Cover plate for flexible substrate, and flexible display device

Patent metadata

Field	Value
Publication number	US-11289671-B2
Application number	US-201916565944-A
Country	US
Kind code	B2
Filing date	Sep 10, 2019
Priority date	Feb 19, 2019
Publication date	Mar 29, 2022
Grant date	Mar 29, 2022

Abstract

The present disclosure provides a cover plate for a flexible substrate which includes a first hardened layer, a second hardened layer and a polymer thin film layer provided between the first hardened layer and the second hardened layer, wherein a hardness of the first hardened layer is less than that of the second hardened layer, a hardness of the polymer thin film layer is less than that of the first hardened layer, and a bending radius of the first hardened layer is greater than that of the second hardened layer.

First claim

What is claimed is:

1. A cover plate for a flexible substrate, comprising a first hardened layer, a second hardened layer and a polymer thin film layer provided between the first hardened layer and the second hardened layer, wherein a hardness of the first hardened layer is less than a hardness of the second hardened layer, a hardness of the polymer thin film layer is less than a hardness of the first hardened layer, a bending radius of the first hardened layer is greater than a bending radius of the second hardened layer, and the first hardened layer is composes of polysiloxane; the second hardened layer is composed of acrylic.

2. The cover plate of claim 1 , wherein a pencil hardness of the second hardened layer is greater than or equal to 9H; a pencil hardness of the first hardened layer ranges from 6H to 8H.

3. The cover plate of claim 1 , wherein a tensile modulus of the polymer thin film layer is greater than a tensile modulus of the first hardened layer, and is less than a tensile modulus of the second hardened layer; the tensile modulus of the polymer thin film layer ranges from 6 GPa to 9 GPa, the tensile modulus of the second hardened layer ranges from 10 GPa to 15 GPa, and the tensile modulus of the first hardened layer ranges from 9 GPa to 12 GPa.

4. The cover plate of claim 2 , wherein a tensile modulus of the polymer thin film layer is greater than a tensile modulus of the first hardened layer, and is less than a tensile modulus of the second hardened layer; the tensile modulus of the polymer thin film layer ranges from 6 GPa to 9 GPa, the tensile modulus of the second hardened layer ranges from 10 GPa to 15 GPa, and the tensile modulus of the first hardened layer ranges from 9 GPa to 12 GPa.

5. The cover plate of claim 1 , wherein the polymer thin film layer is any single film selected from a polyimide thin film, a polymethyl methacrylate thin film, and a polyethylene naphthalate thin film, or a composite film formed by stacking at least two films selected from a polyimide thin film, a polymethyl methacrylate thin film, and a polyethylene naphthalate thin film.

6. The cover plate of claim 5 , wherein a thickness of the second hardened layer ranges from 5 μm to 25 μm, a thickness of the first hardened layer ranges from 5 μm to 25 μm, and a thickness of the polymer thin film layer ranges from 40 μm to 100 μm.

7. The cover plate of claim 4 , wherein the polymer thin film layer is any single film selected from a polyimide thin film, a polymethyl methacrylate thin film, and a polyethylene naphthalate thin film, or a composite film formed by stacking at least two films selected from a polyimide thin film, a polymethyl methacrylate thin film, and a polyethylene naphthalate thin film.

8. The cover plate of claim 1 , wherein a thickness of the second hardened layer ranges from 5 μm to 25 μm, a thickness of the first hardened layer ranges from 5 μm to 25 μm, and a thickness of the polymer thin film layer ranges from 40 μm to 100 μm.

9. The cover plate of claim 7 , wherein a thickness of the second hardened layer ranges from 5 μm to 25 μm, a thickness of the first hardened layer ranges from 5 μm to 25 μm, and a thickness of the polymer thin film layer ranges from 40 μm to 100 μm.

10. The cover plate of claim 1 , wherein a side of the first hardened layer or the second hardened layer distal to the polymer thin film layer is provided with an adhesive layer thereon.

11. The cover plate of claim 10 , wherein a pencil hardness of the second hardened layer is greater than or equal to 9H; a pencil hardness of the first hardened layer ranges from 6H to 8H; a tensile modulus of the polymer thin film layer is greater than a tensile modulus of the first hardened layer, and is less than a tensile modulus of the second hardened layer, the tensile modulus of the polymer thin film layer ranges from 6 GPa to 9 GPa, the tensile modulus of the second hardened layer ranges from 10 GPa to 15 GPa, and the tensile modulus of the first hardened layer ranges from 9 GPa to 12 GPa; and the polymer thin film layer is any single film selected from a polyimide thin film, a polymethyl methacrylate thin film, and a polyethylene naphthalate thin film, or a composite film formed by stacking at least two films selected from a polyimide thin film, a polymethyl methacrylate thin film, and a polyethylene naphthalate thin film; a thickness of the second hardened layer ranges from 5 μm to 25 μm, a thickness of the first hardened layer ranges from 5 μm to 25 μm, and a thickness of the polymer thin film layer ranges from 40 μm to 100 μm.

12. The cover plate of claim 1 , wherein the cover plate has a bending region by which the cover plate is formed as a curved surface, and the second hardened layer in the bending region has a patterned pattern to form, in the second hardened layer, a plurality of spaces in which no second hardened layer is coated therein.

13. The cover plate of claim 12 , wherein a pencil hardness of the second hardened layer is greater than or equal to 9H; and a pencil hardness of the first hardened layer ranges from 6H to 8H.

14. The cover plate of claim 12 , wherein a tensile modulus of the polymer thin film layer is greater than a tensile modulus of the first hardened layer, and is less than a tensile modulus of the second hardened layer; the tensile modulus of the polymer thin film layer ranges from 6 GPa to 9 GPa, the tensile modulus of the second hardened layer ranges from 10 GPa to 15 GPa, and the tensile modulus of the first hardened layer ranges from 9 GPa to 12 GPa.

15. The cover plate of claim 12 , wherein the polymer thin film layer is any single film selected from a polyimide thin film, a polymethyl methacrylate thin film, and a polyethylene naphthalate thin film, or a composite film formed by stacking at least two films selected from a polyimide thin film, a polymethyl methacrylate thin film, and a polyethylene naphthalate thin film.

16. The cover plate of claim 12 , wherein a thickness of the second hardened layer ranges from 5 μm to 25 μm, a thickness of the first hardened layer ranges from 5 μm to 25 μm, and a thickness of the polymer thin film layer ranges from 40 μm to 100 μm.

17. A flexible display device comprising a flexible substrate and a cover plate provided on a side of the flexible substrate, the cover plate being the cover plate of claim 1 .

18. The flexible display device of claim 17 , wherein the flexible substrate is a curved flexible substrate, the cover plate is provided on a side of the flexible substrate having a smaller bending curvature, and the second hardened layer is disposed closer to the flexible substrate than the first hardened layer.

19. The flexible display device of claim 17 , wherein the flexible substrate is a curved flexible substrate, the cover plate is provided on a side of the flexible substrate having a larger bending curvature, and the first hardened layer is disposed closer to the flexible substrate than the second hardened layer.

Assignees

• Boe Technology Group Co Ltd

Inventors

• Shi Yongxiang
• Tsai Paoming
• Bu Dejun
• Cai Peng
• Zhang Jiahao
• Du Shuang

Classifications

• H10K50/80

  Constructional details · CPC title

• H10K77/111 Primary

  Flexible substrates · CPC title

• Y02E10/549

  Organic PV cells · CPC title

• H01L51/52 Primary

  Electricity · mapped topic

• H01L51/0097

  Electricity · mapped topic