Process of making composite inorganic/polymer nanofibers
US-9217210-B2 · Dec 22, 2015 · US
US11286372B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11286372-B2 |
| Application number | US-201314012398-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 28, 2013 |
| Priority date | Aug 28, 2013 |
| Publication date | Mar 29, 2022 |
| Grant date | Mar 29, 2022 |
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The disclosed concept relates to compositions and methods for the manufacture of electrically resistive, thermally conductive electrical switching apparatus. The composition includes a polymer component and a nanofiber component. The thermal conductivity of the nanofiber component is higher than the thermal conductivity of the polymer component such that the electrical switching apparatus which includes the composition of the disclosed concept has improved heat dissipation as compared to an electrical switching apparatus constructed of the polymer component in the absence of the nanofiber component. Further, the disclosed concept relates to methods of towering the internal temperature of an electrically resistive, thermally conductive electrical switching apparatus by forming the internals of the apparatus, e.g., circuit breakers, and/or the enclosure from the composition of the disclosed concept.
Opening claim text (preview).
What is claimed is: 1. A thermally conductive, electrically non-conductive injection-molded circuit interrupter, comprising: a circuit interrupter, comprising: a single injection-molded polymer object, comprising: a polymer component having an outer surface; and a plurality of nanofibers composed of a polymer fiber material or polymer-containing fiber material and a filler, and deposited on or embedded in the outer surface of the polymer component, wherein the single injection-molded polymer object is both thermally conductive and electrically non-conductive, wherein the thermal conductivity of the filler is higher than the thermal conductivity of the polymer component, wherein the plurality of nanofibers imparts a surface thermal conductivity to the single injection-molded polymer object of the circuit interrupter, and the polymer component imparts electrical non-conductivity to the single injection-molded polymer object of the circuit interrupter, and wherein the circuit interrupter dissipates a greater amount of heat as compared to a circuit interrupter constructed of the injection-molded polymer object absent of the plurality of nanofibers. 2. The circuit interrupter of claim 1 , wherein the plurality of nanofibers is in a form of a mat or web. 3. The circuit interrupter of claim 2 , wherein the mat or web is porous. 4. The circuit interrupter of claim 1 , wherein the injection-molded object having the plurality of nanofibers deposited on or embedded in the outer surface is transparent. 5. An electrical switching apparatus, comprising: a single, thermally conductive, electrically non-conductive injection-molded polymer component, comprising: a polymer having an outer surface; and a plurality of nanofibers in a mat or web form directly deposited on or embedded in the outer surface of the injection-molded polymer component, the nanofibers composed of a polymer or polymer-containing fiber material, and a filler, wherein thermal conductivity of the filler is higher than thermal conductivity of the polymer, wherein the plurality of nanofibers imparts a surface thermal conductivity to the injection-molded polymer component, wherein the electrical switching apparatus dissipates a greater amount of heat as compared to an electrical switching apparatus constructed of the injection-molded polymer component absent of the plurality of nanofibers, and wherein the electrical switching apparatus is selected from the group consisting of a circuit breaker, circuit breaker enclosure, load center and load center enclosure.
Bases, casings, or covers (accommodating more than one switch or a switch and another electrical component H02B1/26) · CPC title
Cooling of switch parts (cooling of contacts H01H1/62) · CPC title
Application nanoparticles, e.g. nanotubes, integrated in switch components, e.g. contacts, the switch itself being clearly of a different scale, e.g. greater than nanoscale · CPC title
Use of metals, their alloys or their compounds, as filler · CPC title
Means for plasticising or homogenising the moulding material or forcing it into the mould {(combined with mould opening, closing or clamping devices B29C45/70)} · CPC title
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