Silver/tin electroplating bath and method of using the same

US11280014B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11280014-B2
Application numberUS-202016893956-A
CountryUS
Kind codeB2
Filing dateJun 5, 2020
Priority dateJun 5, 2020
Publication dateMar 22, 2022
Grant dateMar 22, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.

First claim

Opening claim text (preview).

What is claimed is: 1. An electroplating bath composition comprising: a) a source of silver ions; b) a source of tin ions; c) an acid; d) a first complexing agent, wherein the first complexing agent is a dihydroxy bis-sulfide compound selected from the group consisting of 2,4-dithia-1,5-pentanediol, 2,5-dithia-1,6-hexanediol, 2,6-dithia-1,7-heptanediol, 2,7-dithia-1,8-octanediol, 2,8-dithia-1,9-nonanediol, 2,9-dithia-1,10-decanediol, 2,11-dithia-1,12-dodecanediol 5,8-dithia-1,12-dodecanediol 2,15-dithia-1,16-hexadecanediol, 2,21-dithia-1,22-doeicasanediol, 3,5-dithia-1,7-heptanediol, 3,6-dithia-1,8-octanediol, 3,8-dithia-1,10-decanediol, 3,10-dithia-1,8-(dodecanediol, 3,13-dithia-1,15-pentadecanediol, 3,18-dithia-1,20-eicosanediol, 4,6-dithia-1,9-nonanediol, 4,7-dithia-1,10-decanediol, 4,11-dithia-1,14-tetradecanediol, 4,15-dithia-1,18-octadecanediol, 4,19-dithia-1,22-dodeicosanediol, 5,7-dithia-1,1′-undecanediol, 5,9-dithia-1,13-tridecanediol, 5,13-dithia-1,17-heptadecanediol, 5,17-dithia-1,2′-uneicosanediol, 1,8-dimethyl-3,6-dithia-1,8-octanediol, and combinations of one or more of the forgoing; e) a second complexing agent, wherein the second complexing agent is a thiourea selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and f) optionally, a wetting agent; and g) optionally, an antioxidant. 2. The electroplating bath according to claim 1 , wherein the source of silver ions is selected from the group consisting of silver halides, silver gluconate, silver citrate, silver lactate, silver nitrate, silver sulfates, silver alkane sulfonates and silver alkanol sulfonates. 3. The electroplating bath according to claim 1 , wherein the source of tin ions is selected from the group consisting of tin halides, tin sulfates, tin alkane sulfonates, and tin alkanol sulfonates. 4. The electroplating bath according to claim 1 , wherein the acid is selected from the group consisting of methane sulfonic acid, ethane sulfonic acid and propane sulfonic acid, phenyl sulfonic acid, tolyl sulfonic acid, sulfuric acid, sulfamic acid, hydrochloric acid, hydrobromic acid and fluoroboric acid. 5. The electroplating bath according to claim 1 , wherein the source of silver ions is silver methane sulfonate, the source of tin ions is tin methane sulfonate, and the acid is methane sulfonic acid. 6. The electroplating bath according to claim 1 , wherein the first complexing agent comprises 3,6-dithia-1,8-octanediol. 7. The electroplating bath according to claim 1 , wherein the second complexing agent is selected from the group consisting of N-Allyl-N′-(2-hydroxyethyl)thiourea, Allyl-thiourea, phenylthiourea, N,N′-dimethylthiourea, and combinations of one or more of the foregoing. 8. The electroplating bath according to claim 1 , wherein a reducing agent is present in the bath and is selected from the group consisting of hydroquinone, hydroquinone sulfonic acid, potassium salt and hydroxylated aromatic compounds. 9. The electroplating bath according to claim 1 , wherein the electroplating bath is configured to deposit a silver/tin alloy on a substrate containing at least 70% silver. 10. The electroplating bath according to claim 9 , wherein the electroplating bath is configured to deposit a silver tin alloy on a substrate containing between 70% to 95% silver. 11. The electroplating bath according to claim 1 , wherein the bath is maintained at a pH of less than about 5. 