Electronic device including antenna module having heat transfer member extending therefrom

Patent metadata

Field	Value
Publication number	US-11289790-B2
Application number	US-202017025096-A
Country	US
Kind code	B2
Filing date	Sep 18, 2020
Priority date	Sep 19, 2019
Publication date	Mar 29, 2022
Grant date	Mar 29, 2022

Abstract

An electronic device is provided. The electronic device includes a housing, an antenna module disposed along an inner wall of the housing, and a heat dissipation member disposed inside the housing. The antenna module may include a first circuit board including a plurality of layers, wherein the plurality of layers include a plurality of conductive layers and a plurality of non-conductive layers, and the conductive layer and the non-conductive layer are alternately stacked, at least one integrated circuit mounted on the first circuit board, an antenna array disposed on any one of the plurality of layers and electrically coupled with the at least one integrated circuit, and a heat transfer member including a conductive member extending from any one conductive layer among the plurality of conductive layers and a non-conductive member surrounding, at least in part, the conductive member.

First claim

What is claimed is:

1. An electronic device comprising:
a housing;
an antenna module disposed along an inner wall of the housing; and
a heat dissipation member disposed inside the housing,
wherein the antenna module comprises:
a first circuit board comprising a plurality of layers, wherein the plurality of layers comprise a plurality of conductive layers and a plurality of non-conductive layers, and the conductive layer and the non-conductive layer are alternately stacked;
at least one integrated circuit mounted on the first circuit board;
an antenna array disposed on any one of the plurality of layers and electrically coupled with the at least one integrated circuit; and
a heat transfer member comprising a conductive member extending from any one conductive layer among the plurality of conductive layers and a non-conductive member surrounding, at least in part, the conductive member, and

wherein the heat transfer member is coupled to the heat dissipation member and is configured to transfer heat generated from the antenna module to the heat dissipation member.

2. The electronic device of claim 1 ,
wherein the any one conductive layer among the plurality of conductive layers comprises a first conductive layer and a second conducive layer, and
wherein the conductive member comprises a first conductive member extending from the first conductive layer and a second conductive member extending from the second conductive layer.

3. The electronic device of claim 2 , wherein the antenna module comprises an insulation layer disposed between the first conductive layer and the second conductive layer.

4. The electronic device of claim 1 , wherein the heat dissipation member distributes heat of a heat source disposed inside the electronic device, and the heat dissipation member comprises a heat pipe, a vapor chamber, or a graphite sheet.

5. The electronic device of claim 4 , wherein the heat source comprises at least one of a display driver integrated (DDI) circuit or a wireless charging coil.

6. The electronic device of claim 1 , further comprising:
a second circuit board disposed inside the housing,
wherein the second circuit board comprises a conductive plate, and
wherein the heat transfer member is coupled to the conductive plate.

7. The electronic device of claim 1 ,
wherein at least one layer among the plurality of layers is disposed between the any one conductive layer and the at least one integrated circuit,
wherein the antenna module further comprises a conductive via which is in contact with part of a surface of the any one conductive layer and part of a surface of the least one integrated circuit, and
wherein the conductive via penetrates the at least one layer.

8. The electronic device of claim 7 , wherein the conductive via transfers heat generated from the least one integrated circuit to the heat transfer member through the any one conductive layer.

9. The electronic device of claim 1 , further comprising:
a support member disposed inside the housing and constructing a protrusion for supporting the antenna module,
wherein one face of the antenna module is in contact with the protrusion.

10. The electronic device of claim 9 , wherein the heat transfer member comprises a soft material.

11. The electronic device of claim 10 , wherein the heat transfer member extends along one face of the protrusion, and extends by being bent at an end portion of the protrusion.

12. The electronic device of claim 11 ,
wherein the heat dissipation member is attached to one face of the housing located in a direction facing the protrusion, and
wherein the heat transfer member extends from one end of the protrusion towards the heat dissipation member.

13. The electronic device of claim 11 , wherein the heat transfer member extends along the other face of the protrusion, and is coupled to the heat dissipation member.

14. The electronic device of claim 10 , wherein the conductive member comprises a copper thin film, and wherein the non-conductive member comprises a polyimide (PI) layer surrounding the copper thin film.

15. The electronic device of claim 1 , wherein the least one integrated circuit comprises at least one of a radio frequency integrated Circuit (RFIC) or a power management integrated circuit (PMIC).

16. An electronic device comprising:
a housing;
an antenna module disposed along an inner wall of the housing;
a heat dissipation member spaced apart from the antenna module and disposed inside the housing; and
a first circuit board disposed inside the housing and electrically coupled with the antenna module,
wherein the antenna module comprises:
a second circuit board comprising a plurality of layers, wherein the plurality of layers are constructed of a plurality conductive layers and a plurality of non-conductive layers alternatively stacked with the conductive layers;
at least one integrated circuit mounted on the second circuit board;
an antenna array disposed to any one layer among the plurality of layers and electrically coupled with the least one integrated circuit;
a first non-conductive layer disposed to at least one face of the any one layer to which the antenna array is disposed; and
a heat transfer member comprising a conductive member extending from any one conductive layer among the plurality of conductive layers and a non-conductive member surrounding, at least in part, the conductive member, and

wherein the heat transfer member transfers heat generated from the at least one integrated circuit to the heat dissipation member.

17. The electronic device of claim 16 ,
wherein the any one conductive layer comprises a first conductive layer and a second conductive layer, and
wherein the conductive member comprises a first conductive member extending from the first conductive layer and a second conductive member extending from the second conductive layer.

18. The electronic device of claim 17 , wherein the antenna module comprises an insulation layer disposed between the first conductive layer and the second conductive layer.

19. The electronic device of claim 16 ,
wherein at least one layer among the plurality of layers is disposed between the any one conductive layer and the least one integrated circuit,
wherein the antenna module comprises a conductive via which is in contact with part of a surface of the any one conductive layer and part of a surface of the least one integrated circuit, and
wherein the conductive via penetrates the at least one layer.

20. The electronic device of claim 16 , wherein the conductive member comprises a copper thin film of a soft material, and the non-conductive member comprises a polyimide (PI) layer.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Park Jungmin
• Seo Chonghwa
• Son Dongil
• Lee Jongwon
• Ha Sangwon

Classifications

• H01Q1/2283

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title

• H01Q1/02 Primary

  Arrangements for de-icing; Arrangements for drying-out {; Arrangements for cooling; Arrangements for preventing corrosion} · CPC title

• H01Q21/00

  Antenna arrays or systems (arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system H01Q3/00) · CPC title

• H05K2201/10098

  Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas · CPC title

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title