Dual wavelength distributed temperature sensing with built-in fiber integrity monitoring

US11280687B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11280687-B2
Application numberUS-201816119807-A
CountryUS
Kind codeB2
Filing dateAug 31, 2018
Priority dateAug 31, 2018
Publication dateMar 22, 2022
Grant dateMar 22, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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In some examples, a temperature distribution sensor may include a laser source to emit a laser beam that is tunable to a first wavelength and a second wavelength for injection into a device under test (DUT). A first wavelength optical receiver may convert a return signal corresponding to the first wavelength with respect to Rayleigh backscatter or Raman backscatter Anti-Stokes. A second wavelength optical receiver may convert the return signal corresponding to the second wavelength with respect to Rayleigh backscatter or Raman backscatter Stokes. Bending loss associated with the DUT may be determined by utilizing the Rayleigh backscatter signal corresponding to the first wavelength and the Rayleigh backscatter signal corresponding to the second wavelength. Further, temperature distribution associated with the DUT may be determined by utilizing the Raman backscatter Anti-Stokes signal corresponding to the first wavelength and the Raman backscatter Stokes signal corresponding to the second wavelength.

First claim

Opening claim text (preview).

What is claimed is: 1. A temperature distribution sensor comprising: a laser source to emit a laser beam that is tunable to a first wavelength and to a second wavelength for injection into a device under test (DUT); a first wavelength optical receiver to convert a return signal corresponding to the first wavelength with respect to Rayleigh backscatter and Raman backscatter Anti-Stokes; a second wavelength optical receiver to convert a return signal corresponding to the second wavelength with respect to Rayleigh backscatter and Raman backscatter Stokes; a processor; and a memory storing machine readable instructions that when executed by the processor cause the processor to: determine bending loss associated with the DUT by utilizing the Rayleigh backscatter signal corresponding to the first wavelength and the Rayleigh backscatter signal corresponding to the second wavelength, wherein an incident signal associated with the first wavelength generates the Rayleigh backscatter signal corresponding to the first wavelength and the Raman backscatter Stokes signal corresponding to the second wavelength, and an incident signal associated with the second wavelength generates the Rayleigh backscatter signal corresponding to the second wavelength and the Raman backscatter Anti-Stokes signal corresponding to the first wavelength. 2. The temperature distribution sensor according to claim 1 , wherein the machine readable instructions, when executed by the processor, further cause the processor to: determine temperature distribution associated with the DUT by utilizing the Raman backscatter Anti-Stokes signal corresponding to the first wavelength and the Raman backscatter Stokes signal corresponding to the second wavelength. 3. The temperature distribution sensor according to claim 1 , wherein the DUT includes an optical fiber. 4. The temperature distribution sensor according to claim 1 , wherein the machine readable instructions, when executed by the processor, further cause the processor to: identify, by combining measurements associated with the Rayleigh backscatter signal and the Raman backscatter Anti-Stokes signal analyzed at the first wavelength, and the Rayleigh backscatter signal and the Raman backscatter Stokes signal analyzed at the second wavelength, a false temperature offset related to an attribute of the DUT. 5. The temperature distribution sensor according to claim 4 , wherein the attribute of the DUT includes the bending loss associated with the DUT. 6. The temperature distribution sensor according to claim 5 , wherein the bending loss associated with the DUT results in a wavelength sensitive loss-event in the DUT, and wherein the machine readable instructions, when executed by the processor, further cause the processor to: compensate for the wavelength sensitive loss-event in the DUT. 7. The temperature distribution sensor according to claim 6 , wherein the machine readable instructions, when executed by the processor, further cause the processor to: re-align an associated trace on both sides of the wavelength sensitive loss-event to compensate for the wavelength sensitive loss-event in the DUT. 8. The temperature distribution sensor according to claim 6 , wherein the machine readable instructions, when executed by the processor, further cause the processor to: perform local differential attenuation correction to compensate for the wave sensitive loss-event in the DUT.

Assignees

Inventors

Classifications

  • using elastic backscattering to detect the measured quantity, e.g. using Rayleigh backscattering · CPC title

  • at discrete locations in the fibre, e.g. using Bragg scattering · CPC title

  • Details of thermometers not specially adapted for particular types of thermometer (circuits for reducing thermal inertia G01K7/42) · CPC title

  • G01K11/32Primary

    using changes in transmittance, scattering or luminescence in optical fibres · CPC title

  • using inelastic backscattering to detect the measured quantity, e.g. using Brillouin or Raman backscattering · CPC title

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What does patent US11280687B2 cover?
In some examples, a temperature distribution sensor may include a laser source to emit a laser beam that is tunable to a first wavelength and a second wavelength for injection into a device under test (DUT). A first wavelength optical receiver may convert a return signal corresponding to the first wavelength with respect to Rayleigh backscatter or Raman backscatter Anti-Stokes. A second wavelen…
Who is the assignee on this patent?
Viavi Solutions Inc
What technology area does this patent fall under?
Primary CPC classification G01K11/3206. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Mar 22 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).