprising:
the resin multilayer substrate according to claim 5 ; and
a magnet; wherein
the coil has a winding axis in the stacking direction; and
the magnet overlaps a formation region of the coil when viewed in a winding axis direction of the coil, and is closer to the second main surface than to the first main surface.

9. The actuator according to claim 8 , wherein the parallel conductor portion is provided on an entirety or substantially an entirety of the outermost peripheral portion of the coil conductor pattern.

10. The actuator according to claim 8 , wherein the parallel conductor portion includes a straight portion in which the plurality of linear conductor patterns are linearly parallel or substantially parallel to each other, and a connecting portion that connects the linear conductor patterns to each other near a center of the straight portion.

11. An actuator comprising:
the resin multilayer substrate according to claim 7 ; and
a magnet; wherein
the coil has a winding axis in the stacking direction; and
the magnet overlaps a formation region of the coil when viewed in a winding axis direction of the coil, and is closer to the second main surface than to the first main surface.

12. The actuator according to claim 11 , wherein the parallel conductor portion is provided on an entirety or substantially an entirety of the outermost peripheral portion of the coil conductor pattern.

13. The actuator according to claim 11 , wherein the parallel conductor portion includes a straight portion in which the plurality of linear conductor patterns are linearly parallel or substantially parallel to each other, and a connecting portion that connects the linear conductor patterns to each other near a center of the straight portion.

14. A method of manufacturing a resin multilayer substrate comprising:
a coil conductor forming step of forming a plurality of coil conductor patterns on two or more resin layers; and
a stacked body forming step of stacking, after the coil conductor forming step, a plurality of the resin layers including the two or more resin layers on which the plurality of coil conductor patterns are formed, and subjecting the plurality of stacked resin layers to hot pressing to form a stacked body; wherein
the coil conductor forming step includes a step of forming a coil conductor pattern including a parallel conductor portion in which a plurality of linear conductor patterns connected in parallel to each other are in parallel or substantially in parallel in at least a portion of an outermost peripheral portion, and a total line width of the plurality of linear conductor patterns is larger than a line width of other portions of the coil conductor pattern.

15. The method of manufacturing a resin multilayer substrate according to claim 14 , wherein the parallel conductor portion is formed on an entirety or substantially an entirety of the outermost peripheral portion of the coil conductor pattern.

16. The method of manufacturing a resin multilayer substrate according to claim 14 , wherein the parallel conductor portion includes a straight portion in which the plurality of linear conductor patterns are linearly parallel or substantially parallel to each other, and a connecting portion that connects the linear conductor patterns to each other near a center of the straight portion.

17. The method of manufacturing a resin multilayer substrate according to claim 14 , wherein the coil conductor pattern including the parallel conductor portion is formed closest to a surface layer in a stacking direction of the plurality of resin layers among the plurality of coil conductor patterns.

18. The method of manufacturing a resin multilayer substrate according to claim 14 , wherein
the stacked body includes a first main surface and a second main surface that oppose each other in a stacking direction of the plurality of resin layers; and
the coil conductor pattern including the parallel conductor portion is formed closest to the first main surface among the plurality of coil conductor patterns.

19. The method of manufacturing a resin multilayer substrate according to claim 14 , wherein a plurality of the coil conductor patterns including the parallel conductor portion are formed.

20. The method of manufacturing a resin multilayer substrate according to claim 19 , wherein
the stacked body includes a first main surface and a second main surface that oppose each other in a stacking direction of the plurality of resin layers; and
the plurality of the coil conductor patterns including the parallel conductor portion are formed at a position closest to the first main surface and a position closest to the second main surface, respectively, among the plurality of coil conductor patterns.

Assignees

• Murata Manufacturing Co

Inventors

• Ito Shingo

Classifications

• H02K3/26 Primary

  consisting of printed conductors · CPC title

• H01F41/04

  for manufacturing coils {(coils for transformer or inductances H01F27/28)} · CPC title

• H05K3/46

  Manufacturing multilayer circuits · CPC title

• H05K1/16

  incorporating printed electric components, e.g. printed resistors, capacitors or inductors · CPC title

• H01F5/00

  Coils (superconducting coils H01F6/06; fixed inductances of the signal type H01F17/00) · CPC title