Board-to-board interconnect apparatus including microstrip circuits connected by a waveguide, wherein a bandwidth of a frequency band is adjustable

Patent metadata

Field	Value
Publication number	US-11289788-B2
Application number	US-202016874213-A
Country	US
Kind code	B2
Filing date	May 14, 2020
Priority date	Mar 3, 2015
Publication date	Mar 29, 2022
Grant date	Mar 29, 2022

Abstract

Disclosed is a chip-to-chip interface using a microstrip circuit and a dielectric waveguide. A board-to-board interconnection device, according to one embodiment of the present invention, comprises: a waveguide which has a metal cladding and transmits a signal from a transmitter-side board to a receiver-side board; and a microstrip circuit which is connected to the waveguide and has a microstrip-to-waveguide transition (MWT), wherein the microstrip circuit matches a microstrip line and the waveguide, adjusts the bandwidth of a predetermined first frequency band among the frequency bands of the signal, and provides same to the receiver.

First claim

What is claimed is:

1. A board-to-board interconnect apparatus comprising:
a waveguide which transmits a signal from a board on the side of a transmitter to a board on the side of a receiver and has a metal cladding; and
a respective microstrip circuit which is formed on each of the transmitter-side board and the receiver-side board,
wherein each of the microstrip circuit formed on the transmitter-side board and the microstrip circuit formed on the receiver-side board is connected to the waveguide and has a microstrip-to-waveguide transition (MWT),
wherein the microstrip circuit formed on the transmitter-side board and the microstrip circuit formed on the receiver-side board adjust a bandwidth of a first predetermined frequency band of the signal, and
wherein the bandwidth of the first predetermined frequency band is adjusted by adjusting a slope of a lower cutoff frequency band of the signal.

2. The board-to-board interconnect apparatus of claim 1 , wherein each of the microstrip circuit formed on the transmitter-side board and the microstrip circuit formed on the receiver-side board comprises:
a microstrip feeding line which supplies the signal in a first layer of a corresponding board;
a probe element which adjusts the bandwidth of the first predetermined frequency band;
a slotted ground plane including a slot for minimizing a ratio of reverse-traveling waves to forward-traveling waves in a second layer of the corresponding board, wherein the forward-traveling waves travel from the respective microstrip circuit to the waveguide, and the reverse-traveling waves travel from the waveguide to the respective microstrip circuit;
a ground plane including vias for forming an electrical connection between the slotted ground plane and the ground plane in a third layer of the corresponding board; and
a patch which is disposed in the third layer and is electrically isolated from the ground plane, and radiates the signal at a resonance frequency.

3. The board-to-board interconnect apparatus of claim 2 , wherein the probe element has a characteristic impedance greater than a characteristic impedance of the microstrip feeding line.

4. The board-to-board interconnect apparatus of claim 2 , wherein the probe element is connected to an end of the microstrip feeding line, and has a predetermined width and length.

5. The board-to-board interconnect apparatus of claim 4 , wherein the length of the probe element is determined based on a wavelength of the resonance frequency.

6. The board-to-board interconnect apparatus of claim 4 , wherein the width of the probe element is 40% to 80% of a width of the microstrip feeding line.

7. A microstrip circuit comprising:
a microstrip feeding line which supplies a signal in a first layer of a board;
a probe element which is connected to the microstrip feeding line and adjusts a bandwidth of a first predetermined frequency band of the signal;
a slotted ground plane including a slot for minimizing a ratio of reverse-traveling waves to forward-traveling waves in a second layer of the board, wherein the forward-traveling waves travel from the microstrip circuit to a waveguide connected to the microstrip circuit, and the reverse-traveling waves travel from the waveguide to the microstrip circuit;
a ground plane including vias for forming an electrical connection between the slotted ground plane and the ground plane in a third layer of the board on which the microstrip circuit is formed; and
a patch which is disposed in the third layer and electrically isolated from the ground plane, and radiates the signal at a resonance frequency,
wherein the bandwidth of the first predetermined frequency band of the signal is adjusted by adjusting a slope of a lower cutoff frequency band of the signal.

8. The microstrip circuit of claim 7 , wherein the probe element has a characteristic impedance greater than a characteristic impedance of the microstrip feeding line.

9. The microstrip circuit of claim 7 , wherein the probe element is connected to an end of the microstrip feeding line, and has a predetermined width and length.

10. The microstrip circuit of claim 9 , wherein the width of the probe element is 40% to 80% of a width of the microstrip feeding line.

11. The microstrip circuit of claim 9 , wherein the length of the probe element is determined based on a wavelength of the resonance frequency.

Assignees

• Korea Advanced Inst Sci & Tech

Inventors

• Bae Hyeon Min
• Song Ha Il
• Jin Huxian

Classifications

• H01P5/1007

  Microstrip transitions to Slotline or finline · CPC title

• H01P5/087 Primary

  Transitions to a dielectric waveguide · CPC title

• H01P1/00

  Auxiliary devices (coupling devices of the waveguide type H01P5/00) · CPC title

• H01P3/081 Primary

  Microstriplines · CPC title

• H01P3/16

  Dielectric waveguides, i.e. without a longitudinal conductor · CPC title