12. The electroplating bath according to claim 1 , wherein the bath is maintained at a temperature in the range of about room temperature to about 55° C. 13. A method of electroplating a silver/tin alloy onto the surface of a substrate, the method comprising the steps of: a) contacting the surface of the substrate with a silver/tin electroplating bath comprising: i) a source of silver ions; ii) a source of tin ions; iii) an acid; iv) a first complexing agent, wherein the first complexing agent is a dihydroxy bis-sulfide compound selected from the group consisting of 2,4-dithia-1,5-pentanediol, 2,5-dithia-1,6-hexanediol, 2,6-dithia-1,7-heptanediol, 2,7-dithia-1,8-octanediol, 2,8-dithia-1,9-nonanediol, 2,9-dithia-1,10-decanediol, 2,11-dithia-1,12-dodecanediol, 5,8-dithia-1,12-dodecanedial, 2,15-dithia-1,16-hexadecanediol, 2,21-dithia-1,22-doeicasanediol, 3,5-dithia-1,7-heptanediol, 3,6-dithia-1,8-octanediol, 3,8-dithia-1,10-decanediol, 3,10-dithia-1,8-(dodecanediol, 3,13-dithia-1,15-pentadecanediol, 3,18-dithia-1,20-eicosanediol, 4,6-dithia-1,9-nonanediol, 4,7-dithia-1,10-decanediol, 4,11-dithia-1,14-tetradecanediol, 4,15-dithia-1,18-octadecanediol, 4,19-dithia-1,22-dodeicosanediol, 5,7-dithia-1,1′-undecanediol, 5,9-dithia-1,13-tridecanediol, 5,13-dithia-1,17-heptadecanediol, 5,17-dithia-1,2′-uneicosanediol, 1,8-dimethyl-3,6-dithia-1,8-octanediol, and combinations of one or more of the forgoing; v) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and vi) optionally, a wetting agent; and vii) optionally, an antioxidant; wherein the electroplating bath deposits a silver/tin alloy on the surface of the substrate. 14. The process according to claim 13 , wherein the substrate comprises nickel. 15. A method of electroplating a silver/tin alloy onto the surface of a connector, wherein the connector is plated with a nickel barrier layer, the method comprising the steps of: a) contacting the connector with the nickel barrier layer thereon with a silver/tin electrolyte, the electrolyte comprising: i) a source of silver ions; ii) a source of tin ions; iii) an acid; iv) a first complexing agent, wherein the first complexing agent is a dihydroxy bis-sulfide compound selected from the group consisting of 2,4-dithia-1,5-pentanediol, 2,5-dithia-1,6-hexanediol, 2,6-dithia-1,7-heptanediol, 2,7-dithia-1,8-octanediol, 2,8-dithia-1,9-nonanediol, 2,9-dithia-1,10-decanediol, 2,11-dithia-1,12-dodecanediol, 5,8-dithia-1,12-dodecanediol, 2,15-dithia-1,16-hexadecanediol, 2,21-dithia-1,22-doeicasanediol, 3,5-dithia-1,7-heptanediol, 3,6-dithia-1,8-octanediol, 3,8-dithia-1,10-decanediol, 3,10-dithia-1,8-(dodecanediol, 3,13-dithia-1,15-pentadecanediol, 3,18-dithia-1,20-eicosanediol, 4,6-dithia-1,9-nonanediol, 4,7-dithia-1,10-decanediol, 4,11-dithia-1,14-tetradecanediol, 4,15-dithia-1,18-octadecanediol, 4,19-dithia-1,22-dodeicosanediol, 5,7-dithia-1,1′-undecanediol, 5,9-dithia-1,13-tridecanediol, 5,13-dithia-1,17-heptadecanediol, 5,17-dithia-1,2′-uneicosanediol, 1,8-dimethyl-3,6-dithia-1,8-octanediol, and combinations of one or more of the forgoing; v) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and vi) optionally, a wetting agent; and vii) optionally, an antioxidant; wherein the electroplating bath deposits a silver/tin alloy on the surface of the connector. 16. The method according to claim 15 , wherein the connector is a press fit pin. 17. The method according to claim 15 , wherein the silver/tin alloy deposit exhibits a consistent alloy ratio of about 17-18 wt. % tin. 18. The method according to claim 15 , wherein the silver/tin alloy deposit exhibits a satin white deposit color.

Assignees

Inventors

Classifications

  • characterised by the organic bath constituents used · CPC title

  • at least one layer being of nickel or chromium · CPC title

  • C25D3/46Primary

    of silver · CPC title

  • Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance · CPC title

  • C25D3/60Primary

    containing more than 50% by weight of tin · CPC title

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What does patent US11280014B2 cover?
An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and …
Who is the assignee on this patent?
Macdermid Enthone Inc
What technology area does this patent fall under?
Primary CPC classification C25D3/46. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Mar 22 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).