Die bonder incorporating rotatable adhesive dispenser head

US11289445B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11289445-B2
Application numberUS-201816231637-A
CountryUS
Kind codeB2
Filing dateDec 24, 2018
Priority dateDec 24, 2018
Publication dateMar 29, 2022
Grant dateMar 29, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An adhesive dispenser for a die bonding apparatus has an adhesive dispenser head configured to dispense adhesive onto bonding pads of a substrate, and a head conveyer configured to convey the adhesive dispenser head along orthogonal first and second axes for dispensing the adhesive onto target dispensing positions on the bonding pads. The head conveyor includes a first linear positioning motor operative to convey the adhesive dispenser head along the first axis and a rotary positioning motor coupled to the first linear positioning motor which is operative to rotate the adhesive dispenser head. The rotary positioning motor is configured to cooperate with the first linear positioning motor to convey the adhesive dispenser head along the second axis to the target dispensing positions.

First claim

Opening claim text (preview).

The invention claimed is: 1. An adhesive dispenser for a die bonding apparatus, comprising: an adhesive dispenser head configured to dispense adhesive onto bonding pads of a substrate; and a head conveyor configured to convey the adhesive dispenser head along orthogonal first and second axes for dispensing the adhesive onto target dispensing positions on the bonding pads, the head conveyor comprising a first linear positioning motor operative to convey the adhesive dispenser head along the first axis and a rotary positioning motor coupled to the first linear positioning motor which is operative to rotate the adhesive dispenser head, the rotary positioning motor being configured to cooperate solely with the first linear positioning motor to convey the adhesive dispenser head along the second axis to multiple target dispensing positions; wherein the rotary positioning motor is configured to rotate the adhesive dispenser head about a third axis which is orthogonal to the first and second axes. 2. The adhesive dispenser of claim 1 , wherein the first linear positioning motor is configured to cooperate with the rotary positioning motor to apply a correction displacement along the first axis upon rotation of the adhesive dispenser head to convey the adhesive dispenser head to the target dispensing positions. 3. The adhesive dispenser of claim 1 , wherein the first linear positioning motor is configured to cooperate with the rotary positioning motor to apply a first correction displacement along the first axis upon a first rotation of the adhesive dispenser head to convey the adhesive dispenser head to a first target dispensing position and to apply a second correction displacement along the first axis upon a second rotation of the adhesive dispenser head to convey the adhesive dispenser head to a second target dispensing position. 4. The adhesive dispenser of claim 1 , wherein the head conveyor is configured to convey the adhesive dispenser head along the third axis. 5. The adhesive dispenser of claim 1 , wherein the head conveyor comprises a dispenser head mount rotatable about the third axis by the rotary positioning motor and the adhesive dispenser head is received by the dispenser head mount. 6. The adhesive dispenser of claim 1 , wherein a dispenser head mount, the adhesive dispenser head and the rotary positioning motor are configured to align their centre of gravity about the third axis. 7. The adhesive dispenser of claim 6 , wherein the adhesive dispenser head has an elongate axis and the dispenser head mount is configured to receive the adhesive dispenser head to position the elongate axis non-orthogonally with respect to the first, second and third axes. 8. The adhesive dispenser of claim 6 , wherein the head conveyor comprises a first axis slide mount displaceable along the first axis by the first linear positioning motor and the dispenser head mount is received by the first axis slide mount. 9. The adhesive dispenser of claim 8 , wherein the dispenser head mount depends from the first axis slide mount and is displaceable along the first axis by the first linear positioning motor. 10. The adhesive dispenser of claim 8 , wherein the head conveyor comprises a third axis slide mount displaceable along the third axis by a third axis linear positioning motor and the first axis slide mount is received by the third axis slide mount. 11. The adhesive dispenser of claim 10 , wherein the first axis slide mount depends from the third axis slide mount and is displaceable along the third axis by the third axis linear positioning motor. 12. The adhesive dispenser of claim 10 , wherein the third axis slide mount is recessed to prevent contact with the adhesive dispenser head. 13. The adhesive dispenser of claim 10 , wherein the head conveyor comprises a second axis slide mount displaceable along the second axis by a second axis linear positioning motor and the third axis slide mount received by the second axis slide mount. 14. The adhesive dispenser of claim 13 , wherein the third axis slide mount depends from the second axis slide mount and is displaceable along the second axis by the second axis linear positioning motor. 15. The adhesive dispenser of claim 13 , wherein the second axis slide mount comprises a first mount part and a second mount part, the first mount part is located in a fixed position with respect to the substrate and the second mount part is displaceable along the second axis with respect to the substrate. 16. The adhesive dispenser of claim 15 , wherein the third axis slide mount is received by the second mount part of the second axis slide mount.

Assignees

Inventors

Classifications

  • Means for storing or moving the material for the connector · CPC title

  • Means for aligning · CPC title

  • Means for moving chips, wafers or other parts, e.g. conveyor belts · CPC title

  • Apparatus therefor · CPC title

  • in liquid form, e.g. by dispensing droplets or by screen printing · CPC title

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What does patent US11289445B2 cover?
An adhesive dispenser for a die bonding apparatus has an adhesive dispenser head configured to dispense adhesive onto bonding pads of a substrate, and a head conveyer configured to convey the adhesive dispenser head along orthogonal first and second axes for dispensing the adhesive onto target dispensing positions on the bonding pads. The head conveyor includes a first linear positioning motor …
Who is the assignee on this patent?
Asm Tech Singapore Pte Ltd
What technology area does this patent fall under?
Primary CPC classification H10W72/0711. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 29 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).