Variable inlet conductance vacuum pump, vacuum pump arrangement and method

Patent metadata

Field	Value
Publication number	US-11280340-B2
Application number	US-201916504985-A
Country	US
Kind code	B2
Filing date	Jul 8, 2019
Priority date	Jul 9, 2018
Publication date	Mar 22, 2022
Grant date	Mar 22, 2022

Abstract

A vacuum pump, vacuum pump arrangement and method are disclosed. The vacuum pump includes at least one rotor; and a stator, an inlet for receiving gas during operation; and an exhaust for exhausting the gas. The vacuum pump includes a shaft extending through a centre of said pump and comprising a plate mounted on an end of the shaft towards the inlet. The vacuum pump includes control circuitry configured to control an axial position of the plate, a change in axial position of the plate providing a change in inlet conductance of gas to the vacuum pump. The plate is mounted such that it extends beyond the inlet in at least some axial positions of the rotor such that the plate is not on the same side of the inlet as the stator.

First claim

The invention claimed is:

1. A vacuum pump comprising:
at least one rotor; and
a stator,
an inlet for receiving gas during operation; and
an exhaust for exhausting said gas; wherein
said vacuum pump comprises a shaft extending through said pump and comprising a plate mounted on an end of said shaft towards said inlet;
said vacuum pump comprising control circuitry configured to control an axial position of said plate, a change in axial position of said plate providing a change in inlet conductance of gas to said vacuum pump; wherein
said plate is mounted such that it extends beyond said inlet in at least some axial positions of said shaft such that said plate is not on the same side of said inlet as said stator,
wherein said shaft comprises a rotor shaft, said plate comprising a rotor plate configured to rotate with said rotor.

2. The vacuum pump according to claim 1 , wherein said plate is configured to close said inlet at a predefined axial position.

3. The vacuum pump according to claim 1 , said rotor plate comprising surface irregularities on a surface facing towards said inlet, said surface irregularities being configured to divert at least some particles within said gas towards said inlet.

4. The vacuum pump according to claim 1 , wherein said vacuum pump comprises a turbo pump.

5. The vacuum pump according to claim 4 , wherein said vacuum pump comprises a turbo pump stage backed by at least one further stage.

6. The vacuum pump according to claim 5 , wherein said at least one further stage comprises at least one of a drag and a regenerative stage.

7. The vacuum pump according to claim 5 , wherein said at least one further stage comprises a Siegbahn stage, said rotor comprising at least one rotating plate and said stator comprising at least one fixed plate, a distance between said at least one rotating plate and said at least one fixed plate being dependent upon said relative axial position of said stator to said rotor.

8. The vacuum pump according to claim 5 , wherein said turbo pump stage and said at least one further stage are mounted on the rotor shaft.

9. The vacuum pump according to claim 5 , wherein said turbo pump stage and said at least one further stage are mounted on different shafts.

10. The vacuum pump according to claim 1 , wherein said rotor and stator are mounted to be movable in an axial direction with respect to each other.

11. The vacuum pump according to claim 10 , wherein said rotor is positioned within said vacuum pump via electro-magnetic bearings, and said control circuitry is configured to control an axial position of said rotor by controlling a current supplied to electro-magnets associated with said bearings.

12. The vacuum pump according to claim 1 , wherein said control circuitry comprises an input configured to receive a signal indicative of a pressure produced by said vacuum pump, said control circuitry being configured to control a relative axial position of said rotor and said stator in dependence upon a value of said signal.

13. A vacuum arrangement comprising an outlet of a vacuum chamber and a vacuum pump according to claim 1 , said vacuum pump inlet being connected to said outlet of said vacuum chamber.

14. The vacuum arrangement according to claim 13 , said vacuum pump inlet being connected to said outlet of said vacuum chamber, wherein said control circuitry is configured to control said axial position of said plate by changing an axial position of said vacuum pump relative to said outlet of said vacuum chamber.

15. The vacuum arrangement according to claim 13 , further comprising a valve plate mounted on a different side of said vacuum chamber outlet than said stator of said vacuum pump, said plate and valve plate being configured for relative axial movement between an open position where gas can pass from said vacuum chamber into said vacuum pump and a closed position where said valve plate completely obscures at least one of said chamber outlet and said pump inlet such that gas cannot pass from said vacuum chamber to said vacuum pump.

16. The vacuum arrangement according to claim 15 , wherein said control circuitry is configured to control said axial position of said plate by changing an axial position of said vacuum pump relative to said outlet of said vacuum chamber and said valve plate comprises a recess and said plate is sized to fit within said recess.

17. The vacuum arrangement according to claim 13 , wherein said plate is operable to move axially with respect to said chamber outlet to partially obscure said pump inlet by varying amounts and thereby vary said inlet conductance.

18. A method of controlling a pumping capacity of a vacuum pump according claim 1 , said method comprising:
setting an axial position of said plate in dependence upon a required inlet conductance;
operating the vacuum pump;
determining a change of inlet conductance is required; and
setting a new axial position of said plate to provide a new required inlet conductance.

Assignees

• Edwards Ltd

Inventors

• Stones Ian David
• Bailey Christopher Mark

Classifications

• H10P72/00

  Handling or holding of wafers, substrates or devices during manufacture or treatment thereof · CPC title

• F04D27/0253

  by throttling (F04D27/0246 takes precedence) · CPC title

• F04D19/046

  Combinations of two or more different types of pumps · CPC title

• F04D25/08

  the working fluid being air, e.g. for ventilation · CPC title

• F04D29/524

  shiftable members for obturating part of the flow path · CPC title