Battery Cell Module Having a Cooling Element
US-2018358666-A1 · Dec 13, 2018 · US
DC link capacitor cooling system
US11282640B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11282640-B2 |
| Application number | US-201916382601-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 12, 2019 |
| Priority date | Apr 12, 2019 |
| Publication date | Mar 22, 2022 |
| Grant date | Mar 22, 2022 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A DC link capacitor cooling system having an integrated heat sink disposed across a bottom surface of a DC link capacitor with a dielectric thermal interface material covering the integrated heat sink, and a chassis contacting the dielectric thermal interface material, wherein the chassis has an active fluid coolant domain therein.
First claim
Opening claim text (preview).
What is claimed is: 1. A capacitor cooling system, comprising: a DC link capacitor having major and minor dimensions viewed from an overhead perspective; positive and negative busbars extending underneath the DC link capacitor; wherein one of the positive and negative busbars overlies the other of the positive and negative busbars and the busbars are separated by a first layer of dielectric thermal interface material; an integrated heat sink disposed across a bottom surface of the DC link capacitor, wherein the other of the positive and negative busbars is separated from the integrated heat sink by a second layer of dielectric thermal interface material; and wherein the heat sink is located on a chassis, and wherein the heat sink is separated from the chassis by a third layer of dielectric thermal interface material, and wherein the chassis has an active fluid coolant domain therein, and wherein the active fluid coolant domain has fluid passing therethrough, and wherein the active fluid coolant passes through a flow path that travels back and forth along the major dimension of the capacitor. 2. The capacitor cooling system of claim 1 , wherein the capacitor is a power film capacitor. 3. The capacitor cooling system of claim 1 , wherein the capacitor comprises positive and negative conductors sealed into an enclosure with dielectric resin. 4. The capacitor cooling system of claim 1 , wherein the DC link capacitor is used in an electric vehicle's power inverter module. 5. The capacitor cooling system of claim 1 , wherein the integrated heat sink is made of aluminum or copper.
Assignees
Inventors
Classifications
- H01G2/08Primary
Cooling arrangements; Heating arrangements; Ventilating arrangements · CPC title
Forced ventilation, e.g. on heat dissipaters coupled to components · CPC title
Liquid coolant without phase change · CPC title
Wound capacitors · CPC title
specially adapted for mounting on a chassis · CPC title
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Frequently asked questions
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- What does patent US11282640B2 cover?
- A DC link capacitor cooling system having an integrated heat sink disposed across a bottom surface of a DC link capacitor with a dielectric thermal interface material covering the integrated heat sink, and a chassis contacting the dielectric thermal interface material, wherein the chassis has an active fluid coolant domain therein.
- Who is the assignee on this patent?
- Karma Automotive Llc
- What technology area does this patent fall under?
- Primary CPC classification H01G2/08. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 22 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).