Optical coupling with undercut protection from underfill

Patent metadata

Field	Value
Publication number	US-11280971-B2
Application number	US-202016988890-A
Country	US
Kind code	B2
Filing date	Aug 10, 2020
Priority date	Aug 10, 2020
Publication date	Mar 22, 2022
Grant date	Mar 22, 2022

Abstract

An underfill adhesive may be used to mechanically stabilize a photonic integrated circuit chip (PIC) onto an electrical substrate; however, when the PIC is optically coupled to an external optical fiber at or near an edge of the chip, e.g. using an edge coupler, the underfill may flow into the optical interface impacting optical coupling quality. A photonic integrated circuit apparatus according to the disclosure comprises an electrical substrate, which includes a cavity underneath the edge coupler for preventing underfill material from entering the optical interface by impeding capillary action thereof.

First claim

I claim:

1. An apparatus comprising:
a photonic integrated circuit (PIC) chip including an optical device layer and an edge coupler for optically coupling the PIC chip to an adjacent end of an optical fiber, via an edge of the PIC chip;
an electrical substrate configured to support the PIC chip over a substantially planar surface of the electrical substrate; and
a layer of adhesive binding the PIC chip to the substantially planar surface of the electrical substrate;
wherein the substantially planar surface of the electrical substrate includes a surface of a cavity, the cavity being at least, partially located between the edge coupler and the electrical substrate.

2. The apparatus of claim 1 , wherein the cavity is partially filled with the adhesive and has a region under the PIC chip free of the adhesive.

3. The apparatus of claim 1 , wherein at least a part of meniscus of the adhesive is inside the cavity.

4. The apparatus of claim 1 , wherein the PIC chip has an outer planar surface facing the cavity, and wherein a portion of said outer planar surface adjacent the edge is free of the adhesive.

5. The apparatus of claim 1 , further comprising the optical fiber.

6. The apparatus according to claim 1 , wherein the cavity, at least, extends under the edge of the PIC chip.

7. The apparatus of claim 6 , wherein the cavity is partially filled with the adhesive and has a region under the PIC chip free of the adhesive.

8. The apparatus of claim 6 , wherein at least a part of meniscus of the adhesive is inside the cavity.

9. The apparatus of claim 6 , wherein the PIC chip has an outer planar surface facing the cavity and a portion of said outer planar surface adjacent the edge is free of the adhesive.

10. The apparatus of claim 6 , further comprising the optical fiber.

11. The apparatus of claim 1 , wherein the cavity extends through the electrical substrate.

12. The apparatus of claim 1 , wherein the PIC chip includes a pit in an outer major surface thereof, some of the adhesive being in the pit.

13. The apparatus of claim 1 , wherein the cavity extends from an inner wall under the PIC chip to an outer edge of the electrical substrate.

14. The apparatus of claim 1 , wherein the PIC chip includes a component extending to an outer surface thereof; and
wherein the electrical substrate also includes an additional cavity under the component.

15. The apparatus of claim 14 , further comprising an optical coupler configured to couple light between the component and the device layer; wherein the additional cavity is under an interface between the component and the device layer.

16. The apparatus of claim 14 , wherein the component comprises a light source.

17. The apparatus of claim 14 , wherein the component comprises a thermal phase tuner.

18. The apparatus of claim 1 , wherein the cavity extends from an inner wall under the PIC chip to an outer wall spaced from an outer edge of the electrical substrate.

19. The apparatus of claim 18 , wherein the outer wall is configured at an acute angle to a longitudinal axis of the edge coupler for aligning the optical fiber at the acute angle relative to the edge coupler.

20. The apparatus according to claim 18 , wherein the electrical substrate includes a fiber supporting section in between the outer wall and the outer edge of the electrical substrate.

Assignees

• Nokia Solutions & Networks Oy

Inventors

• Novack Ari

Classifications

• G02B6/30

  for use between fibre and thin-film device · CPC title

• G02B6/428

  containing printed circuit boards [PCB] · CPC title

• G02B6/4239 Primary

  Adhesive bonding; Encapsulation with polymer material · CPC title

• G02B6/4204

  the coupling comprising intermediate optical elements, e.g. lenses, holograms (encapsulated active devices H01S5/02208) · CPC title