Removal of electroplating bath additives

Patent metadata

Field	Value
Publication number	US-11280022-B2
Application number	US-202016903302-A
Country	US
Kind code	B2
Filing date	Jun 16, 2020
Priority date	Dec 28, 2017
Publication date	Mar 22, 2022
Grant date	Mar 22, 2022

Abstract

An example electroplating method comprises feeding fresh electrolyte solution into a bath reservoir via a first inlet of the bath reservoir, and bleeding used electrolyte solution out of the bath reservoir via first outlet of the bath reservoir. Recycled electrolyte solution is received into the bath reservoir via a second inlet of the bath reservoir, and electrolyte solution is discharged from the bath reservoir via a second outlet of the bath reservoir. By-products generated by a plating cell are extracted using an extraction column. A first particle filter is disposed in a fluid pathway between the second outlet of the bath reservoir and the inlet of the plating cell, and a second particle filter is disposed in a fluid pathway between the outlet of the extraction column and the second inlet of the bath reservoir. Flow control means are disposed between the plating cell and the bath reservoir and selectively return a portion of the electrolyte solution to the bath reservoir without passing the returned portion through the first or second filter.

First claim

What is claimed is:

1. An electroplating method comprising:
feeding fresh electrolyte solution into a bath reservoir via a first inlet of the bath reservoir;
bleeding used electrolyte solution out of the bath reservoir via a first outlet of the bath reservoir;
receiving recycled electrolyte solution into the bath reservoir via a second inlet of the bath reservoir;
discharging electrolyte solution from the bath reservoir via a second outlet of the bath reservoir;
electroplating an object using a plating cell, the plating cell having an inlet in direct or indirect fluid communication with the bath reservoir, and an outlet for discharge of electrolyte solution from the plating cell;
extracting by-products generated by the plating cell using an extraction column, the extraction column having an inlet in direct or indirect fluid communication with the outlet of the plating cell, and an outlet for discharge of electrolyte solution from the extraction column; and
providing a first particle filter disposed in a fluid pathway between the second outlet of the bath reservoir and the inlet of the plating cell;
providing a second particle filter disposed in a fluid pathway between the outlet of the extraction column and the second inlet of the bath reservoir; and
providing flow control means disposed between the plating cell and the bath reservoir, wherein the flow control means is in fluid communication with the outlet of the plating cell, the flow control means selectively returning a portion of the electrolyte solution to the bath reservoir without passing the returned portion through the first or second filter.

2. The electroplating method of claim 1 , further comprising reconditioning the extraction column during use of the plating cell, the reconditioning of the extraction including, at least:
isolating the extraction column from fluid communication with the plating cell;
draining the extraction column of the electrolyte solution;
rinsing the extraction column with a rinsing fluid containing one or more of water, a solvent, and an electrolyte;
draining the extraction column of the rinsing fluid;
placing the extraction column back into fluid communication with the plating cell; and
introducing plating solution into the extraction column.

3. The electroplating method of claim 2 , further comprising reconditioning the extraction column based on a monitored level of by-product or additive in the plating cell.

4. The electroplating method of claim 1 , wherein the extraction column includes a solids extraction matrix including an extraction material for capturing the byproduct generated by the plating cell.

5. The electroplating method of claim 4 , wherein the extraction material includes one or more of: an 18-carbon chain (C18), 8-carbon chain (C8), phenyl, cyanopropyl, and styrene-divinyl benzene.

6. The electroplating method of claim 4 , wherein the extraction material includes one or more of: Si—OH, Si—NH2, silica gel, and alumina.

7. The electroplating method of claim 4 , wherein the extraction material includes one or more of: an 18-carbon chain (C18), 8-carbon chain (C8), phenyl, cyanopropyl, and styrene-divinyl benzene.

8. The electroplating method of claim 4 , wherein the extraction material includes one or more of: amino propyl, carboxylic acid, quaternary amine, and sulfonic acid.

9. The electroplating method of claim 4 , wherein the extraction material includes one or more of: packed silica or polymer beads.

10. A machine-readable medium including instructions which, when read by a machine, cause the machine to control operations in an electroplating method, the electroplating method comprising, at least:
feeding fresh electrolyte solution into a bath reservoir via a first inlet of the bath reservoir;
bleeding used electrolyte solution out of the bath reservoir via first outlet of the bath reservoir;
receiving recycled electrolyte solution into the bath reservoir via a second inlet of the bath reservoir;
discharging electrolyte solution from the bath reservoir via a second outlet of the bath reservoir;
electroplating an object using a plating cell, the plating cell having an inlet in direct or indirect fluid communication with the bath reservoir, and an outlet for discharge of electrolyte solution from the plating cell;
extracting by-products generated by the plating cell using an extraction column, the extraction column having an inlet in direct or indirect fluid communication with the outlet of the plating cell, and an outlet for discharge of electrolyte solution from the extraction column; and
providing a first particle filter disposed in a fluid pathway between the second outlet of the bath reservoir and the inlet of the plating cell;
providing a second particle filter disposed in a fluid pathway between the outlet of the extraction column and the second inlet of the bath reservoir; and
providing flow control means disposed between the plating cell and the bath reservoir, wherein the flow control means is in fluid communication with the outlet of the plating cell, the flow control means selectively returning a portion of the electrolyte solution to the bath reservoir without passing the returned portion through the first or second filter.

Assignees

• Lam Res Corp

Inventors

• Spurlin Tighe A
• Reid Jonathan D

Classifications

• B01D36/00

  Filter circuits or combinations of filters with other separating devices · CPC title

• C25D3/38

  of copper · CPC title

• C25D3/12

  of nickel or cobalt · CPC title

• B01D15/10

  characterised by constructional or operational features · CPC title

• C25D7/12

  Semiconductors · CPC title