Printed circuit board assembly

Patent metadata

Field	Value
Publication number	US-11277914-B2
Application number	US-201716642413-A
Country	US
Kind code	B2
Filing date	Nov 2, 2017
Priority date	Nov 2, 2017
Publication date	Mar 15, 2022
Grant date	Mar 15, 2022

Abstract

A printed circuit board assembly includes a first printed circuit board with first surface and second surface with a slit portion and a second printed circuit board with third surface and fourth surface with a first end portion and a second end portion. The first end portion is fitted in the slit portion and a tip of the first end portion protrudes from the second surface. The first printed circuit board includes first electrodes arranged along the slit portion in a longitudinal direction of the slit portion on the second surface. The second printed circuit board includes second electrodes arranged in the first end portion on the third and fourth surfaces. The second electrodes are joined to the first electrodes with solder. The first printed circuit board includes a support fixed to the first surface. The second printed circuit board is attached to the support by an adhesive substance.

First claim

The invention claimed is:

1. A printed circuit board assembly comprising:
a first printed circuit board having a first surface and a second surface that is opposite the first surface and including a slit portion extending through the first printed circuit board from the first surface to the second surface; and
a second printed circuit board having a third surface and a fourth surface that is opposite the third surface and including a first end portion and a second end portion that is opposite the first end portion, the first end portion being fitted in the slit portion in such a manner that a tip of the first end portion protrudes from the second surface,
the first printed circuit board including a plurality of first electrodes arranged along the slit portion in a longitudinal direction of the slit portion on at least one of the first surface and the second surface,
the second printed circuit board including a plurality of second electrodes arranged in the first end portion on at least one of the third surface and the fourth surface, the plurality of second electrodes being joined to the plurality of first electrodes with a solder,
the first printed circuit board further including a support fixed to the first surface,
the second printed circuit board being attached to the support by an adhesive substance,
the printed circuit board assembly further comprising
a plurality of mounting parts used to mount the printed circuit board assembly to a mounting component,
when the printed circuit board assembly is viewed in a direction perpendicular to the first surface,
of the plurality of mounting parts, at least one mounting part adjacent to the third surface and remote from the fourth surface is defined as at least one first mounting part and,
of the plurality of mounting parts, at least one mounting part adjacent to the fourth surface and remote from the third surface is defined as at least one second mounting part,
a distance between the second printed circuit board and a first mounting part closest to the second printed circuit board of the at least one first mounting part being longer than a distance between the second printed circuit board and a second mounting part closest to the second printed circuit board of the at least one second mounting part,
the third surface of the second printed circuit board being attached to the support by the adhesive substance,
when the printed circuit board assembly is viewed from a front of the first surface in the direction perpendicular to the first surface, the support is disposed on the first surface on a one single side extending along the longitudinal direction of the slit portion so as to face the third surface of the second printed circuit board,
wherein the second printed circuit board includes a third end portion and a fourth end portion arranged in the longitudinal direction of the slit portion,
wherein, of the plurality of second electrodes, a second electrode closest to the third end portion has a smaller amount of the solder than does a second electrode closest to the fourth end portion, and
wherein the third end portion of the second printed circuit board is attached to the support.

2. The printed circuit board assembly of claim 1 , wherein, in a case where a distance from the first surface of the first printed circuit board to a tip of the second end portion of the second printed circuit board is defined as a height H, a part of the second printed circuit board that corresponds to a distance of 0.1×H or more from the first surface toward the second end portion is attached to the support.

3. The printed circuit board assembly of claim 2 , wherein the part of the second printed circuit board that corresponds to a distance of ((H/2)+10 mm) or less from the first surface is attached to the support.

4. The printed circuit board assembly of claim 1 , further comprising
wherein at least one of solder joints joining the plurality of first electrodes and the plurality of second electrodes is located at a distance of 50 mm or less from one of the plurality of mounting parts when the printed circuit board assembly is viewed in the direction perpendicular to the first surface.

5. The printed circuit board assembly of claim 1 ,
wherein the first end portion has at least one cut and includes a plurality of protrusions,
wherein the slit portion includes a plurality of slits in which the plurality of protrusions are fitted, and
wherein a center line dividing the second printed circuit board into two halves at a middle in the longitudinal direction of the slit portion is referred to as a center line C, and the first end portion of the second printed circuit board is asymmetric about the center line C.

6. The printed circuit board assembly of claim 1 ,
wherein the plurality of first electrodes and the plurality of second electrodes are joined by wave soldering performed while the first printed circuit board and the second printed circuit board are being conveyed in a conveying direction that is along the longitudinal direction of the slit portion,
wherein the second printed circuit board includes the third end portion that is a leading end in the conveying direction during wave soldering, and
wherein the third end portion of the second printed circuit board is attached to the support.

7. The printed circuit board assembly of claim 1 , wherein a part of the second printed circuit board that is not located within the slit portion in the longitudinal direction of the slit portion is attached to the support.

8. The printed circuit board assembly of claim 1 , wherein the support is attached to the second printed circuit board within a distance of 10 mm from a center of gravity of the second printed circuit board in the longitudinal direction of the slit portion.

9. The printed circuit board assembly of claim 1 , further comprising
a circuit part disposed on the second surface of the first printed circuit board,
wherein the circuit part includes at least one of the plurality of mounting parts.

10. The printed circuit board assembly of claim 1 , wherein the support is a connector, a heat sink, or an electrolytic capacitor.

11. The printed circuit board assembly of claim 1 ,
wherein the second printed circuit board has a thickness corresponding to a distance between the third surface and the fourth surface and the thickness is 1.4 mm or more and 1.8 mm or less,
wherein a height H that is a distance from the first surface of the first printed circuit board to a tip of the second end portion of the second printed circuit board is 25 mm or more and 60 mm or less,
wherein a width W that is a dimension of the second printed circuit board in the longitudinal direction of the slit portion is one to two times as long as the height H,
wherein the plurality of first electrodes arranged on one side of the slit portion along the slit portion in the longitudinal direction of the slit portion range in number up to 25, and
wherein the solder with which each of the plurality of first electrodes is joined to a corresponding one of the plurality of second electrodes has a tensile strength of 16 or less and the tensile strength is a tensile load that the solder withstands without fracturing.

12. The printed circuit board assembly of claim 1 ,
wherein the second printed circuit board includes an electronic component on at least one surface of the third surface and the fourth surface, and
wherein the second printed circuit board has no resin coating on the at least one surface.

Assignees

• Mitsubishi Electric Corp

Inventors

• Nakase Shusaku
• Morimoto Yusuke

Classifications

• H05K1/145

  Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules · CPC title

• H05K2201/2045

  Protection against vibrations · CPC title

• H05K1/142

  Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit · CPC title

• H05K2201/048

  Second PCB mounted on first PCB by inserting in window or holes of the first PCB · CPC title

• H05K1/117

  Pads along the edge of rigid circuit boards, e.g. for pluggable connectors · CPC title