Heat sink

US11287192B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11287192-B2
Application numberUS-201615766793-A
CountryUS
Kind codeB2
Filing dateOct 4, 2016
Priority dateOct 8, 2015
Publication dateMar 29, 2022
Grant dateMar 29, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Provided is a heat sink having excellent heat dissipation efficiency by having excellent thermal diffusion characteristics in a planar direction of a heat receiving plate. The heat sink has the heat receiving plate that is thermally connected to a heating element, heat pipes that are thermally connected to the heat receiving plate and are formed from a tube body, and heat dissipation fins that are thermally connected to the heat receiving plate, wherein the heat pipes are provided in a plurality of layers in a vertical direction to a surface of the heat receiving plate, and in at least two layers of the plurality of layers, positions of the heat pipes on the surface of the heat receiving plate are not identical to each other.

First claim

Opening claim text (preview).

The invention claimed is: 1. A heat sink comprising: a heat receiving plate configured for thermal connection thermally connected to a heating element; heat pipes formed from a tube body thermally connected to the heat receiving plate; and heat dissipation fins thermally connected to the heat receiving plate, wherein the heat pipes are provided in a plurality of layers in a vertical direction to a surface of the heat receiving plate by having a first heat pipe layer and a second heat pipe layer laminated on the first heat pipe layer in a vertical direction to the surface of the heat receiving plate, wherein the first heat pipe layer is formed by a first heat pipe and a first heat conductor provided around the first heat pipe being thermally connected thereto, wherein the first heat pipe is fitted into a groove part of the first heat conductor, wherein the groove part has a shape and dimensions corresponding to a shape and dimensions of the first heat pipe, and wherein the second heat pipe layer is formed by a second heat pipe and a second heat conductor provided around the second heat pipe being thermally connected thereto, wherein the second heat pipe is fitted in a hole part of the second heat conductor, wherein the hole part has a shape and dimensions correspond to a shape and dimensions of the second heat pipe and in at least two layers of the plurality of layers, positions of the heat pipes on the surface of the heat receiving plate are not identical to each other, and wherein at least a portion of the first heat pipe is in contact with the second heat pipe layer, wherein the heat receiving plate and the heat dissipation fins overlap a whole of the first heat pipe layer and a whole of the second heat pipe layer in plan view, and the whole of the first heat pipe layer overlaps the whole of the second heat pipe layer in plan view, wherein the second heat conductor is a plate-like body, and the surface thereof is arranged in the parallel direction to a whole of the surface of the heat receiving plate, and wherein the heat dissipation fins, which are different from the second heat conductor, are erected such that the heat dissipation fins are vertical to a surface of the second heat pipe layer in a state in which the heat dissipation fins contact the second heat pipes and the second heat conductor in the second heat pipe layer via the plate-like body. 2. The heat sink according to claim 1 , wherein the heat pipes have a flat shape. 3. The heat sink according to claim 1 , wherein a shape of the heat pipes is U-shaped, linear, L-shaped, S-shaped, or channel-shaped. 4. The heat sink according to claim 1 , wherein at least a portion of the heat pipes is arranged at a same position as the heating element in plan view.

Assignees

Inventors

Classifications

  • characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

  • for cooling by change of state · CPC title

  • Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores · CPC title

  • having particular orientation, e.g. slanted, or being orientation-independent · CPC title

  • the conduits having a particular shape, e.g. non-circular cross-section, annular (F28D15/0241, F28D15/0266 take precedence) · CPC title

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What does patent US11287192B2 cover?
Provided is a heat sink having excellent heat dissipation efficiency by having excellent thermal diffusion characteristics in a planar direction of a heat receiving plate. The heat sink has the heat receiving plate that is thermally connected to a heating element, heat pipes that are thermally connected to the heat receiving plate and are formed from a tube body, and heat dissipation fins that …
Who is the assignee on this patent?
Furukawa Electric Co Ltd
What technology area does this patent fall under?
Primary CPC classification F28D15/0233. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Mar 29 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).