Circuit assembly

Patent metadata

Field	Value
Publication number	US-11289261-B2
Application number	US-201716081753-A
Country	US
Kind code	B2
Filing date	Mar 8, 2017
Priority date	Mar 9, 2016
Publication date	Mar 29, 2022
Grant date	Mar 29, 2022

Abstract

A circuit assembly that includes an inductor including a core; a fixation member to which the inductor is fixed; a base that is attached to the core, wherein: the fixation member is made of a first material having a coefficient of thermal expansion larger than a coefficient of thermal expansion of the core, and the base is made of a second material having a coefficient of thermal expansion larger than the coefficient of thermal expansion of the core and smaller than the coefficient of thermal expansion of the fixation member; and an adhesive layer that is disposed between the base and the fixation member, and that bonds the base and the fixation member together.

First claim

The invention claimed is:

1. A circuit assembly comprising:
an inductor including a core;
a fixation member to which the inductor is fixed;
a base that is attached to the core and that includes a leg protruding toward the fixation member, wherein:
the fixation member is made of a first material having a coefficient of thermal expansion larger than a coefficient of thermal expansion of the core, and
the base is made of a second material having a coefficient of thermal expansion larger than the coefficient of thermal expansion of the core and smaller than the coefficient of thermal expansion of the fixation member; and
an adhesive layer that is disposed between the base and the fixation member, that is formed in a gap formed between the base and the fixation member by the leg, and that bonds the base and the fixation member together.

2. The circuit assembly according to claim 1 , wherein
the inductor is housed in a case, and
a bottom wall of the case forms the base.

3. The circuit assembly according to claim 1 , wherein
the leg includes a plurality of legs,
at least one of the plurality of legs is formed as a positioning leg, and the amount by which the positioning leg protrudes from a bottom face of the base is larger than that of the other legs, and
a positioning hole into which the positioning leg is inserted is formed in the fixation member at a position corresponding to the positioning leg.

4. The circuit assembly according to claim 1 , wherein the adhesive layer is made of a thermosetting adhesive.

5. The circuit assembly according to claim 1 , wherein the fixation member is a heat sink made of a metal.

6. The circuit assembly according to claim 1 , wherein the fixation member is a glass epoxy substrate.

Assignees

• Autonetworks Technologies Ltd
• Sumitomo Wiring Systems
• Sumitomo Electric Industries

Inventors

• Tsuchida Toshiyuki
• Yamane Shigeki
• Maeda Hirotoshi
• Ota Takuya
• Aichi Junya

Classifications

• H01F27/02

  Casings · CPC title

• H05K1/021

  Components thermally connected to metal substrates or heat-sinks by insert mounting · CPC title

• H01F27/022

  Encapsulation · CPC title

• H01F17/045

  with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core · CPC title

• H01F27/2823

  Wires (H01F27/2866 takes precedence) · CPC title