Apparatus and method for thermal dissipation of photonic transceiving module

Patent metadata

Field	Value
Publication number	US-11287586-B2
Application number	US-202017095269-A
Country	US
Kind code	B2
Filing date	Nov 11, 2020
Priority date	Sep 20, 2019
Publication date	Mar 29, 2022
Grant date	Mar 29, 2022

Abstract

An apparatus for dissipating heat from a photonic transceiver module. The apparatus includes a top-plate member disposed in a length direction of a package for the photonic transceiver module. The apparatus further includes multiple fins formed on the top-plate member along the length direction from a backend position to a frontend position except at least one fin with a shorter length, forming an elongated void from the backend position to one backend of the at least one fin. Additionally, the apparatus includes a cover member disposed over the multiple fins with a horizontal sheet, two vertical side sheets, and a flange bent vertically from a middle portion of backend of the horizontal sheet. Furthermore, the apparatus includes a spring loaded in the elongated void between the flange and the one backend of the at least one fin to minimize an air gap at the backend of the horizontal sheet.

First claim

What is claimed is:

1. An apparatus for dissipating heat, from a photonic module, the apparatus comprising:
a top-plate member disposed in a length direction of a package for the photonic module;
a plurality of fins with one length formed on the top-plate member along the length direction of the package for the photonic module from a backend position of the plurality of fins near a middle of the top-plate member to a frontend position, an elongated void being formed from the backend position of the plurality of fins to a backend of at least one fin of the plurality of fins with a shorter length;
a cover member disposed over the plurality of tins with a horizontal sheet, two vertical side sheets, and a flange bent vertically from a middle portion of a backend of the horizontal sheet; and
a spring loaded in the elongated void between the flange and the one-backend of the at least one fin of the plurality of fins for pushing the cover member to slide backward beyond the backend position of the plurality of fins until the backend of the horizontal sheet is stopped against an internal thermal dissipation equipment.

2. The apparatus of claim 1 wherein the plurality of fins, the cover member, and the spring define an external heat sink that, is coupled to a face plate of the internal thermal dissipation equipment.

3. The apparatus of claim 2 wherein the plurality of fins is configured vertically on the top-plate member with a same height and a gap between any two neighboring ones of the plurality of fins throughout the one length of the plurality of fins with the backend position of the plurality of fins being separated by a gap distance of about 1 to 2 millimeters from the face plate of the internal thermal dissipation equipment as the photonic module is plugged in.

4. The apparatus of claim 3 wherein the plurality of fins comprises two outermost fins, each of the two outermost fins having two notches formed at an outer face thereof.

5. The apparatus of claim 4 wherein each of the two vertical side sheets of the cover member comprises two slots respectively for fitting the two notches so that the cover member is partially locked with the plurality of fins, each of the two slots having extra free spacing relative to the two notches larger than the gap distance in the length direction of the package for the photonic module.

6. The apparatus of claim 5 wherein the extra free spacing is configured to be larger than the gap distance for the cover member to move laterally along the length direction of the package for the photonic module as the spring pushes the backend of the horizontal sheet against the face plate of the internal thermal dissipation equipment.

7. The apparatus of claim 5 wherein the horizontal sheet, of the cover member is disposed to touch top ridges of the plurality of fins to form a plurality of air flow channels in gaps between two neighboring ones of the plurality of fins for pulling heat of the package for the photonic module into the internal thermal dissipation equipment to minimize an air gap between the backend of the horizontal sheet and the face plate of the internal thermal dissipation equipment.

8. The apparatus of claim 1 wherein the package for the photonic module comprises an optical transceiver module in Quad Small Form-Factor Pluggable (QSFP) specification.

9. The apparatus of claim 1 wherein the package for the photonic module comprises an optical transceiver module in Quad Small Form-Factor Pluggable Double Density (QSFP-DD) specification.

10. The apparatus of claim 1 wherein the package for the photonic module comprises an optical transceiver module in Quad Small Form-Factor Pluggable Double Density Type II (QSFP-DD type 2) specification.

11. A package structure comprising the apparatus of claim 1 for dissipating heat up to 20 W therefrom.

12. The package structure of claim 11 wherein the photonic module is configured to be an optical transceiver module in Quad Small Form-Factor Pluggable Double Density Type 11 (QSFP-DD type 2) specification.

13. A method of dissipating heat from a package for a photonic module, the method comprising:
setting a top-plate member disposed in a length direction of the package for photonic module;
forming a plurality of fins of one length on the top-plate member along the length direction of the package for the photonic module from a backend position of the plurality of fins near a middle of the top-plate member to a frontend position, an elongated void being formed from the backend position of the plurality of fins to a backend of at least one fin of the plurality of fins with a shorter length;
disposing a cover over the plurality of fins with a horizontal sheet, two vertical side sheets, and a flange bent vertically from a middle portion of a backend of the horizontal sheet; and
loading a spring in the elongated void between the flange and the backend of the at least, one fin of the plurality of fins for pushing the cover member backward beyond the backend position of the plurality of fins until the backend of the horizontal sheet is stopped against an internal thermal dissipation equipment.

14. The method of claim 13 wherein providing the plurality of fins, the cover member, and the spring forms an external heat sink coupled to a face plate of the internal thermal dissipation equipment for the photonic module.

15. The method of claim 14 wherein forming the plurality of fins comprises configuring each fin vertically with a height on the top-plate member and laterally with a gap between any two neighboring fins throughout the one length of the plurality of fins with the backend position of the plurality of fins being separated by a gap distance of about 1 to 2 millimeters from the face plate of the internal thermal dissipation equipment as the photonic module is plugged in.

16. The method of claim 15 wherein forming the plurality of fins comprises forming two notches at each outer surface of two of the plurality of tins located at two outermost locations among the plurality of fins.

17. The method of claim 16 wherein disposing the cover member comprises having two slots formed at the two vertical side sheets to fit with the two notches for partially locking the cover member with the plurality of fins, each of the two slots having extra free spacing relative to the two notches larger than the gap distance in the length direction of the package for the photonic module.

18. The method of claim 17 wherein the extra free spacing is configured to be larger than the gap distance for the cover member to be moveable laterally along the length direction of the package as the spring pushes the backend of the horizontal sheet against the face plate of the internal thermal dissipation equipment.

19. The method of claim 15 wherein disposing the cover member further comprises forming a plurality of air flow channels for pulling heat of the package through the plurality of fins into the internal thermal dissipation equipment to minimize an air gap between the backend of the horizontal sheet and the face plate of the internal thermal dissipation equipment.

20. The method of claim 19 wherein forming the plurality of air flow channels to minimize the air gap between the backend of the horizontal sheet and the face plate of the internal thermal dissipation equipment further comprises providing thermal dissipation up to 20 W in heat power.

Assignees

• Marvell Asia Pte Ltd

Inventors

• Togami Chris
• Nagarajan Radhakrishnan L
• Sasser Gary
• Taylor Brian

Classifications

• G02B6/4269 Primary

  with heat sinks or radiation fins · CPC title

• F28F2215/08

  with openings, e.g. louvers · CPC title

• F28F2275/14

  by using form fitting connection, e.g. with tongue and groove · CPC title

• F28F1/14

  and extending longitudinally (F28F1/38 takes precedence) · CPC title

• H05K7/2049

  Pressing means used to urge contact, e.g. springs · CPC title