Circuit board, backlight module comprising the circuit board, and display device

Patent metadata

Field	Value
Publication number	US-11277904-B2
Application number	US-201716064089-A
Country	US
Kind code	B2
Filing date	Dec 11, 2017
Priority date	May 25, 2017
Publication date	Mar 15, 2022
Grant date	Mar 15, 2022

Abstract

The disclosure discloses a circuit board, as well as a backlight module and a display device including the circuit board. The circuit board includes a copper exposure region which is covered with a conductive ink. By means of the copper exposure region and the conductive ink thereon, the function of conducting electrostatic charges for the circuit board can be realized at low cost in high efficiency, thereby reducing the risk of subjecting the electrical elements on the circuit board to electrostatic breakdown.

First claim

The invention claimed is:

1. A backlight module, comprising a circuit board configured to drive a light emitting device in the backlight module to emit light, wherein the circuit board comprises a copper exposure region, the copper exposure region is covered with a conductive ink,
wherein the backlight module comprises a metal backplate, the circuit board is positioned such that the copper exposure region of the circuit board faces an inner surface of the metal backplate and the conductive ink directly contacts the inner surface of the metal backplate,
wherein the conductive ink comprises a conductive material and a binding material, the conductive material comprises at least one selected from a group consisting of gold, silver, copper and carbon.

2. The backlight module according to claim 1 , wherein the light emitting device comprises a plurality of transient voltage suppression diodes, the plurality of transient voltage suppression diodes are distributed on the circuit board at intervals.

3. The backlight module according to claim 1 , wherein the circuit board is a strip flexible circuit board, and the circuit board and a plurality of light emitting devices distributed thereon constitute a stripe light emitting assembly.

4. The backlight module according to claim 3 , wherein the copper exposure region at least comprises a sub-copper exposure region at one end of the flexible circuit board, the sub-copper exposure region is covered with the conductive ink.

5. A display device, comprising the backlight module according to claim 1 .

6. The display device according to claim 5 , wherein the light emitting device comprises a plurality of transient voltage suppression diodes, the plurality of transient voltage suppression diodes are distributed on the circuit board at intervals.

7. The display device according to claim 5 , wherein the circuit board is a strip flexible circuit board, and the circuit board and a plurality of light emitting devices distributed thereon constitute a stripe light emitting assembly.

8. The display device according to claim 7 , wherein the copper exposure region at least comprises a sub-copper exposure region at one end of the flexible circuit board, the sub-copper exposure region is covered with the conductive ink.

9. The backlight module according to claim 1 , wherein the copper exposure region is located in a peripheral area of the circuit board.

10. The backlight module according to claim 9 , wherein the copper exposure region comprises a plurality of sub-copper exposure regions located in the peripheral area of the circuit board, each sub-copper exposure region is covered with a conductive ink.

11. The backlight module according to claim 1 , wherein the circuit board is a flexible circuit board and is configured to drive a light emitting device in a backlight module to emit light.

Assignees

• Boe Technology Group Co Ltd
• Chongqing Boe Optoelectronics Tech Co Ltd

Inventors

• Wang Xuefeng
• Chen Guohui
• Min Hang
• Han Qiangsheng
• Chen Wei

Classifications

• H05K2201/0746

  Protection against transients, e.g. layout adapted for plugging of connector · CPC title

• H05K2201/10174

  Diode · CPC title

• H05K3/246 Primary

  Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating · CPC title

• H05K1/028

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title

• G09F9/30

  in which the desired character or characters are formed by combining individual elements (panels comprising a number of electrodes in a single cell controlling light arriving from an independent light source, e.g. electro-optical or magneto-optical cell, G02F1/00) · CPC title